Vishay General Semiconductor - Diodes Division SMBG30C-E3/5B
- Part No.:
- SMBG30C-E3/5B
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG30C-E3/5B.pdf
- Description:
- TVS DIODE 30VWM 53.5VC DO215AA
- Quantity:
- Payment:

- Shipping:

Inventory:3,602
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMBG30C-E3/5B from Vishay General Semiconductor is a bi-directional transient voltage suppressor (TVS) diode in DO-215AA (SMBG) package, designed for clamping voltage transients on signal or power lines. It features 30 V stand-off voltage (VWM), 48.4 V maximum clamping voltage (VC) at 12.4 A peak pulse current, and 600 W peak pulse power rating with 10/1000 µs waveform - used to protect automotive sensor interfaces and industrial I/O lines against ESD and inductive switching surges.
For engineers reviewing the SMBG30C-E3/5B datasheet, SMBG30C-E3/5B pinout, SMBG30C-E3/5B application, or SMBG30C-E3/5B equivalent, key selection criteria include bi-directional clamping capability, AEC-Q101 qualification, RoHS-compliant matte tin terminals, MSL Level 1 moisture sensitivity, and compatibility with automated SMT placement on 5.0 mm × 5.0 mm copper pads.
Technical Context
This bi-directional TVS operates symmetrically in both polarities, with breakdown voltage (VBR) specified at 33.3–36.8 V (min/max) under 1 mA test current, and reverse leakage ≤1.0 µA at 30 V stand-off. Its clamping response is characterized by low incremental surge resistance and sub-nanosecond turn-on time, enabling effective suppression of fast transients such as ISO 7637-2 pulses and IEC 61000-4-2 ESD events.
Thermal performance is defined by junction-to-ambient thermal resistance (RθJA) of 100 °C/W and junction-to-lead (RθJL) of 20 °C/W, supporting operation from –55 °C to +150 °C. The device meets AEC-Q101 stress testing requirements and is rated for repetitive surge duty cycle ≤0.01 %.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 30 V - Maximum continuous reverse operating voltage before clamping begins; defines safe working range for protected line. |
| VBR (min/max) | 33.3 V / 36.8 V at 1 mA - Ensures reliable conduction onset above normal operating voltage with margin against false triggering. |
| VC @ IPPM | 48.4 V at 12.4 A - Clamped voltage during 10/1000 µs surge; determines maximum stress imposed on downstream ICs. |
| PPPM | 600 W - Peak pulse power handling capacity; supports robust protection against high-energy transients like load dump spikes. |
| Junction Temp Range | –55 °C to +150 °C - Enables deployment in under-hood automotive and industrial environments without derating. |
| Moisture Sensitivity | MSL Level 1 (per J-STD-020) - No floor life limitation; compatible with standard reflow profiles up to 260 °C peak. |
| AEC-Q101 Qualified | Yes - Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD testing per AEC specification. |
Pinout & Package
Package: DO-215AA (SMBG), surface-mount gull-wing lead frame with matte tin-plated terminals solderable per J-STD-020 and JESD 22-B102. Bi-directional construction means no polarity marking; cathode band absent.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode/Cathode (symmetrical) | Transient conduction path | Bi-directional terminals conduct equally in either polarity; connects across protected line and ground or between differential lines. |
| Case (exposed pad) | Thermal and mechanical interface | Not electrically connected; provides thermal path to PCB copper and mechanical anchoring during reflow. |
Key Features
| Feature | Design Value |
|---|---|
| 600 W peak pulse power (10/1000 µs) | Enables protection against high-energy transients such as ISO 7637-2 Pulse 5a (load dump) in 12 V automotive systems. |
| AEC-Q101 qualified | Validates suitability for automotive applications including engine control units, ADAS sensors, and body electronics modules. |
| Glass passivated junction | Improves long-term stability and reduces parameter drift under thermal cycling and humidity exposure. |
| Low profile DO-215AA package | 0.235–0.255 inch length enables compact layout on space-constrained PCBs while maintaining 5.0 mm × 5.0 mm thermal pad area. |
| RoHS-compliant, whisker-tested (JESD 201 Class 1A) | Ensures solder joint integrity and compliance with environmental regulations for global automotive and industrial markets. |
Applications
| Automotive Sensor Protection | Industrial I/O Interface |
|---|---|
|
Use Scenario: Protecting CAN, LIN, or analog sensor outputs (e.g., pressure, temperature) from ESD and inductive kickback in vehicle ECUs. IC Role / Device Role / Timing Role: Bi-directional clamping element placed between signal line and chassis ground to limit transient overvoltage. Use Value: Limits clamped voltage to ≤48.4 V during 12.4 A surge, preventing damage to 3.3 V or 5 V interface ICs with ±15 kV ESD immunity requirement. |
Use Scenario: Safeguarding PLC digital input channels exposed to relay coil flyback and motor drive noise in factory automation. IC Role / Device Role / Timing Role: Standoff protector across dry-contact inputs or optocoupler front-end to absorb repetitive 600 W surges. Use Value: Maintains 30 V stand-off while clamping to 48.4 V, ensuring compatibility with 24 V nominal industrial logic levels and avoiding false triggering. |
| Telecom Line Interface | Consumer Power Adapter Input |
|
Use Scenario: Transient suppression on Ethernet PHY differential pairs or RS-485 bus lines subject to lightning-induced surges. IC Role / Device Role / Timing Role: Symmetrical shunt device placed across twisted-pair lines to equalize voltage excursion during common-mode transients. Use Value: Bi-directional behavior ensures identical clamping in both directions, preserving signal integrity on balanced interfaces without polarity dependency. |
Use Scenario: Secondary-side overvoltage protection in AC/DC adapters for smart home devices, limiting surge propagation to USB or DC output rails. IC Role / Device Role / Timing Role: Final-stage clamp after rectification and bulk capacitance, absorbing residual switching spikes and ESD events. Use Value: 600 W rating and 48.4 V clamping allow safe operation with 5 V or 12 V regulated outputs, meeting UL 1449 Type 4 secondary surge protection requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMBJ30CA | Same VWM (30 V), identical DO-214AA (SMB) package but slightly higher VC (48.8 V @ 12.3 A); lower thermal resistance (RθJA = 85 °C/W). | Preferred where board space allows larger footprint or where tighter thermal management is required. | Select SMBJ30CA if PCB layout permits SMB package and lower junction temperature rise is critical. |
| SMCJ30CA | Same VWM and bi-directionality, but in larger DO-214AB (SMC) package with 1500 W PPPM; VC = 48.4 V @ 24.9 A. | Used when higher surge energy absorption (e.g., ISO 16750-2 long-duration pulses) is required beyond 600 W. | Choose SMCJ30CA only when system-level surge testing exceeds 600 W capability and board space accommodates larger SMC outline. |
Compared with SMBG30C-E3/5B, SMBJ30CA offers marginally better thermal performance in a functionally equivalent package, while SMCJ30CA trades size for 2.5× higher surge capacity - making SMBG30C-E3/5B optimal for space-constrained AEC-Q101 applications needing precise 600 W compliance.
