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Diodes Incorporated SDM1U30CP3-7

Part No.:
SDM1U30CP3-7
Manufacturer:
Diodes Incorporated
Category:
Single Diodes
Package:
2-XDFN
Datasheet:
AetrixSDM1U30CP3-7.pdf
Description:
DIODE SCHOTT 30V 1A X3-DSN1006-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,960

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Product details

Overview

SDM1U30CP3-7 from Diodes Incorporated is a 30 V, 1 A Schottky barrier rectifier in X3-DSN1006-2 surface-mount package, featuring VF = 500 mV max at 1 A and IR = 150 µA max at 20 V, optimized for low-loss DC/DC conversion in space-constrained portable power rails.

For engineers reviewing the SDM1U30CP3-7 datasheet, SDM1U30CP3-7 pinout, SDM1U30CP3-7 application, or SDM1U30CP3-7 equivalent, key selection criteria include forward voltage drop at rated current, reverse leakage at operating bias, thermal resistance (RθJA = 70 °C/W on 1-in² copper), and ultra-thin 0.275 mm profile for stacked PCB designs.

Technical Context

This Schottky rectifier uses a planar die structure with NiAu bump terminals to achieve low RθJA (70 °C/W) on standard FR-4 with 1 in² copper pour, enabling high-current operation without external heatsinking. Its junction capacitance (CT = 29 pF at VR = 10 V) supports high-frequency switching up to 1 MHz.

The device operates across –55 °C to +150 °C and sustains IFSM = 10 A non-repetitive surge, making it suitable for transient-heavy input stages in buck-boost and flyback topologies where fast recovery and minimal stored charge are critical.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM30 V - Maximum reverse blocking capability before breakdown, sufficient for 24 V nominal bus protection
IO1 A - Continuous DC output current rating under defined thermal conditions (70 °C/W RθJA)
VF Max500 mV @ 1 A - Limits conduction loss to ≤500 mW, directly improving efficiency in 1 A power paths
IR Max150 µA @ 20 V - Low leakage preserves battery runtime in always-on reverse-protection circuits
RθJA70 °C/W - Achieved on 1 in² 2 oz copper; enables 1 A operation at +85 °C ambient without derating
CT29 pF @ 10 V - Minimizes capacitive switching loss and EMI in >500 kHz DC/DC converters
IFRM4 A - Peak pulsed forward current (1 ms, 25% duty), supports short-duration load transients

Pinout & Package

Package: X3-DSN1006-2 - ultra-compact 1.0 × 0.6 mm, 0.275 mm height, NiAu bump terminals, cathode dot marked.

Pin/TerminalCircuit RoleDesign Meaning
AnodeCurrent entry point during forward conductionConnected to input/source side of blocking or boost path; requires low-inductance layout
CathodeCurrent exit point during forward conduction; marked with dotConnected to output/load side; polarity-critical for reverse protection and boost diode orientation

Key Features

FeatureDesign Value
Ultra-low profile (0.275 mm)Reduces stack height by >30% vs DFN1006, enabling dual-sided component placement in slim devices
Low VF (267–500 mV)Minimizes I²R loss across full 0.1–1.0 A range, extending battery life in portable systems
NiAu bump terminalsEnsures reliable solder joint formation per MIL-STD-202 Method 208, compatible with lead-free reflow
Halogen & antimony freeMeets "Green" definition (<900 ppm Br/Cl, <1000 ppm Sb), supporting eco-compliance in global markets

Applications

Blocking DiodeBoost Diode

Use Scenario: Prevents backfeed from a Li-ion battery into USB VBUS during charging circuit failure.

IC Role / Device Role: Unidirectional current gate in power-path management.

Use Value: 150 µA leakage at 20 V minimizes standby drain; 500 mV VF avoids voltage sag under 1 A load.

Use Scenario: Output rectifier in 1 A, 500 kHz boost converter powering a PMOLED display.

IC Role / Device Role: High-efficiency synchronous rectification replacement.

Use Value: 29 pF CT and fast Schottky recovery reduce switching loss and output ripple vs PN diodes.

Reverse Protection DiodeSwitching Diode

Use Scenario: Input polarity guard for a wearable sensor node powered by replaceable coin cell.

IC Role / Device Role: Fail-safe reverse-voltage clamp on main power rail.

Use Value: 30 V VRRM withstands accidental 24 V adapter misconnection; 0.275 mm height fits thin enclosures.

