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Diodes Incorporated SDM2U30CSP-7
- Part No.:
- SDM2U30CSP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SDM2U30CSP-7.pdf
- Description:
- DIODE SCHOTT 30V 2A X3-WLB1608-2
- Quantity:
- Payment:
- Shipping:
Inventory:40,233
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Product details
Overview
SDM2U30CSP-7 from Diodes Incorporated is a 30 V, 2.0 A Schottky barrier rectifier in chip-scale package (X3-WLB1608-2), featuring 0.42 V typical forward voltage at 1.0 A, 150 µA max reverse leakage at 30 V, and 155 °C/W junction-to-ambient thermal resistance. It serves as a low-loss, space-constrained blocking or reverse protection diode in portable DC/DC converters and battery-powered systems.
For engineers reviewing the SDM2U30CSP-7 datasheet, SDM2U30CSP-7 pinout, SDM2U30CSP-7 application, or SDM2U30CSP-7 equivalent, key selection criteria include forward voltage drop at rated current, high-temperature leakage behavior, thermal resistance under FR-4 PCB mounting, and CSP solderability with NiAu bumps.
Technical Context
This Schottky rectifier uses a planar metal-semiconductor junction optimized for low VF and stable IR across -55°C to +150°C operation. Its 110 pF junction capacitance at 4 V enables fast switching in boost and flyback topologies up to several MHz.
The X3-WLB1608-2 package integrates bare-die silicon with NiAu solder bumps on a 1.60 mm × 0.80 mm footprint, achieving 1.28 mm² board area and low-profile mounting. Side-wall silicon exposure requires controlled reflow to avoid flux contact.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum repetitive reverse voltage before breakdown; sets upper limit for input/output rail isolation in 5–24 V systems. |
| IO | 2.0 A - Continuous average forward current at TA = 25°C; derates to ~1.6 A at 85°C ambient on standard FR-4. |
| VF @ 2.0 A | 0.48 V max - Directly determines conduction loss (0.96 W max at full load); critical for thermal budget in sealed enclosures. |
| IR @ 30 V | 150 µA max - Low leakage preserves battery life in always-on reverse-protection applications; stable up to 125°C. |
| RθJA | 155 °C/W - Measured on 2 oz copper FR-4 with minimum pad layout; defines temperature rise per watt dissipated. |
| CJ @ 4 V | 110 pF - Junction capacitance impacts switching speed and EMI in high-frequency DC/DC stages; enables <100 ns recovery. |
Pinout & Package
Package: X3-WLB1608-2 - Chip-scale package with 1.60 mm × 0.80 mm outline, 0.275 mm height, NiAu bump terminals, cathode marked by dot and notch. Board area: 1.28 mm².
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Forward current entry point | Connected to source/switch node in boost or reverse-blocking configurations; requires low-inductance trace routing. |
| Cathode (Pin 2) | Forward current exit / reverse voltage reference | Marked by dot and notch; ties to output rail or ground return; must avoid solder bridging to side-wall silicon. |
Key Features
| Feature | Design Value |
|---|---|
| Low VF at 2.0 A | 0.48 V max reduces power loss by >30% vs. comparable 30 V Si PN rectifiers, directly improving efficiency in 1–2 W portable supplies. |
| Thermally stable IR | Leakage remains ≤150 µA up to 125°C - prevents thermal runaway in compact battery packs and wearable enclosures. |
| Chip-scale footprint | 1.28 mm² area saves >60% board space vs. SOD-123; enables ultra-thin designs where Z-height <0.3 mm is mandatory. |
| NiAu bump terminations | Lead-free, halogen-free, RoHS 3 compliant; supports Pb-free reflow profiles with MIL-STD-202 solderability validation. |
Applications
| Portable DC/DC Boost Converter | USB-C Power Delivery Input Protection |
|---|---|
Use Scenario: Step-up converter in Bluetooth earbuds supplying 5 V from single-cell Li-ion (2.7–4.2 V). IC Role / Device Role / Timing Role: Boost diode conducting during switch-off phase; handles 2 A peak current with minimal voltage headroom loss. Use Value: 0.42 V typical VF at 1 A maintains >92% efficiency at 500 mW output; 1.28 mm² footprint fits within 3.5 mm × 3.5 mm module area. |
Use Scenario: Reverse-polarity protection at USB-C receptacle input of portable monitor. IC Role / Device Role / Timing Role: Blocking diode preventing damage from miswired 20 V PD source; conducts only during normal forward operation. Use Value: 150 µA max IR at 20 V ensures <0.1 µW standby loss; CSP package withstands repeated hot-plug thermal cycling without delamination. |
| Wireless Charging Transmitter Pad | IoT Sensor Node Power Path |
Use Scenario: Rectification of 100–200 kHz AC from transmitter coil into regulated 3.3 V supply. IC Role / Device Role / Timing Role: High-frequency switching diode; operates in discontinuous conduction mode with 110 pF CJ limiting ringing. Use Value: 110 pF junction capacitance minimizes switching losses and EMI emissions; 155 °C/W RθJA allows passive cooling in sealed plastic housing. |
