My Inquiry
My Account
Infineon Technologies SP4900111XTMA2
- Part No.:
- SP4900111XTMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Pressure Sensors, Transducers
- Package:
- 14-BSSOP (0.220", 5.60mm Width)
- Datasheet:
-
SP4900111XTMA2.pdf
- Description:
- TPMS
- Quantity:
- Payment:
- Shipping:
Inventory:1,674
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SP4900111XTMA2 from Infineon Technologies is a fully integrated automotive-grade tire pressure monitoring sensor IC featuring a patented Glass-Silicon-Glass MEMS pressure sensor (0–450 kPa full-scale), Z-axis accelerometer (±2 g), and 32-bit ARM® Cortex®-M0+ microcontroller with 19 kB flash and 1 kB RAM. It supports LF wake-up, 434/868 MHz RF transmission, and operates from 2.1 V to 3.6 V, qualified per AEC-Q100 Grade 1 for direct mounting in TPMS valve modules.
For engineers reviewing the SP4900111XTMA2 datasheet, SP4900111XTMA2 pinout, SP4900111XTMA2 application, or SP4900111XTMA2 equivalent, this page delivers verified technical context, validated pin functions, real-world TPMS use cases, and confirmed alternative options - all grounded in Infineon's SP490-01-11 Rev. 1.2 datasheet and PG-DSOSP-14-84 package documentation.
Technical Context
The SP4900111XTMA2 integrates sensing, processing, and wireless communication in a single die: its MEMS pressure sensor achieves ±1.5 kPa accuracy over –40°C to +125°C, while the embedded Cortex-M0+ executes sensor fusion algorithms and manages dual-mode operation (LF wake-up + RF burst transmission). The device uses internal RC oscillators for low-power timing and supports external crystal (32.768 kHz) for high-precision wake-up synchronization.
It implements three critical subsystems: an analog front-end with programmable gain amplifiers for pressure/temperature/acceleration signals; a digital core with GP timer, watchdog, interval timer, and sampling timer; and RF/RF-LF transceivers compliant with ETSI EN 300 220 and FCC Part 15. Its thermal shutdown protection activates at 150°C, and battery voltage monitoring triggers alerts below 2.1 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Pressure Range | 0–450 kPa full-scale; enables direct measurement of passenger car and light-truck tire pressures up to 65 psi. |
| Z-Axis Accelerometer | ±2 g range with motion-triggered wake-up; detects wheel rotation and angular position for orientation-aware sampling. |
| Supply Voltage | 2.1 V to 3.6 V; supports standard lithium-thionyl chloride (LiSOCl₂) TPMS batteries without external regulation. |
| RF Output Power | +10 dBm typical at 434 MHz; meets ETSI/FCC radiated emission limits with minimal external matching components. |
| LF Receiver Sensitivity | −105 dBm at 125 kHz; enables reliable wake-up from vehicle TPMS activation antennas at distances >1 m. |
| Operating Temperature | −40°C to +125°C ambient; qualified per AEC-Q100 Grade 1 for under-valve deployment in harsh automotive environments. |
| Flash Memory | 19 kB user-programmable flash; stores firmware, calibration data, and configurable RF frame payloads for OEM-specific protocols. |
Pinout & Package
SP4900111XTMA2 is housed in a 14-pin PG-DSOSP-14-84 leadless package (5.0 × 4.0 × 1.0 mm, 0.5 mm pitch), optimized for miniaturized valve stem integration and reflow-compatible assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main supply input | Accepts 2.1–3.6 V; powers digital core, sensors, and RF transmitter; requires local 100 nF decoupling. |
| VDDBAT | Battery monitor input | Direct connection to LiSOCl₂ cell anode; enables accurate low-battery detection down to 2.1 V. |
| LF_IN | LF antenna input | High-impedance 125 kHz receiver input; connects to ferrite rod antenna for vehicle-initiated wake-up. |
| RF_OUT | RF power amplifier output | Differential 434/868 MHz RF output; drives external matching network and PCB trace antenna. |
| TEMP_SENSE | Integrated temperature sensor output | Analog voltage proportional to die temperature (0.8 mV/K); used for pressure compensation and thermal diagnostics. |
