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Diodes Incorporated SDM1L20DCP3-7

Part No.:
SDM1L20DCP3-7
Manufacturer:
Diodes Incorporated
Category:
Diode Arrays
Package:
3-XFDFN
Datasheet:
AetrixSDM1L20DCP3-7.pdf
Description:
DIODE ARR SCHOT 20V X3-DSN1006-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,259

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Product details

Overview

SDM1L20DCP3 from Diodes Incorporated is a 20V dual common-cathode Schottky barrier diode optimized for low forward voltage (max 0.50 V at 1 A) and ultra-low leakage (max 100 µA at 20 V), housed in a compact X3-DSN1006-3 package occupying only 0.6 mm² board area. It serves as a blocking or reverse-polarity protection diode in space-constrained portable power rails.

For engineers reviewing the SDM1L20DCP3 datasheet, SDM1L20DCP3 pinout, SDM1L20DCP3 application, or SDM1L20DCP3 equivalent, key selection criteria include its 1 A average current rating, 245 °C/W thermal resistance on FR-4, 8.6 ns reverse recovery time, and NiAu bump terminations compatible with standard reflow profiles.

Technical Context

This dual-diode device integrates two independent Schottky junctions sharing a common cathode terminal, enabling bidirectional reverse protection or dual-path DC/DC output rectification. Its low VF (260–500 mV across 10–500 mA) directly reduces conduction loss in battery-fed systems, while sub-100 µA IR at 20 V preserves standby runtime.

The X3-DSN1006-3 package uses a 3-terminal die-size outline with cathode dot marking and 0.275 mm profile, supporting high-density layout. Thermal performance varies significantly with PCB pad design: RθJA is 245 °C/W on minimum recommended FR-4 layout but improves to 105 °C/W with a 1-inch-square 2 oz Cu pad.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM20 V - Maximum reverse blocking voltage before breakdown; suitable for 5 V–12 V rail protection
IO (total)1 A - Total average rectified current across both diodes; enables use in 1 A load paths
VF max0.50 V @ 1 A - Low conduction loss; reduces power dissipation to ≤500 mW under full load
IR max100 µA @ 20 V - Minimizes quiescent drain in battery backup circuits
tRR8.6 ns - Fast switching supports high-frequency DC/DC converters without excessive ringing
CJ18 pF @ 5 V - Low junction capacitance limits AC coupling and EMI in signal-path applications
RθJA105 °C/W (with 1″² 2 oz Cu pad) - Enables >0.8 W power dissipation before exceeding 150 °C junction limit

Pinout & Package

Package: X3-DSN1006-3 - ultra-thin (0.275 mm height), 0.6 mm² footprint, 3-terminal die-size package with NiAu bump terminations and cathode dot polarity indicator.

Pin/TerminalCircuit RoleDesign Meaning
1 (Anode 1)First anode connectionAccepts forward current into first Schottky junction; electrically isolated from Pin 2
2 (Cathode)Common cathode nodeShared return path for both diodes; must be routed with low-inductance, low-impedance trace
3 (Anode 2)Second anode connectionAccepts forward current into second Schottky junction; electrically isolated from Pin 1

Key Features

FeatureDesign Value
0.6 mm² footprintReduces PCB area by >60% vs. SOT-23 dual diodes; critical for wearables and hearing aids
Low VF (260–500 mV)Enables ≥95% efficiency in 3.3 V boost converters at 500 mA output
Low IR (≤100 µA)Extends shelf life and runtime in Li-ion coin-cell applications where leakage dominates standby loss
Soft, fast switchingMinimizes EMI during turn-off; eliminates need for snubbers in 1–3 MHz DC/DC designs
NiAu bump terminationsEnsures reliable solder joint formation with standard Pb-free reflow profiles (peak 260 °C)

Applications

USB Power Delivery Input ProtectionWireless Earbud Battery Charging Path

Use Scenario: Prevents reverse current flow from battery to USB input when host is disconnected or powered off.

IC Role / Device Role / Timing Role: Reverse polarity protection diode placed between USB VBUS and system PMIC input.

Use Value: 100 µA max leakage avoids measurable battery drain during multi-week storage; 0.50 V VF limits voltage drop to <2% at 500 mA.

Use Scenario: Isolates charging IC from battery during wireless charging coil activation to prevent backfeed.

IC Role / Device Role / Timing Role: Blocking diode in linear charger path to enforce unidirectional current flow.

Use Value: 0.275 mm profile fits within 1.2 mm earbud housing height; dual-anode structure allows shared cathode routing to simplify layout.

Bluetooth SoC Power Rail OR-ingSmartwatch Display Backlight Boost Output

Use Scenario: Combines power from coin cell and energy harvester outputs using diode-OR configuration.

