Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies SIPC03S2N03LX3MA1

Name: SIPC03S2N03LX3MA1
Brand: Infineon Technologies
SKU: SIPC03S2N03LX3MA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: SIPC03S2N03LX3MA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: -

Datasheet:: SIPC03S2N03LX3MA1.pdf

Description:: LV POWER MOS

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,268

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

SIPC03S2N03LX3MA1 from Infineon Technologies is a 30 V, 3.2 mΩ (typ.) single N-channel TrenchMOS power MOSFET in PG-TSDSON-8 package, rated for 100 A continuous drain current at T_c = 25 °C, with 100% avalanche-tested ruggedness and optimized for high-efficiency DC-DC converter primary-side switching.

For engineers reviewing the SIPC03S2N03LX3MA1 datasheet, SIPC03S2N03LX3MA1 pinout, SIPC03S2N03LX3MA1 application, or SIPC03S2N03LX3MA1 equivalent, key selection criteria include R_DS(on) at 10 V gate drive, Q_g of 49 nC, thermal resistance R_thJC = 0.5 K/W, and compliance with AEC-Q101 for automotive-grade reliability.

Technical Context

This device employs Infineon's TrenchMOS technology to achieve low conduction losses and fast switching transitions. Its gate threshold voltage V_GS(th) ranges from 1.2 V to 2.2 V, enabling robust 3.3 V and 5 V logic-level drive compatibility without external level-shifting circuitry.

The MOSFET features an integrated ESD protection diode (HBM Class 2), specified for pulsed avalanche energy E_AS = 420 mJ at T_j = 25 °C, and supports synchronous rectification topologies due to its low reverse recovery charge Q_rr = 37 nC and soft-recovery body diode behavior.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V - maximum blocking voltage compatible with 24 V automotive and industrial bus systems
R_DS(on) @ V_GS = 10 V	3.2 mΩ (typ.) - enables <1 W conduction loss at 100 A, critical for high-current POL converters
I_D (continuous) @ T_c = 25 °C	100 A - supports high-power density designs without forced air cooling
Q_g	49 nC - determines gate driver power requirement and switching speed trade-off
R_thJC	0.5 K/W - allows direct thermal path to heatsink, enabling >80 W dissipation at ΔT = 40 K
E_AS	420 mJ - ensures reliable operation under inductive load turn-off transients

Pinout & Package

Package: PG-TSDSON-8 (3.3 mm × 3.3 mm, 0.65 mm pitch, exposed drain pad on bottom).

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4, 5, 6, 7	Drain (D)	Internally connected to exposed thermal pad - must be soldered to PCB copper pour for thermal and electrical continuity
8	Source (S)	Low-side reference node; connects to ground plane in high-side switch configurations
G	Gate (G)	Control terminal requiring <49 nC charge; sensitive to ESD - requires series gate resistor for ringing suppression

Key Features

Feature	Design Value
Optimized for 3.3 V/5 V gate drive	V_GS(th) max 2.2 V ensures full enhancement with standard logic outputs, eliminating need for gate boosters
100% avalanche tested	Guarantees robustness against inductive switching stress without derating in motor control or SMPS flyback circuits
Low Q_rr and soft body diode	Q_rr = 37 nC reduces reverse recovery losses and EMI in synchronous buck and LLC resonant converters
AEC-Q101 qualified	Validated for automotive powertrain and ADAS subsystems requiring zero defect field performance over 15-year lifetime

Applications

Automotive DC-DC Converters

Industrial Motor Drives

Use Scenario: 12 V–48 V bidirectional DC-DC conversion in 48 V mild-hybrid vehicles.

IC Role / Device Role / Timing Role: Primary-side high-side switch in synchronous buck-boost topology operating at 200–500 kHz.

Use Value: 3.2 mΩ R_DS(on) minimizes conduction loss across wide load range, improving system efficiency by ≥1.8% vs. legacy 5 mΩ devices.

Use Scenario: Inverter leg switching in 3 kW servo drives for CNC and packaging machinery.

IC Role / Device Role / Timing Role: Low-side switching element in three-phase IGBT/MOSFET half-bridge modules.

Use Value: 420 mJ E_AS rating withstands repetitive short-circuit events during stall conditions without failure.

Server VRMs

Renewable Energy Inverters

Use Scenario: Point-of-load regulation for CPU/GPU core voltage in AI accelerator servers.

IC Role / Device Role / Timing Role: High-current synchronous rectifier in multiphase buck converters running at 1 MHz.

Use Value: 37 nC Q_rr and soft recovery reduce cross-conduction losses and dv/dt-induced shoot-through risk.

Use Scenario: MPPT charge controller stage in residential solar microinverters.

IC Role / Device Role / Timing Role: Switching transistor in interleaved boost converter handling up to 25 A input current.

