Diodes Incorporated SDM2A40CSP-7B
- Part No.:
- SDM2A40CSP-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SDM2A40CSP-7B.pdf
- Description:
- DIODE SCHOTT 40V 2A X3-WLB1608-2
- Quantity:
- Payment:

- Shipping:

Inventory:10,000
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Product details
Overview
SDM2A40CSP-7B from Diodes Incorporated is a 40 V, 2 A Schottky barrier rectifier in a chip-scale X3-WLB1608-2 package (1.28 mm² footprint), featuring 0.58 V max forward voltage at 2 A, 100 µA max reverse leakage at 40 V/25°C, and 137 °C/W junction-to-ambient thermal resistance on standard FR-4. It serves as a blocking or reverse protection diode in portable DC-DC converters and battery-powered systems.
For engineers reviewing the SDM2A40CSP-7B datasheet, SDM2A40CSP-7B pinout, SDM2A40CSP-7B application, or SDM2A40CSP-7B equivalent, key selection criteria include low VF conduction loss, high-temperature IR stability up to 150°C, CSP thermal performance on minimal copper area, and RoHS-compliant NiAu bump termination.
Technical Context
This Schottky rectifier uses a planar metal–semiconductor junction optimized for fast switching (14 ns trr) and low capacitive charge (81 pF CT at 5 V), enabling efficient operation in high-frequency boost and buck converters. Its bare-silicon side walls require non-contact PCB pad layout per Diodes' outline X3-WLB1608-2 to prevent shorting.
The device delivers 2 A average output current with 28 A non-repetitive surge capability and operates across –55°C to +150°C. Thermal resistance drops to 50 °C/W when mounted on a 1-inch² 2 oz copper pad-critical for thermally constrained portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum repetitive reverse voltage before breakdown; sets safe operating limit in 3.3 V–12 V input rails. |
| IO | 2 A - Continuous DC output current rating; supports compact 2 A power stages without heatsinking. |
| VF Max | 0.58 V @ 2 A, 25°C - Low conduction loss enables >92% efficiency in 5 V–12 V boost converters at full load. |
| IR Max | 100 µA @ 40 V, 25°C - Enables stable reverse blocking in battery backup paths with minimal standby drain. |
| trr | 14 ns - Fast recovery minimizes switching loss and EMI in >500 kHz DC-DC topologies. |
| RθJA | 137 °C/W - Validated on minimum FR-4 pad; defines temperature rise under 2 A continuous load in space-constrained layouts. |
| CT | 81 pF @ 5 V - Low junction capacitance reduces turn-on delay and improves light-load regulation in synchronous rectifiers. |
Pinout & Package
Package: X3-WLB1608-2 chip-scale package (1.60 × 0.80 × 0.275 mm), NiAu bump terminals, cathode marked by dot and notch. Side walls are electrically active bare silicon-solder must not contact them.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Input current entry point | Connected to source rail or switch node; requires thermal relief pad for solder reflow control. |
| Cathode (Pin 2) | Output current exit point | Marked by dot and notch; ties to output capacitor or load; primary heat path to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| Low VF (0.43 V typ @ 1 A) | Reduces I²R losses by ≥35% vs. comparable 40 V Schottkys, directly improving battery runtime in portable devices. |
| High-temp IR stability (600 µA @ 32 V, 85°C) | Prevents thermal runaway in enclosed enclosures where ambient exceeds 70°C, supporting reliable 24/7 operation. |
| X3-WLB1608-2 footprint (1.28 mm²) | Enables placement in <2 mm² board area-ideal for wearables and ultra-thin USB-C PD adapters. |
| NiAu bump termination | Ensures robust solder joint reliability after multiple reflow cycles and eliminates lead-based contamination risk. |
Applications
| USB Power Delivery Adapter | Wireless Charging Transmitter |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 20 W–30 W GaN-based USB-C PD adapters. IC Role / Device Role / Timing Role: Output rectifier replacing MOSFET gate drivers; conducts during low-side switch off-time. Use Value: 0.58 V VF limits conduction loss to <1.2 W at 2 A, enabling >94% peak efficiency without forced air cooling. | Use Scenario: Reverse polarity protection between Qi transmitter coil driver and battery management IC. IC Role / Device Role / Timing Role: Unidirectional current gate preventing backfeed during coil deactivation or fault conditions. Use Value: 100 µA IR at 25°C ensures <0.5 µW standby loss-critical for maintaining >99% quiescent efficiency in always-on charging pads. |
| Portable Medical Monitor | Industrial IoT Sensor Node |