Use Scenario: Freewheeling path in a 1 A, 1 MHz buck regulator driving an optical module.

IC Role / Device Role: Fast-recovery path for inductor current during high-side switch off-time.

Use Value: 10 A IFSM handles peak inductor current surges; low CT prevents ringing-induced EMI.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RB050M-30TE25Higher VF (600 mV @ 1 A), larger SOD-323 package (1.7 × 1.3 mm)Less suitable for ultra-thin or high-density layouts due to 0.9 mm height and 2.2 mm² areaChoose if legacy footprint compatibility outweighs efficiency and space savings
SS12Same VF spec (500 mV), but DO-214AC package (4.3 × 2.6 mm, 2.2 mm height)Requires 7× more board area; thermal resistance >100 °C/W limits 1 A use without heatsinkPrefer only for through-hole prototyping or low-frequency, low-density designs

Compared with RB050M-30TE25 and SS12, SDM1U30CP3-7 delivers superior power density (0.6 mm²), lower thermal resistance (70 °C/W), and thinner profile-critical for modern portable electronics where board space and thermal headroom are constrained.

Availability

SDM1U30CP3-7 is available at Aetrix Electronics and suitable for portable power management, battery protection circuits, and compact DC/DC converters requiring stable component supply and RoHS-compliant sourcing.

Supply support for SDM1U30CP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions.

The SDM1U30CP3-7 belongs to Diodes' ultra-compact Schottky rectifier product line, designed specifically for space- and efficiency-critical portable and wearables applications.

FAQ

What is the maximum continuous operating temperature for SDM1U30CP3-7?

The SDM1U30CP3-7 has a specified operating junction temperature range of –55 °C to +150 °C. When mounted on a 1 in² 2 oz copper pad (RθJA = 70 °C/W), it supports 1 A continuous current up to +85 °C ambient without derating. At higher ambient temperatures, current must be reduced per Figure 4 derating curve.

Is SDM1U30CP3-7 compatible with lead-free reflow processes?

Yes. SDM1U30CP3-7 features NiAu bump terminals qualified per MIL-STD-202, Method 208, and is fully RoHS 3 compliant (2015/863/EU). It supports standard lead-free reflow profiles with peak temperatures up to 260 °C, and its moisture sensitivity level is rated J-STD-020 Level 1.

How does the X3-DSN1006-2 package differ from standard DFN1006?

The X3-DSN1006-2 package measures 1.0 × 0.6 mm with 0.275 mm height-30% thinner than typical DFN1006 variants-and uses NiAu bumps instead of solderable metallization. Its thermal performance (RθJA = 70 °C/W) exceeds standard DFN1006 (typically >120 °C/W), due to optimized copper pad coupling and low-profile thermal path.

Can SDM1U30CP3-7 be used in automotive body electronics?

SDM1U30CP3-7 meets AEC-Q200 stress test requirements for passive components but is not AEC-Q101 qualified as a discrete semiconductor. It is suitable for non-safety-critical automotive body electronics (e.g., interior lighting, sensors) where ambient temperature stays within –40 °C to +105 °C and design margins accommodate its 150 °C max junction rating.

SDM1U30CP3-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
2-XDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
500 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
350 µA @ 30 V
Capacitance @ Vr, F:
69pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X3-DSN1006-2
Operating Temperature - Junction:
-55°C ~ 150°C

SDM1U30CP3-7 FAQ

1.How can I place an order for SDM1U30CP3-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for SDM1U30CP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SDM1U30CP3-7 reliable?

The price and inventory of SDM1U30CP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM1U30CP3-7 is usually 5 days.

3.What payment methods are accepted for SDM1U30CP3-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM1U30CP3-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SDM1U30CP3-7?

SDM1U30CP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SDM1U30CP3-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SDM1U30CP3-7?

For technical support, including SDM1U30CP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM1U30CP3-7 requirements.

6.How does Aetrix verify that SDM1U30CP3-7 is sourced from the original manufacturer or authorized distributors?

All SDM1U30CP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM1U30CP3-7 meets industry standards.

7.What is the process for return or replacement of SDM1U30CP3-7?

All SDM1U30CP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM1U30CP3-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SDM1U30CP3-7 part is unused and in its original packaging.

Return procedure for SDM1U30CP3-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SDM1U30CP3-7 Tags

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