Taiwan Semiconductor Corporation SFAF1602G

Overview

SFAF1602G from Taiwan Semiconductor is a 16A, 100V super fast rectifier diode in ITO-220AC package, featuring 0.975V forward voltage at 16A/25°C, 200A surge capability, and 35ns reverse recovery time. It serves as a high-efficiency freewheeling or output rectifier in switching-mode power supplies.

For engineers reviewing the SFAF1602G datasheet, SFAF1602G pinout, SFAF1602G application, or SFAF1602G equivalent, key selection criteria include V_RRM=100V, I_F=16A, t_rr=35ns, R_θJC=1.3°C/W, and AEC-Q101 qualification status (SFAF1602GH variant only).

Technical Context

This super fast rectifier uses glass-passivated silicon junction technology to achieve low conduction loss and rapid carrier recombination. Its 35ns reverse recovery time and 1.3°C/W junction-to-case thermal resistance support high-frequency operation up to several hundred kHz in DC-DC converters and inverters.

The device operates across -55°C to +150°C junction temperature range with 10µA max reverse leakage at 25°C and 400µA at 100°C. It is rated for 200A non-repetitive surge current (8.3ms half-sine) and complies with UL 94V-0 and RoHS/halogen-free standards.

Key Specifications

Pinout & Package

Package: ITO-220AC - 3-terminal through-hole molded package with isolated tab (cathode-connected tab), matte tin-plated leads, UL 94V-0 molding compound, and 0.56 N·m maximum mounting torque.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar super fast rectifier applications.

Compared with STTH1602CT and MUR1620CT, the SFAF1602G offers single-diode simplicity, AEC-Q101 qualification (in GH variant), and optimized thermal resistance for space-constrained single-channel rectification-making it preferable for cost-sensitive, single-output automotive or industrial SMPS where layout simplicity and qualification matter.

Availability

SFAF1602G is available at Aetrix Electronics and suitable for DC-DC converters, switching inverters, and freewheeling applications requiring stable component supply, consistent parametric performance, and traceable sourcing.

Supply support for SFAF1602G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and automotive markets since 1979.

The SFAF160xG series targets high-efficiency, high-reliability power conversion in space- and thermally constrained environments-designed specifically for next-generation SMPS, EV chargers, and industrial UPS systems demanding low V_F, fast t_rr, and robust surge capability.

FAQ

What is the maximum junction temperature rating for SFAF1602G?

The SFAF1602G has a maximum junction temperature (T_J) of +150°C and a minimum of –55°C. This wide operating range allows use in under-hood automotive environments and high-ambient industrial enclosures. Derating curves in the datasheet define allowable average forward current versus case temperature, ensuring safe operation within this thermal envelope. The SFAF1602G must be mounted to an appropriate heatsink to maintain T_J ≤150°C under full 16A load.

Is SFAF1602G pin-compatible with other ITO-220AC rectifiers?

Yes, the SFAF1602G uses the standard ITO-220AC mechanical outline with anode (lead 1), cathode (lead 2), and cathode-connected tab-matching industry-standard pinout for single-diode ITO-220AC devices. Mounting hole spacing, lead pitch, and tab dimensions conform to JEDEC TO-220AC equivalents. However, electrical characteristics (V_F, t_rr, V_RRM) differ across vendors, so functional substitution requires validation against system-level timing and loss requirements.

Does SFAF1602G meet automotive qualification standards?

The base SFAF1602G is not AEC-Q101 qualified; however, the SFAF1602GH variant is explicitly qualified per AEC-Q101. Both share identical electrical and thermal specs, but only the GH suffix indicates completion of stress testing including HTGB, HTRB, and temperature cycling. For automotive applications such as on-board chargers or DC-DC converters, specify SFAF1602GH to ensure compliance with automotive reliability requirements.

What is the reverse leakage current specification for SFAF1602G at elevated temperature?

At T_J = 100°C and rated V_R = 100V, the SFAF1602G exhibits a maximum reverse leakage current (I_R) of 400 µA. At 25°C, the limit is 10 µA. This low leakage supports stable operation in high-temperature power stages and minimizes standby power loss in always-on systems. The specified test condition uses a 30ms pulse width to avoid self-heating artifacts during measurement.

How does the junction-to-case thermal resistance of SFAF1602G impact heatsink selection?

The SFAF1602G has a typical R_θJC of 1.3°C/W, meaning each watt of power dissipated generates 1.3°C temperature rise from junction to case. For example, at 16A and 0.975V V_F, conduction loss is ~15.6W, resulting in ~20.3°C junction-to-case rise-requiring a heatsink with sufficient R_θCA to keep T_J ≤150°C. Accurate thermal modeling must include interface resistance and ambient conditions; the SFAF1602G's low R_θJC simplifies heatsink sizing compared to alternatives with >2.0°C/W.