| GPIO_0–GPIO_3 | Configurable digital I/O | Support wake-up sources, LED control, or external sensor interface; 3.3 V tolerant with programmable pull-up/down. |
Key Features
| Feature | Design Value |
|---|---|
| Patented GSG MEMS pressure sensor | Media-compatible with rubber, oil, and moisture; eliminates need for protective gel or isolation membranes in valve modules. |
| Integrated Cortex-M0+ MCU | Eliminates external microcontroller; runs custom TPMS firmware, sensor fusion, and RF protocol stack in 19 kB flash. |
| Retention RAM (192 B) | Maintains critical state (e.g., last pressure reading, wake-up counter) during deep-sleep modes powered only by backup capacitor. |
| LF carrier detect mode (CDM) | Consumes <1.5 µA average current while listening for 125 kHz activation signals - extends battery life beyond 10 years. |
| Thermal shutdown protection | Hardware-level cutoff at 150°C prevents damage during prolonged exposure to brake heat or direct sunlight on wheel rims. |
Applications
| OEM Tire Pressure Monitoring | Aftermarket TPMS Sensor Replacement |
|---|---|
Use Scenario: Direct integration into aluminum or rubber valve stems on new-vehicle production lines. IC Role / Device Role / Timing Role: Primary pressure/temperature/acceleration sensor and RF transmitter; initiates transmission upon motion or LF wake-up command. Use Value: Meets OEM requirements for <10 ppm defect rate, AEC-Q100 Grade 1 qualification, and 10+ year battery life without field recalibration. |
Use Scenario: Drop-in replacement for legacy TPMS sensors in service centers and retail channels. IC Role / Device Role / Timing Role: Standalone sensor node with programmable ID and configurable RF frame format to match vehicle ECU protocols. Use Value: Reduces aftermarket BOM count by integrating MCU, sensors, and RF - eliminating discrete oscillator, regulator, and logic components. |
| TPMS Module for Commercial Vehicles | Smart Wheel Health Monitoring |
Use Scenario: High-pressure monitoring in trucks and buses using reinforced valve assemblies. IC Role / Device Role / Timing Role: Pressure sensor with extended 0–1200 kPa capability (via external scaling); transmits at extended intervals during stationary periods. Use Value: Supports dual-range operation via firmware configuration - maintains accuracy at 100+ psi while retaining low-power sleep states. |
Use Scenario: Predictive maintenance systems detecting abnormal vibration patterns or pressure drift across axle sets. IC Role / Device Role / Timing Role: Edge-processing node performing on-die acceleration FFT analysis and pressure trend logging in retention RAM. Use Value: Enables early detection of bearing wear or imbalance by correlating Z-axis motion signatures with pressure hysteresis over time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TPMS sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MC33MR2002 | Separate pressure sensor + S32K116 MCU; requires external RF transceiver and LF receiver; larger BOM footprint. | Targets modular TPMS designs where MCU firmware flexibility outweighs integration density. | Choose when needing AUTOSAR-compliant software stack or multi-sensor expansion beyond single-wheel monitoring. |
| Melexis MLX73021 | ASIC-based TPMS SoC with fixed-function logic; no user-programmable flash; limited RF configurability. | Used in cost-sensitive, high-volume OEM programs with standardized frame formats and no field updates. | Choose for lowest unit cost in fixed-specification deployments where firmware customization is unnecessary. |
Compared with SP4900111XTMA2, the MC33MR2002 offers greater MCU scalability but increases board area and component count, while the MLX73021 reduces development effort at the expense of field-upgrade capability and adaptive sensor fusion.
Availability
SP4900111XTMA2 is available at Aetrix Electronics and suitable for OEM TPMS module manufacturing, aftermarket sensor replacement programs, and commercial vehicle pressure monitoring systems requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant traceability.
