My Inquiry
My Account
Vishay SMF24A-HE3_A08
- Part No.:
- SMF24A-HE3_A08
- Manufacturer:
- Vishay
- Category:
- TVS Diodes
- Package:
- DO-219AB
- Datasheet:
-
SMF24A-HE3_A08.pdf
- Description:
- ESD PROTECTION DIODE SMF DO219AB
- Quantity:
- Payment:
- Shipping:
Inventory:2,035
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMF24A-HE3_A08 from Vishay Semiconductors is a unidirectional surface-mount ESD protection diode in the SMF (DO-219AB) package, designed for transient voltage suppression in high-speed data lines. It features a 24 V stand-off voltage (VRWM), 38.9 V maximum clamping voltage at 5.1 A peak pulse current, ±30 kV IEC 61000-4-2 ESD immunity, and 200 W peak pulse power (10/1000 μs). It is AEC-Q101 qualified and used in automotive infotainment interfaces.
For engineers reviewing the SMF24A-HE3_A08 datasheet, SMF24A-HE3_A08 pinout, SMF24A-HE3_A08 application, or SMF24A-HE3_A08 equivalent, key selection criteria include clamping voltage under 40 V at rated IPPM, low capacitance (244 pF at 0 V), AEC-Q101 qualification, SOD-123W-compatible footprint, and DO-219AB package thermal performance (RthJA = 180 K/W).
Technical Context
This device operates as a unidirectional TVS diode with avalanche breakdown behavior, optimized for fast response to ESD transients via low-noise silicon junction technology. Its 1-pin cathode configuration enables simple series placement on signal lines, and its low incremental surge resistance ensures minimal voltage overshoot during clamping.
The SMF24A-HE3_A08 is specified for operation across -65 °C to +175 °C, supports wave and reflow soldering per J-STD-020 MSL level 1, and maintains stable reverse leakage (<0.1 μA at VRWM) and clamping performance up to TJ = 175 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage (VRWM) | 24 V - Maximum continuous reverse operating voltage before significant leakage begins; defines signal line voltage margin. |
| Clamping Voltage (VC) | 38.9 V max at IPPM = 5.1 A - Peak voltage seen by protected circuit during 10/1000 μs surge; critical for IC input stage safety. |
| Peak Pulse Power (PPP) | 200 W (10/1000 μs) - Transient energy handling capacity; sufficient for IEC 61000-4-5 Level 3 surges. |
| Capacitance (CD) | 244 pF at VR = 0 V, f = 1 MHz - Impacts high-frequency signal integrity; suitable for USB 2.0 and CAN FD lines. |
| ESD Rating | ±30 kV contact/air per IEC 61000-4-2 - Meets automotive and industrial ESD immunity requirements without external shielding. |
| Package | DO-219AB (SOD-123W compatible) - 3.9 mm × 1.9 mm × 1.08 mm low-profile outline; enables dense PCB layouts and automated assembly. |
| AEC-Q101 Qualified | Yes - Validated for automotive applications including infotainment, body control, and ADAS sensor interfaces. |
Pinout & Package
SMF24A-HE3_A08 uses the DO-219AB (SMF) package: molded, surface-mount, single-diode configuration with cathode marking bar. Dimensions: 3.9 mm length × 1.9 mm width × 1.08 mm height. Compatible with SOD-123W footprint and reflow profiles up to 260 °C peak.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Signal line input / protected side | Connected to the vulnerable trace (e.g., USB D+); conducts during forward surge events. |
| Cathode | Ground reference / clamp node | Connected to chassis or system ground; provides low-impedance path for transient current during reverse-biased ESD events. |
Key Features
| Feature | Design Value |
|---|---|
| Low clamping voltage | 38.9 V max at 5.1 A ensures downstream logic ICs (e.g., 3.3 V or 5 V microcontrollers) remain within absolute maximum ratings during ESD strikes. |
| Fast response time | Sub-nanosecond turn-on enabled by "Low Noise" silicon junction design minimizes voltage overshoot before clamping engages. |
| AEC-Q101 qualification | Validated for automotive temperature cycling, mechanical shock, and humidity testing-enables drop-in use in vehicle ECUs without additional qualification. |
