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Diodes Incorporated SDM2U40CSP-7B
- Part No.:
- SDM2U40CSP-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SDM2U40CSP-7B.pdf
- Description:
- DIODE SCHOTT 40V 2A X3-WLB1608-2
- Quantity:
- Payment:
- Shipping:
Inventory:1,839
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Product details
Overview
SDM2U40CSP-7B from Diodes Incorporated is a 40 V, 2.0 A Schottky barrier rectifier in a chip-scale X3-WLB1608-2 package (1.28 mm² footprint), featuring VF = 0.53 V max at 2.0 A and IR = 150 µA max at 40 V, optimized for blocking, boost, and reverse protection in portable power rails.
For engineers reviewing the SDM2U40CSP-7B datasheet, SDM2U40CSP-7B pinout, SDM2U40CSP-7B application, or SDM2U40CSP-7B equivalent, key selection criteria include low thermal resistance (RθJA = 65 °C/W on 1-inch² copper), cathode-dot polarity marking, NiAu bump terminations, and CSP-level board space efficiency for space-constrained DC/DC and battery management designs.
Technical Context
This Schottky rectifier uses a planar silicon die with metal-semiconductor junction to achieve low forward voltage and fast switching without minority-carrier storage delay. Its 85 pF junction capacitance at 5 V enables high-frequency operation in boost converters up to ~1 MHz.
The device's thermal performance is defined by two RθJA values: 135 °C/W on standard FR-4 (2 oz Cu) and 65 °C/W on a 1-inch² copper pad-enabling design flexibility between compact layout and higher power dissipation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum repetitive reverse voltage before breakdown; sets upper limit for input rail protection in 5–24 V systems. |
| IO | 2.0 A - Continuous average forward current rating; supports sustained 2 A load in portable chargers and PMIC output stages. |
| VF Max | 0.53 V @ 2.0 A - Low conduction loss reduces I²R heating and improves efficiency in high-duty-cycle boost diodes. |
| IR Max | 150 µA @ 40 V - Low leakage preserves battery life in always-on reverse protection circuits at room temperature. |
| RθJA | 65 °C/W - Thermal resistance on 1-inch² copper pad; allows ~1.2 W continuous dissipation at ΔT = 78 °C above ambient. |
| CT | 85 pF @ 5 V - Junction capacitance limits reverse recovery noise and EMI in high-frequency switching nodes. |
Pinout & Package
Package: X3-WLB1608-2 chip-scale package (1.60 × 0.80 × 0.275 mm), with NiAu solderable bumps, cathode marked by dot, and electrically active side walls requiring non-contact pad layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Bump 1) | Forward current entry | Connected to input/source side; must be routed away from heat-sensitive components due to direct silicon exposure. |
| Cathode (Bump 2) | Forward current exit / Reverse blocking node | Marked with dot; ties to output/load or ground return; defines polarity for reverse voltage protection orientation. |
Key Features
| Feature | Design Value |
|---|---|
| Low VF at 2.0 A | 0.53 V max - Reduces forward power loss to ≤1.06 W, enabling smaller thermal pads in ultra-thin mobile PCBs. |
| Low IR at 40 V | 150 µA max - Minimizes standby current drain in battery-backed systems, extending shelf life beyond 12 months. |
| Chip-scale footprint | 1.28 mm² - Saves >70% board area vs. SOD-123; critical for wearable sensor modules and TWS earbud PCBs. |
| NiAu bump terminations | Lead-free, RoHS/Green compliant - Ensures reliable reflow soldering and eliminates tin whisker risk in automotive-qualified assemblies. |
Applications
| USB Power Delivery Input Protection | Wireless Charging Transmit Stage |
|---|---|
Use Scenario: Prevents reverse current flow from 20 V PD bus into auxiliary 5 V LDO during adapter hot-swap events. IC Role / Device Role / Timing Role: Reverse protection diode placed between PD controller and system rail. Use Value: 0.53 V VF ensures <105 mW conduction loss at 200 mA fault current, avoiding thermal shutdown during transient overvoltage. | Use Scenario: Blocks backfeed from resonant tank into DC input during Qi transmitter burst-mode operation. IC Role / Device Role / Timing Role: Boost diode in 15 W transmitter half-bridge output stage. Use Value: 85 pF CT minimizes capacitive coupling noise into adjacent NFC antenna traces, preserving communication integrity. |
| Smart Band Battery Charging Path | Industrial IoT Sensor Node Rail Isolation |
Use Scenario: Isolates Li-ion battery from USB charging IC when system is powered off to prevent self-discharge. IC Role / Device Role / Timing Role: Blocking diode in linear charger path. Use Value: 150 µA IR at 4.2 V ensures <0.6 nA leakage per cell-negligible impact on 3-month shelf life specification. | Use Scenario: Separates 3.3 V MCU domain from 5 V sensor excitation rail to avoid cross-domain latch-up. IC Role / Device Role / Timing Role: Rail isolation diode in low-power sensor hub. Use Value: 1.28 mm² CSP footprint fits within 2.5 mm × 2.5 mm keep-out zone around MEMS pressure sensor die. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-30TR | Higher VF (0.55 V @ 2 A), larger SOD-523 package (2.8 mm²), 30 V VRRM | Limited to ≤12 V input rails; unsuitable for 20 V USB PD protection | Choose only if 30 V rating suffices and board space permits larger footprint. |
| SS24-HF | Same 40 V rating but higher IR (500 µA @ 40 V), SMA package (12.5 mm²), VF = 0.5 V @ 2 A | Poorer battery retention; requires 10× more PCB area than CSP | Select only for prototyping with hand-soldered through-hole alternatives or legacy layouts. |
Compared with RB055LAM-30TR and SS24-HF, SDM2U40CSP-7B delivers superior space efficiency (1.28 mm²), lower leakage (150 µA), and verified thermal performance on minimal copper-making it optimal for production-grade portable electronics where board area and standby current are constrained.
