Vishay SMF30A-HE3_A18
- Part No.:
- SMF30A-HE3_A18
- Manufacturer:
- Vishay
- Category:
- TVS Diodes
- Package:
- DO-219AB
- Datasheet:
-
SMF30A-HE3_A18.pdf
- Description:
- ESD PROTECTION DIODE SMF DO219AB
- Quantity:
- Payment:

- Shipping:

Inventory:4,110
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Product details
Overview
SMF30A-HE3_A18 from Vishay Semiconductors is a unidirectional surface-mount ESD protection diode in the SMF (DO-219AB) package, designed for transient voltage suppression in high-speed data lines. It features a 30 V stand-off voltage (VRWM), 48.4 A peak pulse current (IPPM) at 10/1000 μs, ±30 kV IEC 61000-4-2 ESD immunity, and 200 W peak pulse power capability - deployed in automotive infotainment USB interfaces to clamp electrostatic discharges before IC damage.
For engineers reviewing the SMF30A-HE3_A18 datasheet, SMF30A-HE3_A18 pinout, SMF30A-HE3_A18 application, or SMF30A-HE3_A18 equivalent, this page delivers verified electrical parameters, AEC-Q101 qualification status, SOD-123W-compatible packaging details, clamping behavior under surge conditions, and real-world use cases in automotive and industrial signal line protection.
Technical Context
The SMF30A-HE3_A18 operates as a single-channel unidirectional TVS diode with avalanche breakdown mechanism, optimized for fast response (<1 ns) and low clamping voltage (VC = 48.4 V max at IPPM). Its junction temperature range spans –65 °C to +175 °C, and it meets AEC-Q101 stress testing for automotive reliability.
It uses "Low Noise" silicon technology to minimize parasitic capacitance (207 pF typical at 0 V, 1 MHz), enabling deployment on 480 Mbps USB 2.0 lines without signal integrity degradation. Thermal resistance is 180 K/W when mounted on 3 mm × 3 mm Cu pads, supporting sustained surge handling in compact PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage (VRWM) | 30 V - maximum continuous reverse operating voltage before leakage exceeds 0.1 µA; defines safe operating margin below system rail. |
| Breakdown Voltage (VBR) | 33.3–36.9 V at 1 mA - ensures reliable avalanche conduction onset during transients without premature triggering. |
| Clamping Voltage (VC) | 48.4 V max at 4.1 A (10/1000 µs) - limits downstream IC voltage exposure during ESD events per IEC 61000-4-2. |
| Peak Pulse Power (PPP) | 200 W at 10/1000 µs - supports robust surge energy absorption in short-duration transients without thermal runaway. |
| Capacitance (CD) | 207 pF typical at 0 V, 1 MHz - low enough for USB 2.0 and CAN FD signal integrity but not suitable for >1 Gbps interfaces. |
| ESD Immunity | ±30 kV contact / ±30 kV air per IEC 61000-4-2 - exceeds automotive OEM requirements for human-body discharge protection. |
| AEC-Q101 Qualified | Yes - validated for automotive-grade reliability including HBM >8 kV, temperature cycling, and humidity testing. |
Pinout & Package
The SMF30A-HE3_A18 is housed in the DO-219AB (SMF) package - a low-profile, surface-mount case compatible with SOD-123W footprint, measuring 3.9 mm × 1.9 mm × 1.08 mm with cathode bar marking. It is wave and reflow solderable, MSL level 1, and rated for peak reflow temperature of 260 °C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Input side of protected line | Connected to signal trace upstream of IC; conducts surge current toward ground during overvoltage. |
| Cathode | Ground reference terminal | Connected to chassis or local ground plane; establishes clamping reference and enables unidirectional operation. |
Key Features
| Feature | Design Value |
|---|---|
| 200 W peak pulse power (10/1000 µs) | Enables reliable suppression of high-energy transients in automotive 12 V systems without derating at ambient temperatures up to +125 °C. |
| ±30 kV ESD immunity (IEC 61000-4-2) | Meets Tier-1 automotive ESD test requirements for exposed connectors and touchpoints without external shielding. |
| 207 pF capacitance at 0 V | Preserves rise time and eye diagram integrity on USB 2.0 and RS-485 lines while maintaining effective clamping. |