| Reflow/wave solder compatible | Rated for peak reflow temperature of 260 °C (MSL level 1) and standard wave solder profiles-supports high-volume manufacturing without derating. |
| Low profile packaging | 1.08 mm height allows integration beneath connectors and in space-constrained modules such as telematics antennas and camera modules. |
Applications
| Automotive Infotainment Interface | Industrial CAN FD Bus Node |
|---|---|
Use Scenario: Protecting USB 2.0 and HDMI data lines in head unit display modules against ESD from user interaction and cable hot-plug events. IC Role / Device Role / Timing Role: Unidirectional transient voltage suppressor placed in series between connector and PHY IC, clamping surges before they reach sensitive SerDes inputs. Use Value: 244 pF capacitance avoids signal degradation at 480 Mbps; ±30 kV ESD rating eliminates need for secondary shielding layers. | Use Scenario: Safeguarding CAN FD transceivers in programmable logic controllers exposed to factory floor ESD and inductive switching noise. IC Role / Device Role / Timing Role: Standoff-clamp TVS diode connected between CANH/CANL and ground, limiting common-mode transients while preserving bus differential signaling integrity. Use Value: 24 V VRWM matches typical CAN FD supply rails; 38.9 V VC prevents transceiver latch-up during 10/1000 μs surges. |
| Medical Sensor Hub Interface | Consumer IoT Wireless Module |
Use Scenario: Shielding analog front-end inputs (e.g., ECG electrode traces) in portable diagnostic devices from electrostatic discharge during clinical handling. IC Role / Device Role / Timing Role: Low-leakage (0.1 μA max) unidirectional clamp that remains transparent during DC-coupled signal acquisition, activating only during >24 V transients. Use Value: 175 °C max junction temperature supports sterilization cycles; DO-219AB package withstands repeated rework without delamination. | Use Scenario: Protecting Wi-Fi/BLE antenna feedlines and button inputs in smart home sensors subjected to human-body-model ESD in residential environments. IC Role / Device Role / Timing Role: Primary ESD shunt on board-level I/O paths, placed adjacent to connectors to minimize inductance and maximize clamping effectiveness. Use Value: 200 W pulse power rating handles multiple consecutive discharges; RoHS-compliant tin terminations ensure long-term solder joint reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ24A-E3/57T | DO-214AC (SMA) package; larger footprint (4.5 mm × 2.7 mm); higher RthJA (200 K/W); same VRWM/VC specs. | Less suitable for ultra-dense layouts; lower thermal efficiency in sealed enclosures. | Choose when legacy SMA footprint compatibility is required and board space permits. |
| TPD2E001DRYR | 2-channel, bidirectional, 15 pF @ 0 V; lower clamping (12 V at 1 A); not AEC-Q101 qualified. | Targeted at low-capacitance USB/MIPI lines-not appropriate for high-energy CAN or automotive power-domain protection. | Prefer for high-speed digital interfaces where capacitance <20 pF is mandatory; avoid for automotive under-hood use. |
Compared with SMAJ24A-E3/57T and TPD2E001DRYR, the SMF24A-HE3_A08 delivers optimal balance of compact DO-219AB packaging, AEC-Q101 compliance, and robust 200 W surge handling-making it the preferred choice for next-generation automotive and industrial edge nodes requiring both miniaturization and qualification rigor.
Availability
SMF24A-HE3_A08 is available at Aetrix Electronics and suitable for automotive infotainment interfaces, industrial CAN FD bus nodes, and medical sensor hub interfaces requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for SMF24A-HE3_A08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and passive components for automotive, industrial, and computing markets.
The SMF series targets high-speed, space-constrained ESD protection applications-designed specifically to meet AEC-Q101 requirements while maintaining low capacitance and tight clamping performance for modern serial interfaces.
FAQ
What is the maximum clamping voltage of the SMF24A-HE3_A08 under standard test conditions?
