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Vishay General Semiconductor - Diodes Division SMF6V0A-HE3-08

Part No.:
SMF6V0A-HE3-08
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
DO-219AB
Datasheet:
AetrixSMF6V0A-HE3-08.pdf
Description:
TVS DIODE 6VWM 10.3VC DO219AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,015

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Product details

Overview

SMF6V0A-HE3-08 from Vishay Semiconductors is a unidirectional surface-mount ESD protection diode in the SMF (DO-219AB) package, designed for low-capacitance transient voltage suppression in high-speed data lines. It features a 6 V stand-off voltage (VRWM), 10.3 V maximum clamping voltage at 19.4 A peak pulse current, ±30 kV IEC 61000-4-2 ESD immunity, and 200 W peak pulse power (10/1000 μs). It is widely used in USB 2.0, HDMI, and industrial sensor interfaces requiring robust electrostatic discharge protection.

For engineers reviewing the SMF6V0A-HE3-08 datasheet, SMF6V0A-HE3-08 pinout, SMF6V0A-HE3-08 application, or SMF6V0A-HE3-08 equivalent, this page delivers verified electrical parameters, AEC-Q101 qualification status, SOD-123W-compatible packaging details, and real-world use cases - all aligned with Vishay's Rev. 2.4 specification (Document #85881, Jul 2023).

Technical Context

This device operates as a single-channel, unidirectional TVS diode optimized for fast response (<1 ns) and low clamping voltage to protect sensitive downstream ICs. Its junction capacitance of 1063 pF at 0 V enables compatibility with moderate-speed digital interfaces without signal integrity degradation.

The SMF6V0A-HE3-08 uses silicon avalanche technology with "Low Noise" design for minimal parasitic inductance and stable clamping under repetitive ESD events. It meets AEC-Q101 stress requirements including H3B-class human body model (>8 kV) and supports wave/reflow soldering per J-STD-020 MSL level 1.

Key Specifications

ParameterValue and Actual Design Meaning
Stand-off Voltage (VRWM)6 V - Maximum continuous reverse operating voltage before clamping begins; sets minimum system operating margin.
Clamping Voltage (VC)10.3 V at IPPM = 19.4 A - Peak voltage seen by protected circuit during worst-case 10/1000 μs surge; critical for IC survival.
Peak Pulse Power (PPP)200 W (10/1000 μs) - Sustains short-duration transients without failure; defines energy-handling capability.
ESD Immunity±30 kV contact / ±30 kV air (IEC 61000-4-2) - Meets highest industrial and automotive ESD test levels.
Junction Capacitance (CD)1063 pF at VR = 0 V, f = 1 MHz - Low enough for USB 2.0 (480 Mbps) but not suitable for USB 3.x or PCIe Gen3+.
Operating Temperature-65 °C to +175 °C - Supports extended-range industrial, automotive under-hood, and aerospace deployments.
AEC-Q101 QualifiedYes - Validated for automotive electronics per stress test requirements including HTGB, TCT, and HTRB.

Pinout & Package

SMF6V0A-HE3-08 is housed in the DO-219AB (SMF) package - a low-profile, surface-mount case compatible with SOD-123W footprint and reflow soldering. Dimensions: 3.9 mm × 1.9 mm × 1.08 mm (L × W × H), cathode marked by bar on top surface.

Pin/TerminalCircuit RoleDesign Meaning
Anode (Pin 1)Input side of protection pathConnected to signal line being protected; carries surge current into diode during overvoltage event.
Cathode (Pin 2)Clamp reference nodeConnected to ground or common return; establishes clamping threshold relative to reference plane.

Key Features

FeatureDesign Value
Low incremental surge resistanceEnables tight clamping (10.3 V @ 19.4 A) with minimal voltage overshoot during fast transients.
"Low Noise" fast-response technologySub-nanosecond response time ensures clamping activation before ESD energy reaches protected IC inputs.
AEC-Q101 qualificationValidated for automotive-grade reliability across temperature cycling, humidity, and high-temperature bias life tests.
SOD-123W footprint compatibilityAllows drop-in replacement or layout reuse in existing designs using industry-standard SOD-123W land patterns.
MSL Level 1 moisture sensitivityZero bake requirement prior to reflow; supports standard assembly processes without special handling.

