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Infineon Technologies SIDC14D60C8X1SA1
- Part No.:
- SIDC14D60C8X1SA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- Die
- Datasheet:
-
SIDC14D60C8X1SA1.pdf
- Description:
- DIODE GEN PURP 600V 50A DIE
- Quantity:
- Payment:
- Shipping:
Inventory:6,081
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Product details
Overview
SIDC14D60C8X1SA1 from Infineon Technologies is a 600 V, 50 A fast-switching silicon power diode die fabricated using Emitter Controlled 3 (EC3) technology with 70 µm thickness and soft reverse recovery characteristics. It serves as the freewheeling or anti-parallel diode in high-efficiency IGBT-based power modules for industrial motor drives and renewable energy inverters.
For engineers reviewing the SIDC14D60C8X1SA1 datasheet, SIDC14D60C8X1SA1 pinout (anode/cathode terminals), SIDC14D60C8X1SA1 application in power modules, or SIDC14D60C8X1SA1 equivalent bare-die diodes, this page delivers verified die-level specifications, thermal ruggedness context, EC3 process advantages, and module-integration guidance - not generic diode generalities.
Technical Context
This bare die implements Infineon's Emitter Controlled 3 (EC3) technology, enabling soft, fast switching with low Qrr (reverse recovery charge) and minimal temperature dependence of forward voltage. Its 70 µm thin wafer design supports high current density (50 A rated, 100 A repetitive peak) while maintaining robust dynamic ruggedness under hard-switching conditions up to 600 V and 100 A.
The die features AlSiCu front-side metallization (3200 nm), Ni/Ag backside metallization compatible with epoxy and soft-solder die attach, and photoimide passivation. Anode pad measures 3.9 × 2.35 mm² on a total die area of 4.6 × 3.05 mm² - optimized for low-inductance, high-thermal-conductivity module layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Repetitive Peak Reverse Voltage | 600 V - supports DC-link operation in 400–690 V AC drive and solar inverter applications |
| Continuous Forward Current (Tvj < 150°C) | 50 A - defines steady-state conduction capability under typical module thermal limits |
| Forward Voltage (IF = 50 A, Tvj = 25°C) | 1.2–1.9 V - low VF range reduces conduction losses; typ. 1.6 V used for loss modeling |
| Reverse Leakage Current (VR = 600 V) | 27 µA - confirms low leakage at rated blocking voltage, critical for high-voltage standby integrity |
| Junction Temperature Range | −40°C to +175°C - enables operation in harsh environments including traction and industrial enclosures |
| Die Thickness | 70 µm - thin die improves thermal resistance and switching speed but requires controlled die-attach process |
Pinout & Package
Package: Bare die (unmounted silicon chip), sawn on foil, dimensions 4.6 × 3.05 mm², thickness 70 µm. No leadframe or molded package - intended for integration into power modules or discrete packages via die bonding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode Pad (A) | Current entry terminal during forward conduction | 3.9 × 2.35 mm² AlSiCu metallized surface - designed for low-resistance, low-inductance wire bonding or clip bonding |
| Cathode Backside | Current exit terminal during forward conduction | Ni/Ag metallization - compatible with conductive epoxy or soft solder die attach to DBC or AMB substrates |
Key Features
| Feature | Design Value |
|---|---|
| Emitter Controlled 3 (EC3) Technology | Enables soft reverse recovery with low Qrr, reducing EMI and snubber stress in high-frequency IGBT modules |
| 70 µm Thin Die | Improves thermal response and switching speed, but mandates precise die-attach void control to avoid delamination |
| Low Tempco of VF | Stable forward voltage across −40°C to +150°C - simplifies thermal derating and parallel diode current sharing |
| Photoimide Passivation | Front-side protection against moisture and contamination during module assembly and long-term operation |
Applications
| Industrial Motor Drives | Solar Inverters |
|---|---|
Use Scenario: Used as anti-parallel freewheeling diode in 3-phase IGBT power modules for variable-frequency drives operating at 4–16 kHz switching frequency. IC Role / Device Role / Timing Role: Freewheeling diode providing low-loss current path during IGBT turn-off and regenerative braking. Use Value: Soft recovery minimizes voltage overshoot and EMI, enabling smaller snubbers and higher system efficiency at 150°C junction temperature. | Use Scenario: Integrated into full-bridge or NPC topology power modules for string inverters handling 5–10 kW DC input. IC Role / Device Role / Timing Role: Bidirectional conduction element supporting synchronous rectification and reactive power control in grid-tied converters. Use Value: Low Qrr and stable VF reduce conduction and switching losses across wide ambient temperature ranges (−25°C to +60°C). |
| Traction Converters | UPS Systems |
