Diodes Incorporated SDM2U20CSP-7

Overview

SDM2U20CSP-7 from Diodes Incorporated is a 20 V, 2.0 A Schottky barrier rectifier in chip-scale package (X3-WLB1608-2), featuring 0.47 V max forward voltage at 2.0 A, 150 µA max reverse leakage at 20 V, and 150 °C/W junction-to-ambient thermal resistance. It serves as a low-loss blocking or boost diode in space-constrained DC/DC converters and USB power paths.

For engineers reviewing the SDM2U20CSP-7 datasheet, SDM2U20CSP-7 pinout, SDM2U20CSP-7 application, or SDM2U20CSP-7 equivalent, key selection criteria include forward voltage drop at rated current, high-temperature reverse leakage stability, thermal resistance under PCB pad constraints, and CSP solderability with NiAu bumps.

Technical Context

This Schottky rectifier uses a planar metal–semiconductor junction optimized for low VF and reduced IR drift over temperature. Its X3-WLB1608-2 package integrates NiAu solderable bumps directly on silicon die, enabling direct board mounting without wire bonds or leads.

Thermal performance relies on low RθJA (150 °C/W) when mounted on 2 oz copper FR-4 with minimum recommended pad layout per AP02001. Junction capacitance is 115 pF at 4 V reverse bias, supporting high-frequency switching up to ~10 MHz in flyback and buck topologies.

Key Specifications

Pinout & Package

Package: X3-WLB1608-2 chip-scale package (1.60 mm × 0.80 mm, 0.275 mm height), with NiAu solderable bumps and cathode dot marking. Polarity confirmed: Pin #1 = Cathode, Pin #2 = Anode.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB055LAM-30TR and SS22-E3/5AT, SDM2U20CSP-7 uniquely delivers 2 A capability in a 1.28 mm² CSP with industry-leading VF/IR trade-off-enabling miniaturized, high-efficiency 5 V power stages where thermal and spatial constraints dominate.

Availability

SDM2U20CSP-7 is available at Aetrix Electronics and suitable for USB-C power delivery adapters, wearable battery management systems, and industrial sensor transmitters requiring stable component supply, RoHS-compliant sourcing, and consistent CSP packaging.

Supply support for SDM2U20CSP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power solutions and signal integrity components for consumer, industrial, and automotive markets.

The SDM2U20CSP belongs to Diodes' CSP Schottky rectifier product line, engineered specifically for ultra-compact, thermally efficient DC/DC conversion in space- and power-constrained portable electronics.

FAQ

What is the maximum operating temperature for SDM2U20CSP-7?

The SDM2U20CSP-7 has an operating junction temperature range of –55°C to +150°C. Its thermal resistance (RθJA = 150 °C/W) allows sustained 2.0 A operation up to +85°C ambient when mounted per AP02001 pad layout on 2 oz copper FR-4. Derating begins above 25°C ambient per Figure 6.

Is SDM2U20CSP-7 compatible with lead-free reflow profiles?

Yes. The device uses NiAu bump terminations qualified per MIL-STD-202, Method 208 and supports JEDEC J-STD-020 Level 1 moisture sensitivity. It is fully RoHS-compliant and rated for peak reflow temperatures up to 260°C, matching standard lead-free soldering profiles.

How does the X3-WLB1608-2 package differ from conventional SOD-123 or SMA packages?

X3-WLB1608-2 is a wafer-level chip-scale package with direct die-level NiAu bumps, measuring 1.60 mm × 0.80 mm × 0.275 mm. Unlike SOD-123 or SMA, it eliminates leads and molding compound, reducing parasitic inductance, thermal resistance, and board area by >60%, while enabling finer-pitch automated placement.

Can SDM2U20CSP-7 be used in automotive applications?

While SDM2U20CSP-7 meets AEC-Q200 stress test recommendations for temperature cycling and humidity, it is not AEC-Q101 qualified. It is suitable for non-safety-critical automotive cabin electronics (e.g., infotainment USB ports) but not for engine bay or ADAS systems requiring full automotive qualification.