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Infineon Technologies SPB100N03S2-03 G

Part No.:
SPB100N03S2-03 G
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSPB100N03S2-03 G.pdf
Description:
MOSFET N-CH 30V 100A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,469

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Product details

Overview

SPB100N03S2-03G from Infineon Technologies is an N-channel enhancement-mode power MOSFET in TO263-3 (D²PAK) package, rated for 30 V VDS, 100 A continuous drain current at TC = 25 °C, and 2.5 mΩ typical RDS(on) at VGS = 10 V and ID = 80 A. It supports 175 °C operation, is avalanche-rated (EAS = 810 mJ), and features dV/dt ruggedness up to 6 kV/µs - deployed in high-current DC-DC output stages and motor phase switches.

For engineers reviewing the SPB100N03S2-03G datasheet, SPB100N03S2-03G pinout, SPB100N03S2-03G application, or SPB100N03S2-03G equivalent, key selection criteria include RDS(on) at 100 A load, thermal resistance (RthJC = 0.3–0.5 K/W), gate charge (Qg = 113–150 nC), and reverse diode forward voltage (VSD = 0.9–1.3 V at 100 A).

Technical Context

This MOSFET uses Infineon's OptiMOS™ T2 process optimized for low RDS(on) × Qg figure-of-merit (FOM), enabling high-efficiency switching in synchronous rectification and half-bridge topologies. Its 3 mΩ max RDS(on) and 5300–7020 pF Ciss support fast turn-on with controlled EMI.

The device integrates a robust body diode with trr = 79–100 ns and Qrr = 109–136 nC, enabling reliable freewheeling in hard-switched converters. Thermal design is enabled by its low junction-to-case resistance and 175 °C maximum operating temperature.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating30 V - supports 24 V nominal bus systems with margin for transients and ripple
RDS(on) max3 mΩ at VGS = 10 V, ID = 80 A - enables <1.5 W conduction loss at 100 A
ID Continuous100 A at TC = 25 °C - requires heatsink or PCB copper area ≥6 cm² for sustained operation
EAS810 mJ single-pulse avalanche energy - withstands inductive turn-off stress without external snubber
dV/dt Rating6 kV/µs - immune to false triggering in noisy high-dV/dt environments like motor drives
Qg113–150 nC - determines gate driver power requirement and switching speed trade-off
VSD0.9–1.3 V at IF = 100 A - defines freewheeling loss during dead-time in synchronous buck converters

Pinout & Package

Package: TO263-3 (D²PAK), surface-mount, isolated drain tab. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control terminalReceives 10 V logic-level drive; threshold 2.1–4 V; requires <150 nC charge for full enhancement
Pin 2 (Drain)High-side or low-side power pathExposed copper tab - must be soldered to ≥6 cm² PCB copper for thermal performance; electrically connected to drain
Pin 3 (Source)Reference node for gate drive and current sensingLow-inductance return path; used for Kelvin source sensing in precision current monitoring designs

Key Features

FeatureDesign Value
N-channel enhancement modeZero conduction when VGS = 0 V - enables fail-safe off-state in power-up sequencing
Optimized FOM (Qg × RDS(on))~375 nC·mΩ - reduces combined switching + conduction losses in 100–500 kHz SMPS
175 °C operating temperatureEnables use in sealed enclosures or high-ambient industrial environments without derating
Avalanche ratedGuaranteed single-pulse energy handling (810 mJ) - eliminates need for external clamping in inductive loads
Halogen-free constructionComplies with IEC61249-2-21 - meets RoHS and automotive material compliance requirements

Applications

Motor Drive InverterServer VRM Output Stage

Use Scenario: Half-bridge leg in 24 V BLDC motor controller driving 5–10 kW fans or pumps.

IC Role / Device Role / Timing Role: Low-side switch with synchronous rectification; handles 100 A peak phase current at 20 kHz PWM.

Use Value: 2.5 mΩ RDS(on) limits conduction loss to ≤25 W per device; 175 °C rating sustains operation under forced-air-limited cooling.

Use Scenario: High-current output FET in 48 V to 12 V intermediate bus converter for AI server racks.

IC Role / Device Role / Timing Role: Primary synchronous rectifier in multiphase buck topology; switched at 300–500 kHz.

Use Value: Low Qg/RDS(on) FOM minimizes total loss; 6 cm² PCB copper mounting achieves <0.5 K/W effective RthJA.

Industrial UPS InverterEV Onboard Charger (OBC) DC-Link Switch

Use Scenario: Bidirectional 30 V DC-AC inverter stage in 3 kVA uninterruptible power supply.

