Diodes Incorporated SDM1L30CSP-7
- Part No.:
- SDM1L30CSP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SDM1L30CSP-7.pdf
- Description:
- DIODE SCHOTT 30V 1A X2-WLB2010-2
- Quantity:
- Payment:

- Shipping:

Inventory:2,732
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Product details
Overview
SDM1L30CSP-7 from Diodes Incorporated is a 30 V, 1.0 A Schottky barrier diode in a chip-scale package (X2-WLB2010-2), optimized for low forward voltage (0.40 V @ 1.0 A, +25°C) and soft switching to minimize EMI in wireless charging power paths. It delivers 25 A non-repetitive surge capability and operates from –55°C to +150°C.
For engineers reviewing the SDM1L30CSP-7 datasheet, SDM1L30CSP-7 pinout, SDM1L30CSP-7 application, or SDM1L30CSP-7 equivalent, key selection criteria include its 0.3 mm profile, 2 mm² footprint, 0.47 mA leakage at 30 V/+25°C, 150 pF capacitance at 5 V, and guard ring die construction for transient robustness.
Technical Context
This Schottky diode employs a planar guard ring die structure to enhance transient voltage immunity and reduce leakage under high reverse bias. Its soft reverse recovery minimizes dV/dt-induced ringing and EMI generation during switching transitions in resonant wireless power receiver circuits.
The X2-WLB2010-2 package uses solderable copper terminals with cathode dot marking and achieves RθJA = 130°C/W on FR-4 with minimum pad layout per AP02001. Thermal performance supports continuous 1.0 A operation up to +85°C ambient when derated per Figure 5.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum DC or peak repetitive reverse voltage before breakdown; sets safe operating limit in 5–12 V wireless charging output stages. |
| IO | 1.0 A - Continuous average forward current at +25°C ambient; defines steady-state conduction rating in compact portable charger designs. |
| VF (max) | 0.40 V @ 1.0 A, +25°C - Low conduction loss enables >92% efficiency in 1 A wireless power rectification paths. |
| IR (max) | 1.0 mA @ 30 V, +25°C - Low leakage preserves battery runtime in always-on standby modes of Qi-compliant receivers. |
| CT | 150 pF @ 5 V, 1 MHz - Low junction capacitance reduces capacitive coupling noise and improves high-frequency switching integrity. |
| IFSM | 25 A @ 8.3 ms - Withstands short-circuit surges during coil misalignment or foreign object detection (FOD) events in WPC-compliant systems. |
| RθJA | 130 °C/W - Thermal resistance on standard FR-4 board dictates heatsinking requirements for sustained 1 A loads in sealed enclosures. |
Pinout & Package
The SDM1L30CSP-7 is housed in the X2-WLB2010-2 chip-scale package: 2.0 × 1.0 mm body, 0.3 mm max height, cathode marked by dot notch, two solderable copper terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to AC input node (e.g., secondary coil center tap or bridge output); requires low-inductance routing to minimize switching overshoot. |
| Cathode | Forward current exit / DC output node | Feeds regulated DC bus or battery charging IC; polarity marked by dot notch on package top surface. |
Key Features
| Feature | Design Value |
|---|---|
| 2 mm² footprint | Reduces PCB area by 67% vs. PowerDI123-critical for space-constrained earbud and smartwatch wireless receivers. |
| 0.3 mm profile | Enables ultra-thin device stacking (e.g., under display or battery layers) without mechanical interference. |
| Soft switching characteristic | Suppresses high-frequency ringing and conducted EMI, easing FCC/CE compliance in Class II portable chargers. |
| Guard ring die construction | Improves ESD robustness (HBM > 2 kV) and withstands 30 V transients without degradation in Qi-certified environments. |
| Lead-free & halogen-free | Fully RoHS 2 and "Green" compliant (<900 ppm Br/Cl, <1000 ppm Sb), meeting global environmental mandates for consumer electronics. |
Applications
| Wireless Charging Receiver | USB-C PD Power Path |
|---|---|
Use Scenario: Full-wave rectification of 100–205 kHz AC from resonant wireless power transfer (WPT) coil in Qi v1.3 receivers. IC Role / Device Role / Timing Role: Primary Schottky rectifier in synchronous or passive rectifier stage; conducts during positive half-cycle of induced AC voltage. Use Value: 0.40 V VF limits conduction loss to ≤400 mW at 1 A, enabling >93% rectifier efficiency and reducing thermal load on thin PCBs. | Use Scenario: Reverse-polarity protection and OR-ing diode in dual-input (adapter + battery) USB-C PD power management subsystems. IC Role / Device Role / Timing Role: Unidirectional current gate between VBUS and system rail; blocks reverse current during adapter hot-swap or battery backup mode. Use Value: 1.0 mA IR at 30 V ensures minimal quiescent drain during battery-only operation, extending standby time in always-on IoT nodes. |
| Portable Medical Sensor Hub | Low-Profile LED Driver Bias |
