Infineon Technologies SPB10N10
- Part No.:
- SPB10N10
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SPB10N10.pdf
- Description:
- MOSFET N-CH 100V 10.3A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:7,770
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPB10N10 from Infineon Technologies is an N-channel enhancement-mode SIPMOS™ power MOSFET rated for 100 V drain-source voltage, 10.3 A continuous drain current at 25°C, and 170 mΩ maximum RDS(on) at VGS = 10 V. It operates up to 175°C, features avalanche and dv/dt ruggedness, and is housed in a P-TO263-3-2 surface-mount package - commonly used in DC-DC converters and motor control half-bridges.
For engineers reviewing the SPB10N10 datasheet, SPB10N10 pinout, SPB10N10 application, or SPB10N10 equivalent, key selection criteria include its 6 kV/µs dv/dt rating, 60 mJ single-pulse avalanche energy, gate plateau voltage of 6.4 V, reverse diode forward voltage of 0.93–1.25 V, and thermal resistance of 3 K/W junction-to-case.
Technical Context
This MOSFET employs planar SIPMOS technology optimized for fast switching and robust unclamped inductive switching (UIS) performance. Its transconductance (2.6–5.8 S), low output capacitance (Coss = 72–96 pF), and gate charge profile (Qg = 14.6–19.4 nC) support high-efficiency hard-switched topologies.
The integrated body diode exhibits trr = 57–71 ns and Qrr = 134–167 nC under defined conditions, enabling moderate-frequency synchronous rectification or freewheeling without external Schottky supplementation in many 100 V-class designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports 48 V bus systems with ≥2× safety margin against transients |
| RDS(on) max | 170 mΩ at VGS = 10 V, ID = 7.8 A - determines conduction loss in continuous operation |
| ID cont | 10.3 A at TC = 25°C - defines maximum steady-state current with adequate heatsinking |
| EAS | 60 mJ - quantifies single-pulse avalanche energy handling capability for inductive load switching |
| dv/dt rating | 6 kV/µs - enables reliable operation in noisy, fast-switching environments without spurious turn-on |
| Tj max | 175°C - allows operation in sealed enclosures or high-ambient industrial settings |
| Qg | 14.6–19.4 nC - directly impacts gate driver power and switching speed trade-offs |
Pinout & Package
SPB10N10 uses the P-TO263-3-2 package - a surface-mount variant of TO-263 with three terminals and exposed drain pad for thermal management. The case is electrically connected to the drain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Reference node for gate drive; carries full load current return path |
| Pin 2 (Gate) | Control input | High-impedance MOS gate requiring <20 V absolute max; threshold 2.1–4 V |
| Pin 3 (Drain) | Power output / high-side switch node | Connected to PCB copper pour for thermal dissipation; electrically tied to case |
Key Features
| Feature | Design Value |
|---|---|
| Avalanche rated | 60 mJ single-pulse EAS - eliminates need for external snubbers in inductive switching |
| dv/dt ruggedness | 6 kV/µs - prevents false triggering during high-slew-rate voltage transients |
| High-temperature operation | Rated to 175°C junction - enables compact thermal design in enclosed power supplies |
| Low gate threshold | VGS(th) = 2.1–4 V - compatible with 3.3 V and 5 V logic-level gate drivers |
| Integrated body diode | VSD = 0.93–1.25 V at 10.3 A - provides functional freewheeling without discrete diode |
Applications
| Motor Drive Half-Bridge | DC-DC Buck Converter |
|---|---|
Use Scenario: High-side switch in 24–48 V brushed DC motor control with PWM frequencies up to 100 kHz. IC Role / Device Role / Timing Role: Power switching element controlling current flow into motor winding; handles repetitive UIS events. Use Value: 175°C rating and 60 mJ EAS ensure reliability during stall and direction reversal without derating. | Use Scenario: Main switch in isolated or non-isolated 48 V input buck converter delivering ≤10 A at 5–12 V output. IC Role / Device Role / Timing Role: Primary power transistor operating in hard-switched mode with 50–100 kHz switching frequency. Use Value: Low RDS(on) and Qg minimize conduction and switching losses, achieving >92% efficiency at full load. |
| Industrial AC-DC Front-End | LED Driver Switch |
