Infineon Technologies SPA11N60C3IN
- Part No.:
- SPA11N60C3IN
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
SPA11N60C3IN.pdf
- Description:
- MOSFET N-CH 650V 11A TO220-3-31
- Quantity:
- Payment:

- Shipping:

Inventory:7,018
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPA11N60C3 from Infineon Technologies is a 600 V, 11 A CoolMOS™ C3 superjunction N-channel power MOSFET in PG-TO220 package, featuring RDS(on) = 0.38 Ω at Tj = 25°C, ultra-low gate charge (Qg = 45–60 nC), and periodic avalanche rating. It serves as a high-efficiency primary-side switch in offline SMPS, PFC stages, and industrial AC-DC converters operating up to 150°C junction temperature.
For engineers reviewing the SPA11N60C3 datasheet, SPA11N60C3 pinout, SPA11N60C3 application, or SPA11N60C3 equivalent, key selection criteria include its 50 V/ns dv/dt capability, 340 mJ single-pulse avalanche energy, thermal resistance RthJC = 1 K/W, and compatibility with hard-switched 650 V-class topologies requiring low conduction and switching losses.
Technical Context
This device implements Infineon's third-generation CoolMOS™ technology, optimized for reduced gate charge (Qgd = 22 nC) and enhanced transconductance (gfs = 8.3 S), enabling faster switching with lower Eoff and reduced driver loss. Its 600 V V(BR)DSS rating and 700 V avalanche breakdown support robust operation under transient overvoltage conditions.
The MOSFET integrates a fast-recovery body diode (trr = 400–600 ns, Qrr = 6 µC) and supports high peak current (ID,puls = 33 A), making it suitable for continuous conduction mode (CCM) PFC and resonant LLC primary switches where diode reverse recovery behavior critically impacts efficiency and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Withstands DC bus voltages up to 480 V in 650 V-class designs with margin for surge and ringing. |
| RDS(on) | 0.38 Ω @ Tj = 25°C - Enables <1.5 W conduction loss at 7 A, supporting compact heatsink design in 100–300 W SMPS. |
| Qg | 45–60 nC - Reduces gate drive power and allows use of low-cost, low-current drivers (e.g., 1 A peak). |
| EAS | 340 mJ - Supports reliable operation under single-pulse inductive fault conditions without external snubbers. |
| dv/dt | 50 V/ns - Ensures immunity to false turn-on in high-noise bridge-leg configurations with fast voltage transients. |
| trr | 400–600 ns - Limits reverse recovery loss and EMI generation in hard-switched PFC, especially at >50 kHz. |
| RthJC | 1 K/W - Allows direct mounting to heatsink with minimal thermal interface resistance for stable 125°C case operation. |
Pinout & Package
Package: PG-TO220 (3-pin, full isolation: 2500 VAC, 1 min). Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source. The drain-connected metal tab provides low-inductance, high-current path and thermal conduction to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | High-impedance control terminal; requires <6.8 Ω series gate resistor to damp oscillation and limit di/dt during turn-on. |
| Pin 2 | Drain (Tab) | Main high-voltage power terminal; electrically isolated from case per IEC 60747-17; must be mounted to heatsink with insulating pad or shoulder washer. |
| Pin 3 | Source | Reference node for gate drive and current sensing; connects to low-side shunt or controller ground in non-isolated topologies. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low Qgd/Qg ratio | 22/45–60 nC → improves hard-switching Eoff by >25% vs. prior-gen 600 V MOSFETs, reducing total switching loss. |
| Periodic avalanche rated | Rated for repetitive avalanche (IAR = 11 A, EAR = 0.6 mJ) - enables robustness in unclamped inductive switching without derating. |
| Extreme dv/dt immunity | 50 V/ns at Tj = 125°C - eliminates need for negative gate voltage or active Miller clamp in half-bridge leg applications. |
| Improved gfs | 8.3 S - delivers tighter VGS(th) control (2.1–3.9 V) and higher current gain across temperature, easing gate drive design. |
| Low Coss energy-related | Co(er) = 45 pF - reduces capacitive turn-off loss in ZVS and quasi-resonant converters operating above 100 kHz. |
Applications
| Server PSU Primary Switch | Industrial PFC Boost Stage |
|---|---|
|
Use Scenario: 80+ Titanium server power supply operating in continuous conduction mode (CCM) with 380–400 V DC bus. IC Role / Device Role / Timing Role: High-side switch in interleaved boost PFC stage, switching at 65–100 kHz with synchronous rectification. Use Value: Low Qg and RDS(on) reduce total loss by ~1.2 W per phase vs. standard 600 V MOSFETs, improving full-load efficiency to >98.5%. |
Use Scenario: 3 kW industrial motor drive front-end with active PFC and wide input range (300–480 V AC). IC Role / Device Role / Timing Role: Main switching element in boost converter, handling 11 A RMS current with 33 A peak pulses. Use Value: Avalanche rating and 150°C Tj capability allow operation without derating in sealed enclosures with ambient up to 70°C. |
| LED Driver Flyback Primary | Solar Microinverter DC-Link Switch |
|