Applications

USB 2.0 Interface ProtectionHDMI Signal Line Protection

Use Scenario: Protecting D+ and D- lines in embedded host/device USB ports against ESD events during hot-plug or handling.

IC Role / Device Role / Timing Role: Unidirectional TVS diode placed between signal line and ground to clamp transients while preserving DC bias and signal integrity.

Use Value: Maintains 480 Mbps data rate with <1063 pF loading and limits voltage to ≤10.3 V during ±30 kV ESD strikes.

Use Scenario: Safeguarding TMDS clock and data channels in consumer displays and set-top boxes exposed to user-accessible connectors.

IC Role / Device Role / Timing Role: Standoff-clamp TVS element on each differential pair, referenced to chassis or analog ground.

Use Value: Prevents latch-up or gate oxide damage in HDMI receiver ICs while meeting IEC 61000-4-2 compliance without degrading rise/fall times.

Industrial Sensor InterfaceAutomotive Body Control Module (BCM)

Use Scenario: Shielding analog and digital I/O lines of pressure, temperature, or proximity sensors in factory automation equipment.

IC Role / Device Role / Timing Role: Primary ESD shunt on sensor bus lines (e.g., I²C, RS-485 stubs) operating up to 175 °C ambient.

Use Value: Ensures uninterrupted operation after repeated ESD exposure in unshielded industrial environments with no parameter drift.

Use Scenario: Protecting LIN bus or switch input lines in door modules, lighting controls, or mirror actuators subject to harsh automotive environments.

IC Role / Device Role / Timing Role: AEC-Q101-qualified unidirectional suppressor on low-speed control signals interfacing microcontrollers.

Use Value: Delivers validated reliability over full automotive temperature range (-40 °C to +125 °C case) and passes vehicle-level ESD testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SMAJ6.0AHigher clamping voltage (10.5 V @ 21.1 A); SMA package (larger footprint, higher inductance)Less suitable for high-speed data lines due to ~15% higher capacitance and slower responsePrefer SMF6V0A-HE3-08 where board space and signal integrity are constrained.
TPD2E001DRYRLower capacitance (11 pF), dual-channel, integrated ESD array; requires external bias for some configurationsDesigned for ultra-high-speed interfaces (USB 3.0, DisplayPort); not rated for 200 W pulse powerSelect SMF6V0A-HE3-08 when high-energy surge immunity (200 W) and AEC-Q101 qualification are mandatory.

Compared with SMAJ6.0A and TPD2E001DRYR, the SMF6V0A-HE3-08 uniquely balances high pulse power handling (200 W), automotive qualification, and compact DO-219AB packaging - making it optimal for space-constrained, high-reliability industrial and automotive data-line protection where both ESD robustness and signal fidelity matter.

Availability

SMF6V0A-HE3-08 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI signal line safeguarding, and industrial sensor I/O conditioning requiring stable component supply across long production cycles.

Supply support for SMF6V0A-HE3-08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Semiconductors is a global leader in discrete semiconductors and passive components, specializing in high-reliability, application-optimized devices for automotive, industrial, and computing markets.

The SMF series targets high-energy ESD protection in space-constrained layouts, with design focus on low clamping voltage, AEC-Q101 compliance, and compatibility with automated SMT assembly processes.

FAQ

What is the clamping voltage of SMF6V0A-HE3-08 at its rated peak pulse current?

The SMF6V0A-HE3-08 has a maximum clamping voltage (VC) of 10.3 V at 19.4 A peak pulse current (IPPM) under 10/1000 μs waveform conditions. This value is measured per Vishay's datasheet Rev. 2.4 (Document #85881) and reflects the actual voltage imposed on protected circuitry during worst-case surge events - critical for ensuring downstream ICs remain within safe operating limits. The SMF6V0A-HE3-08 achieves this with low incremental surge resistance and fast avalanche response.

Is SMF6V0A-HE3-08 qualified for automotive applications?