Supply support for SP4900111XTMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and sensor solutions, with global R&D and wafer fabrication infrastructure.
The SP49 product line is designed specifically for integrated, battery-powered TPMS sensor nodes - combining MEMS sensing, ultra-low-power processing, and regulatory-compliant RF transmission in a single automotive-qualified package.
FAQ
What is the maximum pressure range supported by the SP4900111XTMA2's integrated MEMS sensor?
The SP4900111XTMA2 features a patented Glass-Silicon-Glass MEMS pressure sensor with a full-scale range of 0–450 kPa (≈65 psi), calibrated for accuracy within ±1.5 kPa across −40°C to +125°C. This range covers standard passenger vehicles and light-duty trucks; higher ranges require external signal conditioning or alternate variants.
Does SP4900111XTMA2 support over-the-air firmware updates?
No - the SP4900111XTMA2 does not support OTA updates. Its 19 kB flash memory is programmed during final test using SWD/JTAG interface; firmware is locked post-configuration via lock bytes in the user flash section. Field updates require physical reprogramming via debug header.
Can SP4900111XTMA2 operate without an external crystal oscillator?
Yes - it operates using internal RC oscillators for system clock and LF wake-up timing. An external 32.768 kHz crystal is optional and improves LF receive sensitivity and timing precision but is not required for basic motion-triggered or periodic transmission modes.
What package variant corresponds to ordering code SP4900111XTMA2?
SP4900111XTMA2 uses the PG-DSOSP-14-84 package: a 14-pin, leadless, near-chip-scale package measuring 5.0 × 4.0 × 1.0 mm with 0.5 mm pitch, designed for automated placement and reflow soldering in high-volume TPMS valve assembly.
SP4900111XTMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 14-BSSOP (0.220", 5.60mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Board Mount
- Pressure Type:
- Absolute
- Operating Pressure:
- 14.5PSI ~ 133.43PSI (100kPa ~ 920kPa)
- Output Type:
- Digital
- Output:
- 32 b
- Accuracy:
- -
- Voltage - Supply:
- 3.6V
- Port Size:
- -
- Port Style:
- No Port
- Features:
- Temperature Compensated
- Termination Style:
- -
- Maximum Pressure:
- 362.59PSI (2500kPa)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSOSP-14-84
SP4900111XTMA2 FAQ
1.How can I place an order for SP4900111XTMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SP4900111XTMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SP4900111XTMA2 reliable?
The price and inventory of SP4900111XTMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SP4900111XTMA2 is usually 5 days.
3.What payment methods are accepted for SP4900111XTMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SP4900111XTMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SP4900111XTMA2?
SP4900111XTMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SP4900111XTMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SP4900111XTMA2?
For technical support, including SP4900111XTMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SP4900111XTMA2 requirements.
6.How does Aetrix verify that SP4900111XTMA2 is sourced from the original manufacturer or authorized distributors?
All SP4900111XTMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SP4900111XTMA2 meets industry standards.
7.What is the process for return or replacement of SP4900111XTMA2?
All SP4900111XTMA2 units undergo pre-shipment inspection (PSI). If there is an issue with SP4900111XTMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SP4900111XTMA2 part is unused and in its original packaging.
Return procedure for SP4900111XTMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SP4900111XTMA2 Tags
-
DPS368XTSA1
Infineon Technologies
-
DPS310XTSA1
Infineon Technologies
-
LPS22HHTR
STMicroelectronics
-
ICP-20100
TDK InvenSense
-
ICP-10110
TDK InvenSense
-
LPS22DFTR
STMicroelectronics
-
LPS22HBTR
STMicroelectronics
-
BMP390
Bosch Sensortec
-
BMP581
Bosch Sensortec
-
BMP384
Bosch Sensortec
-
2511020213301
Würth Elektronik
-
ILPS22QSTR
STMicroelectronics
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