Use Scenario: Mounted in press-pack or bolt-down modules for rail traction inverters supplying 3-phase AC to induction motors. IC Role / Device Role / Timing Role: High-reliability freewheeling diode sustaining repetitive 100 A surge currents during dynamic load transients. Use Value: Verified dynamic ruggedness at 600 V / 100 A ensures robustness against short-circuit and overload events without derating. | Use Scenario: Employed in double-conversion online UPS modules delivering clean 50/60 Hz output with <1% THD. IC Role / Device Role / Timing Role: Output rectifier and battery-charging diode in high-efficiency IGBT-based inverter stages. Use Value: Low leakage (27 µA @ 600 V) maintains standby efficiency and prevents battery self-discharge in backup mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fast-switching power diode die applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS MDD100-16N1 | 1600 V rating, larger die (7.2 × 5.2 mm²), higher VF (1.85 V typ.), no EC3 soft-switching optimization | Targeted at medium-voltage industrial HVDC links, not optimized for 600 V motor drive switching frequencies >10 kHz | Select when higher blocking voltage and surge robustness outweigh switching loss sensitivity |
| STMicroelectronics STTH120R06CW | 600 V, 120 A discrete TO-247 packaged diode; uses standard soft-recovery process, not EC3; thicker die (~120 µm) | Designed for discrete PCB-mount use, not module integration; lacks backside metallization for direct substrate bonding | Choose for prototyping or low-volume discrete designs where bare-die handling and module assembly are impractical |
Compared with MDD100-16N1 and STTH120R06CW, SIDC14D60C8X1SA1 uniquely combines EC3 soft switching, 70 µm thinness, and Ni/Ag backside for direct high-thermal-conductivity module integration - making it optimal for high-power-density, high-frequency motor drive modules requiring low EMI and tight thermal management.
Availability
SIDC14D60C8X1SA1 is available at Aetrix Electronics and suitable for industrial motor drives, solar inverters, and UPS systems requiring stable component supply, traceable wafer-lot sourcing, and long-term production continuity.
Supply support for SIDC14D60C8X1SA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and renewable energy markets.
SIDC14D60C8X1SA1 belongs to Infineon's EC3 fast diode die product line, engineered specifically for high-efficiency, high-reliability power modules in demanding industrial drive and inverter applications.
FAQ
Is SIDC14D60C8X1SA1 supplied in tape-and-reel or waffle pack?
No - SIDC14D60C8X1SA1 is delivered as bare die on foil, not in carrier packaging. It is intended for automated die placement in power module assembly lines. Handling requires ESD-safe tools and nitrogen-controlled storage per Infineon's recommendation (<6 months at 23°C in dry N₂).
What is the maximum allowable die-attach void percentage for reliable thermal performance?
Infineon specifies ≤5% total void area in the die-attach layer for optimal thermal resistance and mechanical reliability. Exceeding this threshold increases junction-to-case thermal resistance by >15% and risks interfacial delamination under thermal cycling.
Does SIDC14D60C8X1SA1 require gate driving or external control signals?
No - SIDC14D60C8X1SA1 is an uncontrolled two-terminal power diode. It conducts when forward-biased and blocks when reverse-biased; no gate, control pin, or bias circuitry is involved. Its behavior is governed solely by applied voltage polarity and magnitude.
Can SIDC14D60C8X1SA1 be paralleled with other diodes in the same module?
Yes - its low temperature coefficient of forward voltage enables stable current sharing across paralleled dies. Successful parallel operation requires matched die thickness, identical die-attach quality, symmetrical layout, and balanced thermal paths to maintain ΔTvj < 5°C between units.
SIDC14D60C8X1SA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 50A
- Voltage - Forward (Vf) (Max) @ If:
- 1.9 V @ 50 A
- Speed:
- Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 27 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
- Operating Temperature - Junction:
- -40°C ~ 175°C
SIDC14D60C8X1SA1 FAQ
1.How can I place an order for SIDC14D60C8X1SA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIDC14D60C8X1SA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIDC14D60C8X1SA1 reliable?
The price and inventory of SIDC14D60C8X1SA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIDC14D60C8X1SA1 is usually 5 days.
3.What payment methods are accepted for SIDC14D60C8X1SA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIDC14D60C8X1SA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIDC14D60C8X1SA1?
SIDC14D60C8X1SA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIDC14D60C8X1SA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIDC14D60C8X1SA1?
For technical support, including SIDC14D60C8X1SA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIDC14D60C8X1SA1 requirements.
6.How does Aetrix verify that SIDC14D60C8X1SA1 is sourced from the original manufacturer or authorized distributors?
All SIDC14D60C8X1SA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIDC14D60C8X1SA1 meets industry standards.
7.What is the process for return or replacement of SIDC14D60C8X1SA1?
All SIDC14D60C8X1SA1 units undergo pre-shipment inspection (PSI). If there is an issue with SIDC14D60C8X1SA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIDC14D60C8X1SA1 part is unused and in its original packaging.
Return procedure for SIDC14D60C8X1SA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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