Diodes Incorporated SDT8A60VP5-7

Overview

SDT8A60VP5-7 from Diodes Incorporated is an 8A, 60V trench Schottky barrier rectifier in PowerDI5 package, featuring VF ≤ 0.54 V at 8A/25°C, IR ≤ 0.2 mA at 60V/125°C, and 150°C maximum junction temperature. It serves as a high-efficiency freewheel or output rectifier in compact DC-DC converters and AC-DC adapters.

For engineers reviewing the SDT8A60VP5-7 datasheet, SDT8A60VP5-7 pinout, SDT8A60VP5-7 application, or SDT8A60VP5-7 equivalent, key selection criteria include forward voltage drop at full load, high-temperature leakage stability, thermal resistance to case (RθJC = 3°C/W on Al board), and PowerDI5 footprint compatibility with space-constrained power stages.

Technical Context

This Schottky rectifier uses trench MOS structure to reduce forward conduction loss while maintaining low reverse leakage up to 150°C junction temperature. Its soft, fast switching behavior minimizes EMI in high-frequency switching topologies such as synchronous buck and flyback converters.

The device achieves RθJC = 3°C/W when mounted on a 2-inch × 2-inch aluminum board - enabling high-power density designs without forced airflow. Its 140A non-repetitive surge rating supports transient overload tolerance in adapter input rectification and motor drive freewheel paths.

Key Specifications

Pinout & Package

Package: PowerDI5 - surface-mount, thermally enhanced plastic package with exposed cathode pad; dimensions 3.966 mm × 6.51 mm × 1.10 mm; UL 94V-0 rated molding compound; matte tin terminals solderable per MIL-STD-202.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-8EWH06FN-M3/45 and SB860-E3/45, SDT8A60VP5-7 delivers lower VF and superior thermal resistance in a smaller footprint - making it optimal for new designs prioritizing power density and efficiency in space-constrained adapters and DC-DC modules.

Availability

SDT8A60VP5-7 is available at Aetrix Electronics and suitable for DC-DC converters, AC-DC adaptors, and industrial motor drives requiring stable component supply, consistent thermal performance, and RoHS-compliant manufacturing.

Supply support for SDT8A60VP5-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for industrial, computing, and consumer markets.

The SDT8A60VP5 belongs to Diodes' advanced Schottky rectifier product line, engineered specifically for high-frequency, high-density power conversion where low VF, low IR, and robust thermal performance are critical.

FAQ

What is the maximum continuous forward current rating for SDT8A60VP5-7 at 115°C case temperature?

The SDT8A60VP5-7 is rated for 8 A average forward current at TC = 115°C, as shown in Figure 4 (DC Forward Current Derating). This rating assumes proper thermal design using the recommended 2-inch × 2-inch aluminum board or equivalent copper area to achieve RθJC = 3°C/W.

Does SDT8A60VP5-7 require a heatsink in typical 8A operation?

No external heatsink is required if mounted on a 2-inch × 2-inch aluminum board or ≥200 mm² of 2-oz copper with thermal vias. Under those conditions, RθJC = 3°C/W ensures TJ remains below 150°C at 8A/25°C ambient. On standard FR-4, RθJA = 18°C/W necessitates careful layout but still avoids active cooling.

Is SDT8A60VP5-7 suitable for automotive applications?

SDT8A60VP5-7 is not AEC-Q101 qualified and lacks automotive-specific qualification data. While its +150°C TJ rating meets under-hood temperature requirements, Diodes Incorporated does not endorse or guarantee its use in automotive safety-critical systems without additional customer validation and qualification testing.

How does the PowerDI5 package improve thermal performance over traditional SMC or SMA packages?

PowerDI5 integrates an exposed cathode pad that serves as both electrical terminal and primary thermal path. Its RθJC = 3°C/W on Al board is ~3× better than SMA (RθJC ≈ 9°C/W), enabling higher current density without increasing board area or adding thermal interface materials.