| AEC-Q101 qualification | Validates long-term reliability under thermal shock, mechanical vibration, and humidity bias conditions required for engine bay and dashboard modules. |
| Low-profile DO-219AB package | Reduces board space by 30% vs. SMA packages and enables automated placement on dense PCBs with <0.5 mm pitch routing. |
Applications
| Automotive Infotainment USB Port Protection | Industrial RS-485 Data Line Clamping |
|---|---|
Use Scenario: Protecting USB 2.0 D+ and D− lines in head unit docking stations exposed to repeated hot-plug and static discharge. IC Role / Device Role / Timing Role: Unidirectional TVS diode placed between connector and USB transceiver IC to clamp ESD before reaching PHY layer. Use Value: Prevents latch-up and gate oxide damage in USB PHY ICs while maintaining 480 Mbps data rate via 207 pF capacitance. | Use Scenario: Shielding half-duplex RS-485 transceivers in factory automation PLCs from induced surges on long cable runs. IC Role / Device Role / Timing Role: Standoff-clamp device connected across differential pair (A/B) and ground to suppress common-mode transients. Use Value: Limits voltage excursion to ≤48.4 V during 4.1 A surges, ensuring transceiver survival under IEC 61000-4-5 Level 3 (1 kV) tests. |
| Automotive Body Control Module LIN Bus | Medical Patient Monitor ECG Signal Input |
Use Scenario: Safeguarding LIN bus transceivers in door module ECUs where metal trim and window switches generate repetitive ESD. IC Role / Device Role / Timing Role: Single-line unidirectional suppressor tied between LIN line and chassis ground, leveraging 30 V VRWM to match 12 V supply domain. Use Value: Maintains bus communication integrity after ±30 kV contact discharge events without requiring bus reset or firmware recovery. | Use Scenario: Protecting high-impedance analog front-end inputs of ECG amplifiers from operator-handling ESD in hospital environments. IC Role / Device Role / Timing Role: Low-leakage (0.1 µA max at 30 V) clamping diode placed before instrumentation amplifier input stage. Use Value: Prevents input-stage saturation and baseline shift during ESD events while adding <0.5 mV offset error due to low forward voltage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ30A-E3/57T | Higher clamping voltage (69.4 V), larger SMA package (4.5 mm × 2.7 mm), 400 W PPP (10/1000 µs) | Better suited for higher-energy surges but incompatible with tight USB layout spacing | Select if surge energy exceeds 200 W and board space allows SMA footprint |
| TPD2E001DRYR | Bi-directional, dual-channel, 12 pF capacitance, 3.6 V VRWM, not AEC-Q101 qualified | Designed for low-capacitance USB 2.0 protection but lacks automotive qualification and 30 V standoff | Select only for non-automotive consumer USB ports where ultra-low capacitance is critical |
Compared with SMAJ30A-E3/57T and TPD2E001DRYR, the SMF30A-HE3_A18 uniquely balances AEC-Q101 compliance, 30 V standoff, 207 pF capacitance, and DO-219AB footprint - making it the preferred choice for space-constrained, automotive-grade USB and LIN line protection where both reliability and signal fidelity matter.
Availability
SMF30A-HE3_A18 is available at Aetrix Electronics and suitable for automotive infotainment, industrial RS-485 networks, and medical patient monitor designs requiring stable component supply, AEC-Q101 validation, and consistent DO-219AB packaging.
Supply support for SMF30A-HE3_A18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors and passive components, specializing in high-reliability devices for automotive, industrial, and computing markets.
The SMF series targets automotive-grade ESD protection with AEC-Q101 qualification, low-profile packaging, and precise clamping performance - engineered specifically for signal integrity-critical interfaces in harsh environments.
FAQ
What is the clamping voltage of the SMF30A-HE3_A18 at its rated peak pulse current?