Use Scenario: Input-blocking diode isolating dual Li-ion battery inputs from main PMIC in patient-worn monitors. IC Role / Device Role / Timing Role: Prevents cross-battery discharge during hot-swap or cell imbalance events. Use Value: 137 °C/W RθJA allows full 2 A operation within 25°C ambient rise on 4-layer PCB-meeting IEC 60601 creepage and thermal safety margins. | Use Scenario: Boost converter output rectifier in LoRaWAN end-node powered by coin-cell or energy harvester. IC Role / Device Role / Timing Role: Delivers regulated 3.3 V from 1.8–2.5 V input; handles pulsed 100 mA transmit loads. Use Value: 14 ns trr and 81 pF CT minimize switching loss and output ripple during 100 ms RF bursts, preserving battery life over 10-year deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-30TR | 30 V VRRM, 0.45 V VF @ 2 A, SOD-123FL package (3.5 mm²) | Lower voltage rating; larger footprint; higher RθJA (200 °C/W) | Select only if system reverse voltage ≤30 V and board space >3 mm² is available. |
| SS24-HF | 40 V VRRM, 0.5 V VF @ 2 A, SMA package (12 mm²), 100 µA IR | Same voltage/current specs but 10× larger area and 3× higher thermal resistance | Choose only when manual assembly or legacy footprint compatibility is required. |
Compared with RB055LAM-30TR and SS24-HF, SDM2A40CSP-7B uniquely delivers 40 V rating, 2 A current, and sub-1.3 mm² footprint with verified 137 °C/W thermal performance-making it the only option for space- and thermally constrained 20+ W portable power stages.
Availability
SDM2A40CSP-7B is available at Aetrix Electronics and suitable for USB-C PD adapters, wireless charging transmitters, portable medical monitors, and industrial IoT sensor nodes requiring stable component supply and long-term lifecycle support.
Supply support for SDM2A40CSP-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.
The SDM2A40CSP belongs to Diodes' CSP Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency DC-DC conversion in battery-powered portable electronics where board area and thermal headroom are severely limited.
FAQ
What is the maximum allowable PCB copper area for optimal thermal performance?
The datasheet specifies two thermal test conditions: 137 °C/W on minimum recommended FR-4 pad (per Diodes' outline), and 50 °C/W on a 1-inch² 2 oz copper pad. For production designs targeting ≤60°C junction rise at 2 A, use ≥250 mm² of 2 oz copper connected directly to both anode and cathode terminals via thermal vias.
Can SDM2A40CSP-7B be used in automotive cabin modules?
Yes-it operates from –55°C to +150°C and meets AEC-Q200 stress test requirements for temperature cycling and humidity bias. However, its 40 V VRRM is insufficient for 12 V battery load-dump transients (ISO 7637-2 Pulse 5a); external TVS clamping is required for direct battery connection.
Is the cathode dot visible under optical inspection after reflow?
Yes-the cathode is marked by a laser-etched dot and physical notch on the package edge. The dot remains clearly visible post-reflow due to contrast between NiAu bump and silicon surface; automated AOI systems detect it reliably at ≥10× magnification using standard white-light illumination.
Does the X3-WLB1608-2 package support hand-soldering for prototyping?
No-its 0.6 mm pitch NiAu bumps and bare-silicon side walls make hand-soldering impractical. Diodes recommends stencil-printed solder paste with Type 4 powder and reflow profiling (peak 245°C, 60 sec above 220°C). For evaluation, use Diodes' SDM2A40CSP-EVM adapter board with SOP-2 footprint.
SDM2A40CSP-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 470 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 14 ns
- Current - Reverse Leakage @ Vr:
- 100 µA @ 40 V
- Capacitance @ Vr, F:
- 81pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-WLB1608-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM2A40CSP-7B FAQ
1.How can I place an order for SDM2A40CSP-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM2A40CSP-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM2A40CSP-7B reliable?
The price and inventory of SDM2A40CSP-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM2A40CSP-7B is usually 5 days.
3.What payment methods are accepted for SDM2A40CSP-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM2A40CSP-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM2A40CSP-7B?
SDM2A40CSP-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM2A40CSP-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM2A40CSP-7B?
For technical support, including SDM2A40CSP-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM2A40CSP-7B requirements.
6.How does Aetrix verify that SDM2A40CSP-7B is sourced from the original manufacturer or authorized distributors?
All SDM2A40CSP-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM2A40CSP-7B meets industry standards.
7.What is the process for return or replacement of SDM2A40CSP-7B?
All SDM2A40CSP-7B units undergo pre-shipment inspection (PSI). If there is an issue with SDM2A40CSP-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM2A40CSP-7B part is unused and in its original packaging.
Return procedure for SDM2A40CSP-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SDM2A40CSP-7B Tags

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Diodes Incorporated
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