IC Role / Device Role / Timing Role: High-current switching element in H-bridge; subjected to repetitive avalanche during grid sync transitions.

Use Value: 810 mJ EAS and 6 kV/µs dV/dt rating prevent failure during line disturbance events.

Use Scenario: DC-link switching FET in 6.6 kW OBC PFC + LLC stage operating at 400 V bus.

IC Role / Device Role / Timing Role: Low-voltage auxiliary switch for clamp or soft-start circuitry tied to 30 V rail.

Use Value: Robust body diode (trr = 79 ns, Qrr = 109 nC) ensures clean commutation with minimal voltage overshoot.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRL100N03LRDS(on) = 3.2 mΩ max; Qg = 130 nC; no specified avalanche ratingLacks guaranteed EAS and dV/dt rating - unsuitable for inductive hard-switchingSelect only for low-stress, low-frequency linear or resistive loads
STP100N3LLH6RDS(on) = 2.8 mΩ max; Tjmax = 175 °C; Qg = 125 nC; EAS = 720 mJSlightly lower avalanche energy and higher RDS(on) - marginal in high-reliability motor controlAcceptable where 10% higher conduction loss and 11% lower EAS are tolerable

Compared with IRL100N03L and STP100N3LLH6, SPB100N03S2-03G delivers superior avalanche ruggedness and lower RDS(on), making it preferred for mission-critical 100 A switching in motor drives and UPS inverters where transient immunity and thermal headroom are design constraints.

Availability

SPB100N03S2-03G is available at Aetrix Electronics and suitable for motor drive inverters, server VRM output stages, industrial UPS systems, and EV onboard charger auxiliary circuits requiring stable component supply and long-term production continuity.

Supply support for SPB100N03S2-03G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The OptiMOS™ product line targets high-efficiency power conversion with ultra-low RDS(on) and optimized gate charge for 20–100 V applications in computing, industrial, and e-mobility systems.

FAQ

What is the maximum safe operating temperature for SPB100N03S2-03G?

The device is rated for continuous operation up to Tj = 175 °C, verified per JEDEC JESD22-A108. Derating begins above TC = 120 °C per the ID vs. TC curve on page 4 of the datasheet. At TC = 100 °C, continuous current drops to ~65 A with VGS ≥ 10 V.

Does SPB100N03S2-03G require a gate resistor for stability?

Yes - a series gate resistor (typically 2.2 Ω, as used in the td(on)/td(off) test conditions) is recommended to dampen ringing and limit peak gate current. The device's 150 nC Qg and 5.6 V plateau voltage make it sensitive to fast edge rates without proper gate control.

Can SPB100N03S2-03G be used in parallel configurations?

Yes - its positive temperature coefficient for RDS(on) (see page 9 RDS(on) vs. Tj) enables current sharing across paralleled units. Use matched layout, Kelvin source connections, and individual gate resistors to ensure balanced dynamic current distribution.

Is the drain tab electrically isolated from the PCB mounting plane?

No - the exposed drain tab (Pin 2) is internally connected to the MOSFET's drain and must be electrically isolated from other nets via insulating thermal pad or dielectric coating if mounted to a grounded heatsink. The TO263-3 package has no internal isolation.

SPB100N03S2-03 G Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3mOhm @ 80A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
150 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7020 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

SPB100N03S2-03 G FAQ

1.How can I place an order for SPB100N03S2-03 G through Aetrix?

Please submit a Request for Quotation (RFQ) for SPB100N03S2-03 G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPB100N03S2-03 G reliable?

The price and inventory of SPB100N03S2-03 G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB100N03S2-03 G is usually 5 days.

3.What payment methods are accepted for SPB100N03S2-03 G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB100N03S2-03 G transactions.

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4.How is shipping managed for SPB100N03S2-03 G?

SPB100N03S2-03 G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPB100N03S2-03 G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPB100N03S2-03 G?

For technical support, including SPB100N03S2-03 G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB100N03S2-03 G requirements.

6.How does Aetrix verify that SPB100N03S2-03 G is sourced from the original manufacturer or authorized distributors?

All SPB100N03S2-03 G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB100N03S2-03 G meets industry standards.

7.What is the process for return or replacement of SPB100N03S2-03 G?

All SPB100N03S2-03 G units undergo pre-shipment inspection (PSI). If there is an issue with SPB100N03S2-03 G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPB100N03S2-03 G part is unused and in its original packaging.

Return procedure for SPB100N03S2-03 G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPB100N03S2-03 G Tags

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