Availability
SMBG30C-E3/5B is available at Aetrix Electronics and suitable for automotive sensor protection, industrial I/O hardening, and telecom line interface applications requiring stable component supply, AEC-Q101 qualification, and RoHS-compliant manufacturing traceability.
Supply support for SMBG30C-E3/5B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, MOSFETs, optoelectronics, and passive components with emphasis on reliability and automotive-grade validation.
The SMBG series was developed specifically for high-reliability surface-mount transient suppression in automotive and industrial environments, balancing compact size, AEC-Q101 compliance, and repeatable clamping performance under thermal stress.
FAQ
What is the polarity configuration of SMBG30C-E3/5B?
SMBG30C-E3/5B is a bi-directional TVS diode with symmetrical anode/cathode terminals and no polarity marking. Unlike uni-directional variants (e.g., SMBG30A), it conducts identically in both directions, making it suitable for AC-coupled or differential signal lines where voltage polarity reverses. This eliminates orientation concerns during automated placement.
Does SMBG30C-E3/5B meet AEC-Q101 requirements?
Yes, SMBG30C-E3/5B is explicitly AEC-Q101 qualified per Vishay documentation (Document Number 88456, Revision 12-Nov-12). It undergoes stress testing including temperature cycling, high-temperature reverse bias (HTRB), and ESD per AEC-Q101 standards, confirming suitability for automotive under-hood and cabin applications.
What is the maximum clamping voltage for SMBG30C-E3/5B under surge conditions?
The maximum clamping voltage (VC) for SMBG30C-E3/5B is 48.4 V at 12.4 A peak pulse current (IPPM) with a 10/1000 µs waveform. This value is measured per ANSI/IEEE C62.35 and defines the upper voltage limit imposed on protected circuitry during standardized surge events.
How does the DO-215AA (SMBG) package differ from DO-214AA (SMB)?
The DO-215AA (SMBG) package used by SMBG30C-E3/5B has gull-wing leads with tighter pitch and lower profile than DO-214AA (SMB). Key differences include smaller body dimensions (0.235–0.255″ length vs. 0.276″ for SMB) and optimized thermal pad layout for 5.0 mm × 5.0 mm copper areas, enabling higher density layouts without sacrificing thermal performance.
Is SMBG30C-E3/5B compatible with lead-free reflow processes?
Yes, SMBG30C-E3/5B is rated for lead-free reflow with a maximum peak temperature of 260 °C per J-STD-020, and is classified as MSL Level 1 - meaning it may be stored indefinitely at ambient conditions without baking prior to assembly. Its matte tin-plated terminals comply with J-STD-002 and JESD 22-B102 solderability requirements.
SMBG30C-E3/5B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-215AA, SMB Gull Wing
- Series:
- TransZorb®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 30V
- Voltage - Breakdown (Min):
- 33.3V
- Voltage - Clamping (Max) @ Ipp:
- 53.5V
- Current - Peak Pulse (10/1000µs):
- 11.2A
- Power - Peak Pulse:
- 600W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG30C-E3/5B FAQ
1.How can I place an order for SMBG30C-E3/5B through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG30C-E3/5B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG30C-E3/5B reliable?
The price and inventory of SMBG30C-E3/5B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG30C-E3/5B is usually 5 days.
3.What payment methods are accepted for SMBG30C-E3/5B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG30C-E3/5B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG30C-E3/5B?
SMBG30C-E3/5B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG30C-E3/5B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG30C-E3/5B?
For technical support, including SMBG30C-E3/5B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG30C-E3/5B requirements.
6.How does Aetrix verify that SMBG30C-E3/5B is sourced from the original manufacturer or authorized distributors?
All SMBG30C-E3/5B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG30C-E3/5B meets industry standards.
7.What is the process for return or replacement of SMBG30C-E3/5B?
All SMBG30C-E3/5B units undergo pre-shipment inspection (PSI). If there is an issue with SMBG30C-E3/5B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG30C-E3/5B part is unused and in its original packaging.
Return procedure for SMBG30C-E3/5B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG30C-E3/5B Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