The SMF24A-HE3_A08 has a maximum clamping voltage (VC) of 38.9 V when subjected to a 10/1000 μs surge waveform at its rated peak pulse current of 5.1 A. This value is measured per IEC 61000-4-5 and ensures protected circuits remain within safe operating limits. The SMF24A-HE3_A08 achieves this performance using a low-resistance silicon junction optimized for fast transient response.
Is the SMF24A-HE3_A08 qualified for automotive applications?
Yes, the SMF24A-HE3_A08 is AEC-Q101 qualified, having passed stress tests including temperature cycling, mechanical shock, and humidity exposure required for automotive electronic control units. Its operating temperature range of -65 °C to +175 °C and DO-219AB package robustness make it suitable for under-hood and cabin-mounted systems. The SMF24A-HE3_A08 is explicitly listed in Vishay's AEC-Q101 qualified product matrix.
What is the capacitance of the SMF24A-HE3_A08 at zero bias, and how does it affect high-speed signal lines?
The SMF24A-HE3_A08 exhibits a typical capacitance of 244 pF at 0 V reverse bias and 1 MHz frequency. This value is well-suited for USB 2.0 (480 Mbps) and CAN FD (up to 5 Mbps) interfaces, where signal integrity is maintained without excessive rise-time degradation. The SMF24A-HE3_A08's capacitance-vs-voltage curve shows monotonic decrease above 5 V, further stabilizing impedance during normal operation.
Does the SMF24A-HE3_A08 support automated PCB assembly processes?
Yes, the SMF24A-HE3_A08 is fully compatible with standard reflow and wave soldering processes. It meets J-STD-020 moisture sensitivity level 1, supports peak reflow temperatures up to 260 °C, and uses tin-plated terminations compliant with RoHS. Its DO-219AB package geometry and tape-and-reel packaging (3K per 7″ reel, code A08) enable seamless pick-and-place integration. The SMF24A-HE3_A08 has been validated across IPC-A-610 Class 2 and Class 3 assembly lines.
How does the SMF24A-HE3_A08 compare to older SMAJ-series TVS diodes in terms of board space and thermal performance?
The SMF24A-HE3_A08 occupies ~45 % less PCB area than the SMAJ24A due to its smaller DO-219AB (3.9 mm × 1.9 mm) versus DO-214AC (4.5 mm × 2.7 mm) footprint. Its thermal resistance (RthJA = 180 K/W) is also 10 % lower than SMAJ24A's 200 K/W, enabling better power dissipation in thermally constrained modules. The SMF24A-HE3_A08 thus delivers superior density and thermal efficiency without sacrificing electrical performance.
SMF24A-HE3_A08 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay
- Package/Case:
- DO-219AB
- Series:
- eSMP®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 24V
- Voltage - Breakdown (Min):
- 26.7V
- Voltage - Clamping (Max) @ Ipp:
- 38.9V
- Current - Peak Pulse (10/1000µs):
- 5.1A
- Power - Peak Pulse:
- 200W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 244pF @ 1MHz
- Operating Temperature:
- -65°C ~ 175°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AB (SMF)
SMF24A-HE3_A08 FAQ
1.How can I place an order for SMF24A-HE3_A08 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMF24A-HE3_A08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMF24A-HE3_A08 reliable?
The price and inventory of SMF24A-HE3_A08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMF24A-HE3_A08 is usually 5 days.
3.What payment methods are accepted for SMF24A-HE3_A08?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMF24A-HE3_A08 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMF24A-HE3_A08?
SMF24A-HE3_A08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMF24A-HE3_A08 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMF24A-HE3_A08?
For technical support, including SMF24A-HE3_A08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMF24A-HE3_A08 requirements.
6.How does Aetrix verify that SMF24A-HE3_A08 is sourced from the original manufacturer or authorized distributors?
All SMF24A-HE3_A08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMF24A-HE3_A08 meets industry standards.
7.What is the process for return or replacement of SMF24A-HE3_A08?
All SMF24A-HE3_A08 units undergo pre-shipment inspection (PSI). If there is an issue with SMF24A-HE3_A08, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMF24A-HE3_A08 part is unused and in its original packaging.
Return procedure for SMF24A-HE3_A08:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMF24A-HE3_A08 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