Use Scenario: Power-path OR-ing diode selecting between coin-cell and energy-harvesting source in environmental sensor. IC Role / Device Role / Timing Role: Low-leakage blocking element ensuring microamp-level sleep current integrity. Use Value: ≤150 µA IR at 3.3 V preserves >99.5% battery shelf life over 12 months; 0.275 mm profile avoids interference with stacked PCB layers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-30TR | Higher VF (0.55 V @ 2 A), larger SOD-523 package (2.8 mm²), 200 µA IR @ 30 V. | Less suitable for ultra-thin wearables; acceptable in cost-sensitive consumer chargers with relaxed thermal limits. | Choose when board area >2 mm² is available and leakage tolerance >200 µA is acceptable. |
| SS23-E3/5AT | SMA package (4.5 mm²), 0.5 V VF @ 2 A, 500 µA IR @ 30 V, higher RθJA (200 °C/W). | Not viable for space-constrained IoT nodes; usable in industrial adapters with heatsinking. | Prefer only if existing SMA footprint reuse is required and thermal margin exceeds 40°C/W. |
Compared with RB050M-30TR and SS23-E3/5AT, SDM2U30CSP-7 delivers superior board-area efficiency (1.28 mm²), lowest VF among CSP 2 A Schottkys, and best high-temperature leakage control-making it optimal for next-gen miniaturized battery systems.
Availability
SDM2U30CSP-7 is available at Aetrix Electronics and suitable for portable DC/DC converters, USB-C power delivery protection circuits, and wireless charging transmitter modules requiring stable component supply and consistent CSP packaging.
Supply support for SDM2U30CSP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The SDM2U30CSP belongs to Diodes' high-efficiency Schottky rectifier product line, engineered specifically for space- and thermally constrained portable electronics where low VF, low IR, and ultra-small CSP packaging are mandatory.
FAQ
What is the maximum allowable junction temperature for SDM2U30CSP-7?
The SDM2U30CSP-7 has an absolute maximum junction temperature of +150°C, with continuous operation rated from -55°C to +150°C. Derating begins above +85°C ambient, and thermal design must ensure TJ stays below 150°C under worst-case IO and PCB layout conditions.
Is SDM2U30CSP-7 qualified for automotive applications?
No - SDM2U30CSP-7 is not AEC-Q101 qualified. Diodes offers automotive-grade variants (e.g., SDM2U30Qxx) with PPAP documentation and IATF 16949 manufacturing, but this part is intended for commercial portable and industrial applications only.
How should the X3-WLB1608-2 package be handled during reflow soldering?
Use standard Pb-free reflow profile (peak 260°C, 30 sec max). Avoid flux contact with side walls (bare silicon), maintain stencil aperture accuracy for NiAu bumps, and follow Diodes' recommended pad layout (X2=1.622 mm, Y=0.690 mm) to prevent tombstoning or voiding.
Does SDM2U30CSP-7 support bidirectional current flow?
No - it is a unidirectional Schottky rectifier. Forward conduction occurs only from anode to cathode; reverse bias blocks current up to 30 V. It cannot function as a bidirectional switch or TVS device.
SDM2U30CSP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 480 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 150 µA @ 30 V
- Capacitance @ Vr, F:
- 110pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-WLB1608-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM2U30CSP-7 FAQ
1.How can I place an order for SDM2U30CSP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM2U30CSP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM2U30CSP-7 reliable?
The price and inventory of SDM2U30CSP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM2U30CSP-7 is usually 5 days.
3.What payment methods are accepted for SDM2U30CSP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM2U30CSP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM2U30CSP-7?
SDM2U30CSP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM2U30CSP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM2U30CSP-7?
For technical support, including SDM2U30CSP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM2U30CSP-7 requirements.
6.How does Aetrix verify that SDM2U30CSP-7 is sourced from the original manufacturer or authorized distributors?
All SDM2U30CSP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM2U30CSP-7 meets industry standards.
7.What is the process for return or replacement of SDM2U30CSP-7?
All SDM2U30CSP-7 units undergo pre-shipment inspection (PSI). If there is an issue with SDM2U30CSP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM2U30CSP-7 part is unused and in its original packaging.
Return procedure for SDM2U30CSP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SDM2U30CSP-7 Tags
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Diodes Incorporated
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