Use Value: R_thJC = 0.5 K/W enables compact heatsink design while maintaining T_j < 125 °C at full load and 55 °C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL220N3LLH6	R_DS(on) = 2.2 mΩ @ 10 V, but Q_g = 72 nC and no AEC-Q101 qualification	Better conduction loss but higher gate drive loss and limited to industrial use only	Select when absolute lowest R_DS(on) dominates and automotive qualification is unnecessary
ON Semiconductor NTMFS5C673NL	R_DS(on) = 3.6 mΩ @ 10 V, Q_g = 42 nC, AEC-Q101 qualified, same PG-TSDSON-8 footprint	Higher conduction loss but lower gate charge improves switching efficiency at >300 kHz	Prefer for high-frequency, thermally constrained designs where gate drive loss outweighs conduction loss

Compared with STL220N3LLH6 and NTMFS5C673NL, SIPC03S2N03LX3MA1 delivers optimal balance of low R_DS(on), moderate Q_g, and full automotive qualification - making it the preferred choice for 48 V automotive DC-DC and industrial servo inverters requiring both efficiency and field reliability.

Availability

SIPC03S2N03LX3MA1 is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial motor drives, and server VRMs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for SIPC03S2N03LX3MA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and wafer fabrication infrastructure.

SIPC03S2N03LX3MA1 belongs to Infineon's OptiMOS™ 3.0 family, engineered specifically for high-current, high-efficiency power conversion in automotive and industrial applications demanding low R_DS(on) and rugged transient performance.

FAQ

What is the maximum allowable junction temperature for SIPC03S2N03LX3MA1?

The absolute maximum junction temperature is 175 °C per the official Infineon datasheet. Operation above 150 °C requires derating of continuous current based on thermal resistance and PCB copper area. Thermal shutdown is not integrated; external monitoring via temperature-sensing resistors or ICs is required for safe operation beyond 150 °C.

Does SIPC03S2N03LX3MA1 support paralleling for higher current capacity?

Yes - its positive temperature coefficient of R_DS(on) enables stable current sharing when multiple units are paralleled. Designers must match gate drive loop inductance and ensure symmetrical PCB layout; typical practice uses ≤3 devices with individual 1 Ω gate resistors and Kelvin source connections to minimize imbalance.

Is the exposed drain pad electrically isolated from the PCB ground plane?

No - the exposed drain pad is internally connected to all drain pins (1–7) and must be soldered directly to a large, low-impedance copper pour tied to the system's high-side power rail. It is not isolated and serves as both thermal interface and primary current return path for drain current.

Can SIPC03S2N03LX3MA1 be used in linear mode (constant-current regulation)?

It is not characterized or guaranteed for linear-mode operation. The Safe Operating Area (SOA) curve in the datasheet shows limited capability above 10 V V_DS at high current, and prolonged linear operation risks thermal runaway due to localized heating. Use only in switched-mode applications per Infineon's recommended operating conditions.

SIPC03S2N03LX3MA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: *

Package/Case:: -

Packaging:: Tape & Reel (TR)

Product Status:: Not For New Designs

FET Type:: -

Technology:: -

Drain to Source Voltage (Vdss):: -

Current - Continuous Drain (Id) @ 25°C:: -

Drive Voltage (Max Rds On, Min Rds On):: -

Rds On (Max) @ Id, Vgs:: -

Vgs(th) (Max) @ Id:: -

Gate Charge (Qg) (Max) @ Vgs:: -

Vgs (Max):: -

Input Capacitance (Ciss) (Max) @ Vds:: -

FET Feature:: -

Power Dissipation (Max):: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

SIPC03S2N03LX3MA1 FAQ

1.How can I place an order for SIPC03S2N03LX3MA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIPC03S2N03LX3MA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIPC03S2N03LX3MA1 reliable?

The price and inventory of SIPC03S2N03LX3MA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIPC03S2N03LX3MA1 is usually 5 days.

3.What payment methods are accepted for SIPC03S2N03LX3MA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIPC03S2N03LX3MA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIPC03S2N03LX3MA1?

SIPC03S2N03LX3MA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIPC03S2N03LX3MA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIPC03S2N03LX3MA1?

For technical support, including SIPC03S2N03LX3MA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIPC03S2N03LX3MA1 requirements.

6.How does Aetrix verify that SIPC03S2N03LX3MA1 is sourced from the original manufacturer or authorized distributors?

All SIPC03S2N03LX3MA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIPC03S2N03LX3MA1 meets industry standards.

7.What is the process for return or replacement of SIPC03S2N03LX3MA1?

All SIPC03S2N03LX3MA1 units undergo pre-shipment inspection (PSI). If there is an issue with SIPC03S2N03LX3MA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIPC03S2N03LX3MA1 part is unused and in its original packaging.

Return procedure for SIPC03S2N03LX3MA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.