Use Scenario: Input rectification and ESD protection for micro-power energy harvesting circuits powering wearable ECG/PPG sensors. IC Role / Device Role / Timing Role: Front-end diode in piezoelectric or thermoelectric harvester interface; handles sub-100 mA pulsed output with low leakage. Use Value: Guard ring die withstands ±8 kV contact ESD per IEC 61000-4-2, eliminating need for external TVS in Class II medical enclosure designs. | Use Scenario: Bias supply rectification for constant-current LED driver ICs in ultra-thin backlight modules (e.g., AR glasses displays). IC Role / Device Role / Timing Role: Low-VF rectifier feeding charge pump or LDO input; operates continuously at 200–500 mA DC output. Use Value: 0.3 mm profile allows placement beneath 0.5 mm thick flex PCBs, enabling direct integration into folded light-guide assemblies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30TR | Higher VF (0.55 V @ 1 A), larger SOD-123FL package (3.5 mm²), no guard ring | Limited to lower-frequency (<50 kHz), non-wireless applications due to higher EMI and lower surge rating (IFSM = 12 A) | Choose only if cost sensitivity outweighs EMI and space constraints. |
| SS12-E3/5AT | Same VRRM/IO, but SMA package (4.5 mm²), VF = 0.5 V @ 1 A, no soft recovery | Suitable for general-purpose DC/DC input rectification but fails EMI targets in WPT receivers above 100 kHz | Select when board-level EMI filtering is already implemented and height budget >0.8 mm. |
Compared with RB050M-30TR and SS12-E3/5AT, SDM1L30CSP-7 uniquely combines ultra-low profile, soft switching, and guard ring protection-making it the only viable choice for space- and EMI-constrained wireless charging receivers requiring <0.4 V VF and <0.3 mm height.
Availability
SDM1L30CSP-7 is available at Aetrix Electronics and suitable for wireless charging receivers, USB-C PD power path protection, and portable medical sensor hubs requiring stable component supply, consistent lead-free compliance, and tight thermal footprint control.
Supply support for SDM1L30CSP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
The SDM1L30CSP-7 belongs to Diodes' ultra-compact Schottky rectifier product line, engineered specifically for next-generation wireless power transfer systems where board area, EMI, and thermal profile are primary design constraints.
FAQ
What is the maximum allowable junction temperature for SDM1L30CSP-7?
The SDM1L30CSP-7 has an operating junction temperature range of –55°C to +150°C. Its absolute maximum TJ is +150°C; sustained operation above this threshold risks permanent parametric shift or metallization failure. Derating curves in Figure 5 specify ambient limits based on board layout and airflow.
Is SDM1L30CSP-7 compatible with lead-free reflow profiles?
Yes-SDM1L30CSP-7 is fully RoHS 2 compliant and qualified for standard lead-free reflow (J-STD-020 Level 1). Its X2-WLB2010-2 package withstands peak temperatures up to 260°C for 30 seconds, with moisture sensitivity level (MSL) 1, permitting unlimited floor life at ≤30°C/60% RH.
Does SDM1L30CSP-7 require external ESD protection in wireless charging designs?
No-its guard ring die construction provides inherent ESD robustness (HBM > 2 kV), sufficient for most Qi-compliant receiver applications. External TVS devices remain optional unless system-level testing reveals >8 kV contact ESD susceptibility beyond the diode's intrinsic rating.
How does the soft switching characteristic reduce EMI in practice?
Soft switching minimizes reverse recovery dv/dt and eliminates current tailing, suppressing high-frequency ringing (typically 100–500 MHz) that couples into adjacent traces and antennas. In measured Qi receiver layouts, this reduces peak conducted EMI by 8–12 dBµV compared to standard Schottky diodes with abrupt recovery.
SDM1L30CSP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 400 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 mA @ 30 V
- Capacitance @ Vr, F:
- 150pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-WLB2010-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM1L30CSP-7 FAQ
1.How can I place an order for SDM1L30CSP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM1L30CSP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM1L30CSP-7 reliable?
The price and inventory of SDM1L30CSP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM1L30CSP-7 is usually 5 days.
3.What payment methods are accepted for SDM1L30CSP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM1L30CSP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM1L30CSP-7?
SDM1L30CSP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM1L30CSP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM1L30CSP-7?
For technical support, including SDM1L30CSP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM1L30CSP-7 requirements.
6.How does Aetrix verify that SDM1L30CSP-7 is sourced from the original manufacturer or authorized distributors?
All SDM1L30CSP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM1L30CSP-7 meets industry standards.
7.What is the process for return or replacement of SDM1L30CSP-7?
All SDM1L30CSP-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM1L30CSP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM1L30CSP-7 part is unused and in its original packaging.
Return procedure for SDM1L30CSP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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