IC Role / Device Role / Timing Role: Dual-anode common-cathode diode enabling two independent input sources feeding single regulated rail.

Use Value: Matched VF characteristics between anodes ensure balanced current sharing; 8.6 ns tRR prevents cross-conduction during source switchover.

Use Scenario: Rectifies switched-node output of 1.2 MHz boost converter powering white LED strings.

IC Role / Device Role / Timing Role: Output rectifier diode in asynchronous boost topology.

Use Value: 18 pF CJ minimizes capacitive loading on switch node; low RθJA sustains 1 A peak current without thermal derating in sealed enclosure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RB050M-30TRHigher VF (0.55 V @ 1 A), larger SOD-323 package (1.7 mm²), 120 °C/W RθJALess suitable for ultra-thin devices; higher conduction loss in 3.3 V systemsPrefer when legacy SOD-323 footprint compatibility is required over size/power trade-off
NSR20F30NXT5GLower IR (10 µA @ 20 V), same X3-DSN1006-3 package, but VF slightly higher (0.52 V @ 1 A)Better for long-term battery retention; marginally lower efficiency at high loadChoose when standby leakage dominates system budget, e.g., medical sensors with 10-year shelf life

Compared with RB050M-30TR and NSR20F30NXT5G, SDM1L20DCP3 delivers the best balance of ultra-small footprint, lowest VF, and adequate leakage for consumer portable designs-making it optimal for next-gen wearables where board area and efficiency are co-constrained.

Availability

SDM1L20DCP3 is available at Aetrix Electronics and suitable for USB PD input protection, wireless earbud charging paths, Bluetooth SoC OR-ing, and smartwatch backlight boost circuits requiring stable component supply and consistent lead-free sourcing.

Supply support for SDM1L20DCP3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.

The SDM1L20DCP3 belongs to Diodes' low-profile Schottky diode product line, engineered specifically for space- and efficiency-critical portable electronics where minimal board area and ultra-low power loss are mandatory design requirements.

FAQ

What is the maximum continuous current per diode in SDM1L20DCP3?

The device is rated for 1 A total average rectified output current across both diodes. Since it is a dual common-cathode configuration, each diode can handle up to 1 A individually if the other is inactive-but thermal limits apply. Derating is required above 70 °C ambient, especially with minimal PCB copper.

Does SDM1L20DCP3 support reflow soldering with standard Pb-free profiles?

Yes. Its NiAu bump terminations are qualified for standard Pb-free reflow processes with peak temperatures up to 260 °C. The X3-DSN1006-3 package is compatible with IPC-J-STD-020 Level 1 moisture sensitivity handling-no baking required prior to assembly.

How does the common-cathode configuration affect PCB layout?

The shared cathode (Pin 2) must be routed as a low-impedance, low-inductance node-ideally connected directly to ground or power return plane. Separating anode traces (Pins 1 and 3) prevents crosstalk, and symmetric layout ensures matched thermal and electrical behavior between diodes.

Can SDM1L20DCP3 be used in automotive body electronics?

No. While it operates from –55 °C to +150 °C, it is not AEC-Q200 qualified and lacks automotive-specific reliability testing, traceability, or PPAP documentation. Diodes Incorporated offers AEC-Q200-qualified alternatives like DFLS120Q for such applications.

SDM1L20DCP3-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Diode Configuration:
1 Pair Common Cathode
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
20 V
Current - Average Rectified (Io) (per Diode):
1A
Voltage - Forward (Vf) (Max) @ If:
500 mV @ 500 mA
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
8.6 ns
Current - Reverse Leakage @ Vr:
100 µA @ 20 V
Operating Temperature - Junction:
-55°C ~ 150°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X3-DSN1006-3

SDM1L20DCP3-7 FAQ

1.How can I place an order for SDM1L20DCP3-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for SDM1L20DCP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SDM1L20DCP3-7 reliable?

The price and inventory of SDM1L20DCP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM1L20DCP3-7 is usually 5 days.

3.What payment methods are accepted for SDM1L20DCP3-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM1L20DCP3-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SDM1L20DCP3-7?

SDM1L20DCP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SDM1L20DCP3-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SDM1L20DCP3-7?

For technical support, including SDM1L20DCP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM1L20DCP3-7 requirements.

6.How does Aetrix verify that SDM1L20DCP3-7 is sourced from the original manufacturer or authorized distributors?

All SDM1L20DCP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM1L20DCP3-7 meets industry standards.

7.What is the process for return or replacement of SDM1L20DCP3-7?

All SDM1L20DCP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM1L20DCP3-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SDM1L20DCP3-7 part is unused and in its original packaging.

Return procedure for SDM1L20DCP3-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SDM1L20DCP3-7 Tags

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