Availability
SDM2U40CSP-7B is available at Aetrix Electronics and suitable for USB Power Delivery input protection, wireless charging transmit stages, smart band battery charging paths, and industrial IoT sensor node rail isolation requiring stable component supply and consistent CSP-level assembly compatibility.
Supply support for SDM2U40CSP-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.
The SDM2U40CSP belongs to Diodes' advanced Schottky rectifier product line, engineered specifically for ultra-compact, high-current DC/DC conversion and reverse protection in battery-powered portable electronics.
FAQ
What is the maximum junction temperature for SDM2U40CSP-7B?
The SDM2U40CSP-7B has an operating junction temperature range of –55 °C to +150 °C. Its absolute maximum TJ is 150 °C; exceeding this risks permanent degradation of the Schottky barrier and increased IR. Derating curves in Figure 3 show IO drops to 1.0 A at TA = 125 °C on a 1-inch² copper pad.
Is SDM2U40CSP-7B compatible with lead-free reflow profiles?
Yes-SDM2U40CSP-7B uses NiAu bump terminations and is fully RoHS-compliant with no intentionally added lead. It supports standard JEDEC J-STD-020 Level 1 moisture sensitivity and withstands peak reflow temperatures up to 260 °C per MIL-STD-202 Method 208.
How is polarity identified on the SDM2U40CSP-7B package?
Polarity is marked by a cathode dot located adjacent to Pin 2 (cathode bump) on the top surface of the X3-WLB1608-2 package. The anode is Pin 1, and the dot aligns with the cathode terminal per the schematic on page 4 of DS38584 Rev. 5-2.
Can SDM2U40CSP-7B be used in place of a standard SOD-123 Schottky diode?
No-it is not a drop-in replacement due to its chip-scale X3-WLB1608-2 footprint and NiAu bump terminations, which require specific stencil aperture design and reflow profile tuning. Board redesign is required to accommodate the 1.60 × 0.80 mm CSP layout and avoid solder bridging on electrically active side walls.
SDM2U40CSP-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 530 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 150 µA @ 40 V
- Capacitance @ Vr, F:
- 85pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-WLB1608-2
- Operating Temperature - Junction:
- -55°C ~ 150°C
SDM2U40CSP-7B FAQ
1.How can I place an order for SDM2U40CSP-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for SDM2U40CSP-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SDM2U40CSP-7B reliable?
The price and inventory of SDM2U40CSP-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SDM2U40CSP-7B is usually 5 days.
3.What payment methods are accepted for SDM2U40CSP-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SDM2U40CSP-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SDM2U40CSP-7B?
SDM2U40CSP-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SDM2U40CSP-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SDM2U40CSP-7B?
For technical support, including SDM2U40CSP-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SDM2U40CSP-7B requirements.
6.How does Aetrix verify that SDM2U40CSP-7B is sourced from the original manufacturer or authorized distributors?
All SDM2U40CSP-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SDM2U40CSP-7B meets industry standards.
7.What is the process for return or replacement of SDM2U40CSP-7B?
All SDM2U40CSP-7B units undergo pre-shipment inspection (PSI). If there is an issue with SDM2U40CSP-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SDM2U40CSP-7B part is unused and in its original packaging.
Return procedure for SDM2U40CSP-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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Diodes Incorporated
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