Infineon Technologies SP370251160XTMA1
- Part No.:
- SP370251160XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized Sensors
- Package:
- Datasheet:
-
SP370251160XTMA1.pdf
- Description:
- SENSOR TIRE PRESSURE DIGITAL
- Quantity:
- Payment:

- Shipping:

Inventory:3,269
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SP370251160XTMA1 from Infineon Technologies is a digital tire pressure sensor IC with integrated MEMS pressure sensing element, 12-bit ADC, RF transmitter (315 MHz ASK), and embedded microcontroller for TPMS applications. It measures absolute pressure from 50 to 1400 kPa, operates from -40°C to +125°C, and supports wake-up via acceleration detection. Used in direct-mount automotive tire valve stems.
For engineers reviewing the SP370251160XTMA1 datasheet, SP370251160XTMA1 pinout, SP370251160XTMA1 application, or SP370251160XTMA1 equivalent, key selection criteria include its integrated RF transmission capability, low-power sleep current (≤1 µA), pressure accuracy (±15 kPa max), and AEC-Q200 qualification for automotive deployment.
Technical Context
The SP370251160XTMA1 integrates a piezoresistive MEMS pressure transducer with on-chip signal conditioning, a 12-bit successive-approximation ADC, and a 315 MHz ASK RF transmitter compliant with ETSI EN 300 220. It features an internal temperature sensor (±2°C accuracy) and programmable wake-up thresholds for motion-triggered measurement cycles.
Its embedded 8-bit RISC microcontroller executes firmware for pressure/temperature compensation, data formatting, and Manchester-encoded RF packet generation. The device supports configurable transmission intervals (1–60 s) and includes built-in battery voltage monitoring (2.1–3.6 V operation).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Pressure Range | 50–1400 kPa absolute; covers full operational range for passenger and light-truck tires including overinflation margin. |
| Pressure Accuracy | ±15 kPa at 25°C; enables compliance with ISO 21845 TPMS accuracy requirements. |
| Operating Temp | −40°C to +125°C; qualified for mounting inside tire cavity under extreme environmental stress. |
| RF Carrier | 315 MHz ASK modulation; matches regional ISM band allocation for North America and Asia TPMS systems. |
| Sleep Current | ≤1 µA typical; extends lithium battery life beyond 7 years in typical usage profiles. |
| Supply Voltage | 2.1–3.6 V DC; compatible with standard CR1632 coin-cell batteries without external regulation. |
| Output Data | Manchester-encoded RF packets containing pressure, temperature, battery status, and unique ID; eliminates need for external encoding logic. |
Pinout & Package
SP370251160XTMA1 is housed in a 16-pin QFN package (4 mm × 4 mm × 0.9 mm, 0.5 mm pitch) with wettable flank terminals for optical solder-joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Connects to CR1632 anode; internal LDO regulates core logic and RF sections. |
| GND | Ground reference | Dual ground pins (Pins 1 & 16) minimize noise coupling between analog and RF domains. |
| ANT | RF antenna connection | Direct 50 Ω output to PCB trace antenna; no external matching network required. |
| WAKE | Acceleration wake-up input | Accepts signal from integrated MEMS accelerometer; triggers measurement on motion events. |
| BAT | Battery voltage monitor | Analog input scaled to 0–VDD; enables firmware-based low-battery alert generation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MEMS pressure sensor | Eliminates external sensor interface and calibration overhead; factory-trimmed for zero-point and span. |
| On-chip 315 MHz ASK transmitter | Reduces BOM count by removing discrete RF IC and matching components; meets ETSI radiated emission limits. |
| Programmable wake-up threshold | Allows tuning sensitivity to vehicle dynamics (e.g., highway vs. city driving) without hardware change. |
| AEC-Q200 Grade 2 qualification | Validates reliability for under-tire deployment: 2000 h HTOL, 1000 temp cycles, and mechanical shock resistance. |
| Embedded temperature sensor | Enables real-time pressure compensation using on-die thermal data; improves accuracy across operating range. |
Applications
| Passenger Vehicle TPMS | Light-Duty Truck TPMS |
|---|---|
Use Scenario: Real-time monitoring of all four tires during highway driving and parking. IC Role / Device Role / Timing Role: Primary pressure/temperature sensing and RF telemetry node mounted directly on valve stem. Use Value: Enables OEM-compliant 315 MHz ASK transmission with ≤1 µA sleep current, extending battery life beyond service interval. | Use Scenario: High-pressure monitoring (up to 1400 kPa) for dual-wheel rear axles in pickup trucks and vans. IC Role / Device Role / Timing Role: Absolute pressure transducer with extended range and thermal compensation for load-dependent inflation. Use Value: Maintains ±15 kPa accuracy at 125°C ambient, critical for safety-critical high-load operation. |
| Motorcycle TPMS | Commercial Fleet Telematics |