Use Scenario: 150 W outdoor LED streetlight driver with universal AC input and high reliability requirement. IC Role / Device Role / Timing Role: Primary-side switch in flyback topology, operating in DCM/QR mode with 65 kHz nominal frequency. Use Value: Fast body diode (trr = 400 ns) minimizes dead-time loss and EMI, enabling compliance with EN 55015 Class B without additional filtering. |
Use Scenario: 300–500 W solar microinverter interfacing PV string (600–1000 V DC) to grid. IC Role / Device Role / Timing Role: DC-link switch in H-bridge inverter stage, subjected to high dv/dt and partial shading transients. Use Value: 50 V/ns dv/dt rating and 700 V avalanche breakdown ensure safe operation during rapid irradiance changes and lightning-induced surges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP12N60DM6 | RDS(on) = 0.33 Ω, Qg = 32 nC, but no specified periodic avalanche rating; trr = 550 ns. | Lacks documented repetitive avalanche capability - unsuitable for unclamped inductive loads or high-reliability PFC. | Preferable only when lowest conduction loss dominates and avalanche stress is absent. |
| IPP60R190C7 | RDS(on) = 0.19 Ω, Qg = 43 nC, 650 V rating, but higher Ciss (1350 pF) increases gate drive loss. | Higher capacitance raises Eon at >100 kHz; not qualified for 150°C continuous operation. | Better for high-frequency ZVS designs below 70°C ambient; avoid in thermally constrained industrial enclosures. |
Compared with STP12N60DM6 and IPP60R190C7, SPA11N60C3 uniquely balances avalanche ruggedness, 150°C operation, and low Qgd-driven Eoff, making it optimal for mission-critical industrial PFC and server PSUs where reliability trumps marginal conduction loss reduction.
Availability
SPA11N60C3 is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, and solar microinverters requiring stable component supply, long-term lifecycle support, and traceable sourcing from original manufacturer stock.
Supply support for SPA11N60C3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The CoolMOS™ C3 product line targets high-efficiency AC-DC conversion in enterprise, industrial, and renewable energy systems, emphasizing ruggedness, thermal stability, and ease of gate drive integration.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The SPA11N60C3 supports 7 A continuous drain current at TC = 100°C, as specified in its Absolute Maximum Ratings table. This derating reflects thermal limits of the TO-220 package and ensures safe operation within RthJC = 1 K/W and junction temperature ≤150°C.
Does SPA11N60C3 require a negative gate voltage for reliable turn-off?
No. The device's 50 V/ns dv/dt immunity and low Qgd eliminate the need for negative gate drive in typical half-bridge or full-bridge configurations. A 0 V to +10 V or +13 V gate swing with appropriate series resistance suffices for robust switching.
Can SPA11N60C3 replace older CoolMOS™ C2 devices in existing designs?
Yes - it is a direct drop-in replacement for SPP11N60C2 and SPI11N60C2 with identical pinout, voltage rating, and thermal footprint. Its lower Qg and improved Eoff typically yield 0.3–0.5% system efficiency gain without layout or driver changes.
Is the drain tab electrically isolated in the PG-TO220 package?
Yes. The PG-TO220 variant used for SPA11N60C3 features full electrical isolation between the drain-connected metal tab and the mounting surface (2500 VAC, 1 minute), enabling safe use on uninsulated heatsinks without additional isolation hardware.
SPA11N60C3IN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 380mOhm @ 7A, 10V
- Vgs(th) (Max) @ Id:
- 3.9V @ 500µA
- Gate Charge (Qg) (Max) @ Vgs:
- 60 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 33W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-3-31
SPA11N60C3IN FAQ
1.How can I place an order for SPA11N60C3IN through Aetrix?
Please submit a Request for Quotation (RFQ) for SPA11N60C3IN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPA11N60C3IN reliable?
The price and inventory of SPA11N60C3IN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPA11N60C3IN is usually 5 days.
3.What payment methods are accepted for SPA11N60C3IN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPA11N60C3IN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPA11N60C3IN?
SPA11N60C3IN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPA11N60C3IN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPA11N60C3IN?
For technical support, including SPA11N60C3IN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPA11N60C3IN requirements.
6.How does Aetrix verify that SPA11N60C3IN is sourced from the original manufacturer or authorized distributors?
All SPA11N60C3IN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPA11N60C3IN meets industry standards.
7.What is the process for return or replacement of SPA11N60C3IN?
All SPA11N60C3IN units undergo pre-shipment inspection (PSI). If there is an issue with SPA11N60C3IN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPA11N60C3IN part is unused and in its original packaging.
Return procedure for SPA11N60C3IN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPA11N60C3IN Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