Yes, SMF6V0A-HE3-08 is AEC-Q101 qualified, having passed stress tests including high-temperature reverse bias (HTRB), temperature cycling (TCT), and highly accelerated stress test (HAST). It supports operating temperatures from -65 °C to +175 °C and is rated for human body model (HBM) >8 kV (Class H3B), making it suitable for automotive body electronics, infotainment interfaces, and BCM modules. The SMF6V0A-HE3-08 meets these requirements per Vishay's official qualification report referenced in Document #85881.

What package type does SMF6V0A-HE3-08 use, and is it compatible with standard SMT processes?

SMF6V0A-HE3-08 uses the DO-219AB (SMF) package - a low-profile, surface-mount outline measuring 3.9 mm × 1.9 mm × 1.08 mm. It is fully compatible with wave and reflow soldering per J-STD-020 MSL level 1 (peak temperature ≤260 °C), with no pre-bake required. Its footprint aligns with SOD-123W land patterns, enabling layout reuse. The SMF6V0A-HE3-08's cathode is marked by a bar on the top surface, supporting automated optical inspection and placement verification.

How does the junction capacitance of SMF6V0A-HE3-08 affect its suitability for high-speed data lines?

The SMF6V0A-HE3-08 exhibits 1063 pF typical junction capacitance at 0 V and 1 MHz, which is appropriate for USB 2.0 (480 Mbps) and RS-485 interfaces but too high for USB 3.x (≥5 Gbps) or HDMI 2.0+ (≥6 Gbps). This capacitance introduces measurable signal attenuation and rise-time degradation above ~100 MHz. Engineers must verify eye diagram integrity in their specific layout; the SMF6V0A-HE3-08 is intentionally optimized for robustness over bandwidth, prioritizing clamping performance and energy handling over ultra-low capacitance.

Can SMF6V0A-HE3-08 replace SMF5V0A in an existing design?

SMF6V0A-HE3-08 can replace SMF5V0A only if the system's signal line DC bias allows a 6 V stand-off voltage (VRWM) instead of 5 V - e.g., when protecting a 3.3 V rail with sufficient noise margin. The SMF6V0A-HE3-08 offers higher breakdown (6.67–7.4 V vs. 6.4–7.1 V) and slightly lower clamping (10.3 V vs. 9.2 V at respective IPPM), but its 26 μA max reverse leakage at VRWM is higher than SMF5V0A's 5 μA. Layout and thermal design remain identical due to shared DO-219AB packaging. Verify system-level ESD margin before substitution.

SMF6V0A-HE3-08 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
DO-219AB
Series:
eSMP®
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
6V
Voltage - Breakdown (Min):
6.67V
Voltage - Clamping (Max) @ Ipp:
10.3V
Current - Peak Pulse (10/1000µs):
19.4A
Power - Peak Pulse:
200W
Power Line Protection:
No
Applications:
-
Capacitance @ Frequency:
1063pF @ 1MHz
Operating Temperature:
-65°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
DO-219AB (SMF)

SMF6V0A-HE3-08 FAQ

1.How can I place an order for SMF6V0A-HE3-08 through Aetrix?

Please submit a Request for Quotation (RFQ) for SMF6V0A-HE3-08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SMF6V0A-HE3-08 reliable?

The price and inventory of SMF6V0A-HE3-08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMF6V0A-HE3-08 is usually 5 days.

3.What payment methods are accepted for SMF6V0A-HE3-08?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMF6V0A-HE3-08 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SMF6V0A-HE3-08?

SMF6V0A-HE3-08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SMF6V0A-HE3-08 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SMF6V0A-HE3-08?

For technical support, including SMF6V0A-HE3-08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMF6V0A-HE3-08 requirements.

6.How does Aetrix verify that SMF6V0A-HE3-08 is sourced from the original manufacturer or authorized distributors?

All SMF6V0A-HE3-08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMF6V0A-HE3-08 meets industry standards.

7.What is the process for return or replacement of SMF6V0A-HE3-08?

All SMF6V0A-HE3-08 units undergo pre-shipment inspection (PSI). If there is an issue with SMF6V0A-HE3-08, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SMF6V0A-HE3-08 part is unused and in its original packaging.

Return procedure for SMF6V0A-HE3-08:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SMF6V0A-HE3-08 Tags

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