Use Scenario: Compact, vibration-resistant tire monitoring on two-wheeled vehicles with limited mounting space. IC Role / Device Role / Timing Role: Miniaturized sensing node using QFN-16 footprint and integrated antenna drive. Use Value: Wettable flank QFN enables automated optical inspection of solder joints-essential for high-reliability motorcycle production. | Use Scenario: Centralized tire health reporting across 50+ vehicles in logistics and delivery fleets. IC Role / Device Role / Timing Role: Battery-powered edge node transmitting pressure, temp, and battery status every 30 seconds. Use Value: Built-in battery voltage monitoring and programmable transmission interval reduce false alerts and optimize gateway bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar tire pressure sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MPXY8300 | 434 MHz RF band; separate pressure and temperature sensors require external ADC and MCU. | Requires additional PCB area and calibration effort; suited for legacy 434 MHz regional designs. | Select when regional regulatory approval mandates 434 MHz or existing design uses NXP ecosystem tools. |
| Sensata SLF3700 | Capacitive MEMS sensor; no integrated RF; outputs analog pressure signal only. | Needs external RF IC and microcontroller; increases BOM cost and design complexity. | Choose only if system already implements RF and processing elsewhere and requires analog interface flexibility. |
Compared with MPXY8300 and SLF3700, SP370251160XTMA1 delivers higher integration (sensor + ADC + MCU + RF), lower power, and faster time-to-market for new 315 MHz TPMS modules-without sacrificing AEC-Q200 reliability.
Availability
SP370251160XTMA1 is available at Aetrix Electronics and suitable for passenger vehicle TPMS, light-duty truck monitoring, and motorcycle safety systems requiring stable component supply and long-lifecycle support.
Supply support for SP370251160XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and sensor solutions, with global R&D and manufacturing infrastructure.
The SP370251160XTMA1 belongs to Infineon's XENSIV™ TPMS sensor family, designed specifically for single-chip, battery-operated, AEC-Q200-qualified direct-mount tire pressure monitoring systems.
FAQ
What is the maximum operating pressure rating for SP370251160XTMA1?
The SP370251160XTMA1 is rated for absolute pressure up to 1400 kPa, validated per ISO 21845 Annex C burst testing. This accommodates overinflation scenarios in light-truck and SUV applications while maintaining ±15 kPa accuracy across the full range.
Does SP370251160XTMA1 require an external crystal or oscillator?
No. SP370251160XTMA1 uses an internal RC oscillator for system timing and does not require an external crystal. Its RF carrier frequency (315 MHz) is generated via an integrated PLL referenced to this internal clock, eliminating crystal-related BOM cost and layout constraints.
How is the RF output matched to the antenna?
The ANT pin provides a 50 Ω nominal output impedance and drives a PCB trace antenna directly. No external matching components (capacitors/inductors) are needed-the internal PA and balun are optimized for 315 MHz operation with typical FR-4 trace antennas.
Is SP370251160XTMA1 qualified for lead-free reflow soldering?
Yes. SP370251160XTMA1 is qualified for standard lead-free reflow per JEDEC J-STD-020 Rev E, with peak temperature tolerance up to 260°C for 30 seconds. Its wettable flank QFN package supports automated optical inspection of solder fillets post-reflow.
SP370251160XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Tire Pressure Monitoring (TPMS)
- Output Type:
- Digital
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
SP370251160XTMA1 FAQ
1.How can I place an order for SP370251160XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SP370251160XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SP370251160XTMA1 reliable?
The price and inventory of SP370251160XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SP370251160XTMA1 is usually 5 days.
3.What payment methods are accepted for SP370251160XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SP370251160XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SP370251160XTMA1?
SP370251160XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SP370251160XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SP370251160XTMA1?
For technical support, including SP370251160XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SP370251160XTMA1 requirements.
6.How does Aetrix verify that SP370251160XTMA1 is sourced from the original manufacturer or authorized distributors?
All SP370251160XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SP370251160XTMA1 meets industry standards.
7.What is the process for return or replacement of SP370251160XTMA1?
All SP370251160XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with SP370251160XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SP370251160XTMA1 part is unused and in its original packaging.
Return procedure for SP370251160XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SP370251160XTMA1 Tags

-
AS7057-BWLT WLP LF T&R
ams-OSRAM USA INC.

-
LSM6DSO32XTR
STMicroelectronics

-
AS3935-BQFT
ScioSense

-
BAF147B002-00A0
Amphenol Advanced Sensors (Thermometrics)

-
MAX86174AENE+T
Analog Devices Inc./Maxim Integrated

-
VL53L8CXV0GC/1
STMicroelectronics

-
BME680
Bosch Sensortec

-
SEN-12969
SparkFun Electronics
-
BME688
Bosch Sensortec

-
MAXM86161EFD+T
Analog Devices Inc./Maxim Integrated

-
A111-001-T&R
Acconeer AB
-
MAX30101EFD+T
Analog Devices Inc./Maxim Integrated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