Use Scenario: PFC boost switch in universal-input (90–264 VAC) industrial power supplies. IC Role / Device Role / Timing Role: Fast-switching MOSFET in continuous conduction mode (CCM) boost topology. Use Value: Ciss = 320–426 pF and tr/tf ≤ 69/35 ns enable efficient high-frequency operation with minimal EMI. | Use Scenario: Constant-current switch in high-brightness LED string drivers for street lighting. IC Role / Device Role / Timing Role: Series-pass element modulating LED current via PWM dimming at 1–10 kHz. Use Value: Avalanche rating protects against inductive kickback from long LED cable runs and transformer leakage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP10NK100Z | 100 V, 10 A, RDS(on) = 1 Ω - significantly higher on-resistance | Lower efficiency in high-current DC-DC; suitable only for lower-power or cost-sensitive designs | Prefer SPB10N10 where <200 mΩ RDS(on) is required for thermal or efficiency targets |
| IRF540NPBF | 100 V, 33 A, RDS(on) = 44 mΩ - lower RDS(on), but TO-220 through-hole package | Requires through-hole assembly and larger board area; not drop-in compatible for SMD layouts | Select IRF540NPBF only when higher current headroom and through-hole mounting are acceptable |
Compared with STP10NK100Z and IRF540NPBF, SPB10N10 uniquely balances low RDS(on), SMD P-TO263 packaging, and ruggedness - making it optimal for space-constrained, thermally demanding 10 A-class industrial power stages.
Availability
SPB10N10 is available at Aetrix Electronics and suitable for motor drives, DC-DC converters, and industrial AC-DC front-ends requiring stable component supply and long-term production continuity.
Supply support for SPB10N10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global manufacturing and R&D infrastructure.
The SIPMOS™ product line delivers high-voltage, high-reliability power MOSFETs engineered for industrial motor control, renewable energy inverters, and robust power conversion systems.
FAQ
What is the maximum gate-source voltage for SPB10N10?
The absolute maximum gate-source voltage is ±20 V. Operation beyond this risks permanent gate oxide damage. Recommended drive is 10 V for full enhancement, with 0 V to ensure safe turn-off. Gate drive circuits must include clamping or Zener protection if subject to transient overvoltage.
Does SPB10N10 have a built-in body diode, and what are its characteristics?
Yes - it integrates a monolithic body diode rated for 10.3 A continuous forward current at 25°C. Its forward voltage is 0.93–1.25 V at 10.3 A, with reverse recovery time of 57–71 ns and Qrr of 134–167 nC under specified test conditions (VR = 50 V, dIF/dt = 100 A/µs).
Can SPB10N10 be used in linear (analog) regulation mode?
No - it is not characterized or guaranteed for linear-mode operation. Its Safe Operating Area (SOA) curve shows limited DC capability, and prolonged operation in the linear region risks thermal runaway due to positive temperature coefficient of RDS(on). Use only in switched-mode applications per datasheet SOA limits.
What is the thermal resistance from junction to case, and how should it be applied in layout?
Junction-to-case thermal resistance is 3 K/W maximum. To achieve this, the drain pad must be soldered to ≥6 cm² of 70 µm thick copper on FR4 PCB, vertically mounted with no forced airflow. Smaller copper areas increase thermal resistance and require corresponding derating of ID or Ptot.
SPB10N10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 10.3A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 170mOhm @ 7.8A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 21µA
- Gate Charge (Qg) (Max) @ Vgs:
- 19.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 426 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 50W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
SPB10N10 FAQ
1.How can I place an order for SPB10N10 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPB10N10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPB10N10 reliable?
The price and inventory of SPB10N10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB10N10 is usually 5 days.
3.What payment methods are accepted for SPB10N10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB10N10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPB10N10?
SPB10N10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPB10N10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPB10N10?
For technical support, including SPB10N10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB10N10 requirements.
6.How does Aetrix verify that SPB10N10 is sourced from the original manufacturer or authorized distributors?
All SPB10N10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB10N10 meets industry standards.
7.What is the process for return or replacement of SPB10N10?
All SPB10N10 units undergo pre-shipment inspection (PSI). If there is an issue with SPB10N10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPB10N10 part is unused and in its original packaging.
Return procedure for SPB10N10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPB10N10 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