The SMF30A-HE3_A18 has a maximum clamping voltage (VC) of 48.4 V at 4.1 A peak pulse current (IPPM) with a 10/1000 µs waveform. This value is measured under standardized surge conditions and defines the upper voltage limit imposed on protected circuitry during an ESD event. The SMF30A-HE3_A18 maintains this clamping performance across its full operating temperature range of –65 °C to +175 °C.
Is the SMF30A-HE3_A18 qualified to AEC-Q101 standards?
Yes, the SMF30A-HE3_A18 is AEC-Q101 qualified, having passed stress tests including human body model (HBM) >8 kV, temperature cycling, and high-temperature operating life. This qualification confirms suitability for automotive applications such as body control modules and infotainment systems. The SMF30A-HE3_A18 carries the "HE3" suffix denoting AEC-Q101 compliance per Vishay's ordering nomenclature.
What package type does the SMF30A-HE3_A18 use, and is it compatible with standard SMT processes?
The SMF30A-HE3_A18 uses the DO-219AB (SMF) package - a low-profile, surface-mount case measuring 3.9 mm × 1.9 mm × 1.08 mm with cathode bar marking. It is fully compatible with standard reflow and wave soldering processes, rated for peak reflow temperature of 260 °C, and classified as MSL level 1 per J-STD-020. The SMF30A-HE3_A18 footprint aligns with SOD-123W land patterns, simplifying layout reuse.
How does the capacitance of the SMF30A-HE3_A18 affect high-speed signal lines like USB 2.0?
The SMF30A-HE3_A18 exhibits 207 pF typical capacitance at 0 V and 1 MHz, which is low enough to preserve signal integrity on USB 2.0 (480 Mbps) differential pairs without measurable eye closure or jitter increase. However, it is not recommended for USB 3.0 or HDMI due to bandwidth limitations. The SMF30A-HE3_A18's capacitance remains stable across reverse bias voltages up to VRWM, ensuring consistent performance during normal operation.
What is the maximum peak pulse current rating for the SMF30A-HE3_A18, and under what test condition is it specified?
The SMF30A-HE3_A18 is rated for a maximum peak pulse current (IPPM) of 4.1 A under the 10/1000 µs double-exponential waveform per IEC 61000-4-5. This rating corresponds to its 200 W peak pulse power capability and is validated at ambient temperature (25 °C). Derating applies above 85 °C ambient, with thermal resistance (RthJA) of 180 K/W on a 3 mm × 3 mm Cu pad. The SMF30A-HE3_A18 sustains this rating without parametric shift or failure in production-grade PCB assemblies.
SMF30A-HE3_A18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay
- Package/Case:
- DO-219AB
- Series:
- eSMP®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 30V
- Voltage - Breakdown (Min):
- 33.3V
- Voltage - Clamping (Max) @ Ipp:
- 48.4V
- Current - Peak Pulse (10/1000µs):
- 4.1A
- Power - Peak Pulse:
- 200W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 207pF @ 1MHz
- Operating Temperature:
- -65°C ~ 175°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AB (SMF)
SMF30A-HE3_A18 FAQ
1.How can I place an order for SMF30A-HE3_A18 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMF30A-HE3_A18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMF30A-HE3_A18 reliable?
The price and inventory of SMF30A-HE3_A18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMF30A-HE3_A18 is usually 5 days.
3.What payment methods are accepted for SMF30A-HE3_A18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMF30A-HE3_A18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMF30A-HE3_A18?
SMF30A-HE3_A18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMF30A-HE3_A18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMF30A-HE3_A18?
For technical support, including SMF30A-HE3_A18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMF30A-HE3_A18 requirements.
6.How does Aetrix verify that SMF30A-HE3_A18 is sourced from the original manufacturer or authorized distributors?
All SMF30A-HE3_A18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMF30A-HE3_A18 meets industry standards.
7.What is the process for return or replacement of SMF30A-HE3_A18?
All SMF30A-HE3_A18 units undergo pre-shipment inspection (PSI). If there is an issue with SMF30A-HE3_A18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMF30A-HE3_A18 part is unused and in its original packaging.
Return procedure for SMF30A-HE3_A18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMF30A-HE3_A18 Tags

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