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Infineon Technologies SIDC06D60F6X1SA2
- Part No.:
- SIDC06D60F6X1SA2
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- Die
- Datasheet:
-
SIDC06D60F6X1SA2.pdf
- Description:
- DIODE GEN PURP 600V 15A DIE
- Quantity:
- Payment:
- Shipping:
Inventory:2,118
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Product details
Overview
SIDC06D60F6X1SA2 from Infineon Technologies is a 600 V, 15 A fast-switching silicon power diode die with emitter-controlled technology and 70 µm thickness, designed for high-frequency switching in discrete devices and power modules. It delivers soft recovery, low reverse recovery charge (Qrr), and stable thermal behavior across -40 °C to +150 °C junction range, enabling use in resonant SMPS and motor drives.
For engineers reviewing the SIDC06D60F6X1SA2 datasheet, SIDC06D60F6X1SA2 pinout, SIDC06D60F6X1SA2 application, or SIDC06D60F6X1SA2 equivalent, key selection criteria include its 600 V repetitive peak reverse voltage, 15 A forward current rating at Tvj < 150 °C, soft switching behavior, low temperature coefficient of VF, and compatibility with epoxy or soft-solder die bonding.
Technical Context
This bare die implements emitter-controlled (EC) technology to suppress minority carrier injection during turn-off, resulting in reduced Qrr and minimized voltage overshoot. Its 70 µm chip thickness and 2.45 × 2.45 mm² active area are optimized for low inductance and high thermal conductivity in module-level integration.
Static characteristics-such as VF = 1.6 V at IF = 15 A and IR = 27 µA at VR = 600 V-are wafer-tested at 25 °C. Dynamic ruggedness is verified by design (not production-tested) under 30 A / 600 V stress conditions at Tvj ≤ 150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - maximum repetitive reverse blocking capability without avalanche breakdown |
| IF | 15 A - continuous forward current rating at Tvj < 150 °C, defining thermal derating baseline |
| VF | 1.6 V @ 15 A - forward voltage drop directly impacts conduction loss in high-current paths |
| IR | 27 µA @ 600 V - ultra-low leakage ensures minimal standby power loss in high-voltage hold circuits |
| Tvj Range | -40 °C to +150 °C - operational junction temperature window compatible with industrial and automotive power stages |
| Chip Size | 2.45 × 2.45 mm² - standardized die footprint for automated pick-and-place and module substrate layout |
| Thickness | 70 µm - thin die enables low thermal resistance and fast transient response in bonded assemblies |
Pinout & Package
Package: Bare die (unmounted silicon chip) with anode pad (1.73 × 1.73 mm² AlSiCu metallization) on frontside and Ni/Ag backside metallization suitable for conductive epoxy or soft-solder die attachment. No leadframe or molded package.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (frontside pad) | Current entry point during forward conduction | AlSiCu metallization (3200 nm) supports aluminum wire bonding ≤250 µm and provides low-resistance interface to module baseplate |
| Cathode (backside metal) | Current exit path and thermal conduction surface | Ni/Ag stack enables reliable epoxy or solder bonding to copper or DBC substrates while maintaining electrical isolation integrity |
Key Features
| Feature | Design Value |
|---|---|
| Emitter-Controlled Technology | Reduces minority carrier lifetime to suppress Qrr and enable soft, oscillation-free turn-off in hard-switched topologies |
| Low Reverse Recovery Charge | Minimizes switching losses and EMI generation in high-frequency resonant converters (e.g., LLC, phase-shifted full-bridge) |
| Small Temperature Coefficient | Stable VF and Qrr over -40 °C to +150 °C ensures consistent performance across thermal transients |
| Wafer-Level Passivation | Photoimide frontside coating protects against moisture ingress and mechanical damage during module assembly handling |
Applications
| Resonant SMPS | Industrial Motor Drives |
|---|---|
Use Scenario: Used as freewheeling or synchronous rectifier diode in LLC resonant converters operating above 100 kHz. IC Role / Device Role / Timing Role: Fast-recovery diode providing low-loss unidirectional current path during resonant tank zero-voltage switching transitions. Use Value: Low Qrr and soft recovery reduce voltage spikes and snubber losses, improving efficiency and reliability at high switching frequencies. | Use Scenario: Integrated into IGBT-based three-phase inverter modules for HVAC compressors and servo drives. IC Role / Device Role / Timing Role: Anti-parallel freewheeling diode paired with 600 V IGBTs in bridge-leg configuration. Use Value: Stable VF and rugged dynamic behavior ensure predictable commutation losses and robust operation under repetitive short-circuit stress. |
| High-Voltage DC-DC Converters | Uninterruptible Power Supplies (UPS) |
Use Scenario: Employed in isolated bidirectional DC-DC stages for energy storage systems requiring 400–800 V bus interfaces. IC Role / Device Role / Timing Role: High-voltage output rectifier handling up to 600 V reverse bias and 15 A average forward current. Use Value: 600 V VRRM and low leakage support high bus voltage operation while minimizing standby power loss. | Use Scenario: Mounted in double-sided cooling power modules for online UPS inverters with forced-air or liquid cooling. IC Role / Device Role / Timing Role: Freewheeling diode in high-efficiency PWM inverters delivering clean sine-wave output under variable load. Use Value: Thermal stability and low temperature coefficient ensure consistent conduction loss across ambient temperature swings and long runtime cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fast-switching high-voltage diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS MDD150-16N1 | Bare die, 1600 V / 150 A rated; larger chip size (5.5 × 5.5 mm²), higher Qrr, no EC technology | Targeted at medium-frequency (≤20 kHz) industrial rectification, not optimized for >100 kHz resonant topologies | Select only when higher voltage margin and higher current handling outweigh soft-switching requirements |
| Vishay VS-15EWH06FN-M3 | Surface-mount packaged diode (TO-252AA), 600 V / 15 A, standard PN junction, higher VF (1.85 V) | Designed for PCB-level discrete designs-not module-integrated; lacks die-level thermal optimization | Choose for cost-sensitive, lower-power (<500 W) board-level designs where module integration is unnecessary |
Compared with MDD150-16N1 and VS-15EWH06FN-M3, SIDC06D60F6X1SA2 uniquely combines emitter-controlled soft switching, 70 µm thinness, and wafer-level passivation-making it optimal for high-frequency, thermally constrained module integrations rather than discrete PCB or low-frequency rectification roles.
Availability
SIDC06D60F6X1SA2 is available at Aetrix Electronics and suitable for resonant SMPS, industrial motor drives, and high-voltage DC-DC converters requiring stable component supply, consistent wafer-batch performance, and traceable die-level sourcing.
Supply support for SIDC06D60F6X1SA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy systems.
SIDC06D60F6X1SA2 belongs to Infineon's high-voltage fast diode die portfolio, developed specifically for module manufacturers needing soft-switching, low-Qrr bare dies compatible with advanced power packaging technologies.
FAQ
Is SIDC06D60F6X1SA2 supplied in tape-and-reel or waffle-pack format?
No. SIDC06D60F6X1SA2 is delivered as bare die on foil, sawn and inspected per AQL 0.65 visual standards. It is not pre-mounted or packaged. Customers must integrate it into modules or substrates using conductive epoxy or soft-solder die bonding per Infineon's recommended process guidelines.
What is the maximum allowable mounting pressure during die attach?
Infineon specifies no explicit maximum mounting pressure; however, mechanical stress must avoid cracking the 70 µm silicon. Recommended die attach force is 2–5 N per die, applied uniformly via vacuum pickup tools calibrated for 2.45 × 2.45 mm² footprint. Excessive localized pressure may fracture the chip or delaminate photoimide passivation.
Does SIDC06D60F6X1SA2 require gate drive or external control signals?
No. SIDC06D60F6X1SA2 is a passive two-terminal power diode. It operates solely based on applied voltage polarity and magnitude-no gate signal, bias, or timing control is needed. Its emitter-controlled structure is intrinsic to the silicon design and requires no external circuitry to activate soft-switching behavior.
Can SIDC06D60F6X1SA2 be used in parallel configurations within a single module?
Yes-provided thermal and electrical symmetry is maintained. Parallel operation requires matched die batches, identical bond wire lengths, uniform die attach quality, and symmetrical heat spreading. Infineon confirms inherent current-sharing capability due to positive temperature coefficient of VF, but system-level validation under worst-case imbalance is required.
SIDC06D60F6X1SA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 1.6 V @ 15 A
- Speed:
- Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 27 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
- Operating Temperature - Junction:
- -40°C ~ 175°C
SIDC06D60F6X1SA2 FAQ
1.How can I place an order for SIDC06D60F6X1SA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIDC06D60F6X1SA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIDC06D60F6X1SA2 reliable?
The price and inventory of SIDC06D60F6X1SA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIDC06D60F6X1SA2 is usually 5 days.
3.What payment methods are accepted for SIDC06D60F6X1SA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIDC06D60F6X1SA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIDC06D60F6X1SA2?
SIDC06D60F6X1SA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIDC06D60F6X1SA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIDC06D60F6X1SA2?
For technical support, including SIDC06D60F6X1SA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIDC06D60F6X1SA2 requirements.
6.How does Aetrix verify that SIDC06D60F6X1SA2 is sourced from the original manufacturer or authorized distributors?
All SIDC06D60F6X1SA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIDC06D60F6X1SA2 meets industry standards.
7.What is the process for return or replacement of SIDC06D60F6X1SA2?
All SIDC06D60F6X1SA2 units undergo pre-shipment inspection (PSI). If there is an issue with SIDC06D60F6X1SA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIDC06D60F6X1SA2 part is unused and in its original packaging.
Return procedure for SIDC06D60F6X1SA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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