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Infineon Technologies SPB12N50C3ATMA1

Part No.:
SPB12N50C3ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSPB12N50C3ATMA1.pdf
Description:
MOSFET N-CH 560V 11.6A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,921

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Product details

Overview

SPB12N50C3ATMA1 from Infineon Technologies is a 500 V, 11.6 A N-channel CoolMOS™ C3 power MOSFET in PG-TO263 (D²PAK) package, featuring RDS(on) = 0.38 Ω at VGS = 10 V and Tj = 25 °C, ultra-low gate charge (Qg = 49 nC), and periodic avalanche rating. It serves as a high-efficiency primary-side switch in offline SMPS, PFC stages, and industrial DC-DC converters.

For engineers reviewing the SPB12N50C3ATMA1 datasheet, SPB12N50C3ATMA1 pinout, SPB12N50C3ATMA1 application, or SPB12N50C3ATMA1 equivalent, key selection criteria include its 500 V VDS, 0.38 Ω RDS(on), 49 nC total gate charge, 125 W Ptot at TC = 25 °C, and robust dv/dt immunity (50 V/ns at Tj = 125 °C).

Technical Context

This device implements Infineon's third-generation CoolMOS™ superjunction technology optimized for hard-switched and resonant topologies. Its low effective output capacitance (Co(er) = 45 pF, Co(tr) = 92 pF) and high transconductance (gfs = 8 S) enable fast switching with reduced switching losses and improved EMI behavior.

The MOSFET integrates an optimized body diode with trr = 380 ns and Qrr = 5.5 µC at Tj = 25 °C, supporting ZVS-capable designs and reducing commutation losses in bridge configurations. Its thermal resistance RthJC = 1 K/W ensures efficient heat transfer to external heatsinks in high-power applications.

Key Specifications

ParameterValue and Actual Design Meaning
VDS500 V - Withstands 400 V DC-link voltage with 25 % margin in 380–400 V offline applications
RDS(on)0.38 Ω @ Tj = 25 °C - Enables ≤1.5 W conduction loss at 7 A continuous drain current
Qg49 nC - Reduces gate drive power and enables use with standard 1–2 A peak gate drivers
EAS340 mJ - Supports single-pulse avalanche operation under fault conditions without failure
dv/dt50 V/ns @ Tj = 125 °C - Resists parasitic turn-on in high-noise, high-speed switching environments
tr/tf8 ns / 8 ns - Minimizes switching transition time and associated energy loss in 65–100 kHz SMPS
RthJC1 K/W - Allows direct mounting to heatsink for thermal management in ≥100 W power stages

Pinout & Package

SPB12N50C3ATMA1 is housed in PG-TO263 (D²PAK) package with exposed drain pad for thermal and electrical connection. The package features three terminals: Gate (G), Drain (D), and Source (S), with Drain electrically connected to the metal tab.

Pin/TerminalCircuit RoleDesign Meaning
GGate control inputAccepts 0–10 V logic-level drive; requires <100 nA leakage current handling per IGSS spec
DHigh-voltage drain nodeConnected to PCB copper pour for thermal dissipation and high-current return path
SSource reference and current returnServes as local ground reference for gate driver; carries full load current (11.6 A continuous)

Key Features

FeatureDesign Value
Ultra-low gate chargeQg = 49 nC reduces gate driver power consumption and simplifies drive circuit design
Periodic avalanche ratedEAR = 0.6 mJ enables reliable operation under repetitive overvoltage transients in PFC circuits
Extreme dv/dt immunity50 V/ns rating prevents false triggering during fast voltage transitions in half-bridge topologies
Low effective output capacitanceCo(er) = 45 pF minimizes stored energy loss during hard-switching transitions
Optimized body diodetrr = 380 ns and Qrr = 5.5 µC reduce reverse recovery losses in synchronous rectification

Applications

Server Power SupplyIndustrial Motor Drive

Use Scenario: Primary-side switch in 80 PLUS Titanium-certified 1 kW server PSU using LLC resonant topology.

IC Role / Device Role / Timing Role: High-side switching element operating at 200–300 kHz with zero-voltage switching.

Use Value: Low Qg and Ciss = 1200 pF enable precise timing control and reduced dead-time loss.

Use Scenario: Inverter leg switch in 3-phase 7.5 kW variable frequency drive for HVAC compressors.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 16 kHz PWM inverter stage.

Use Value: 500 V rating and 11.6 A ID support 400 V AC input with safety margin; RDS(on) lowers conduction loss vs. older MOSFETs.

Photovoltaic InverterEV Onboard Charger

Use Scenario: DC-DC boost stage in string inverter converting 600–1000 V PV array output to 400 V DC bus.

IC Role / Device Role / Timing Role: Unidirectional high-voltage switch in interleaved boost converter with 50–100 kHz switching.

Use Value: Periodic avalanche rating handles lightning-induced surges; low Coss improves light-load efficiency.

Use Scenario: Isolated DC-DC stage in 6.6 kW OBC converting 400 V battery to 12 V auxiliary supply.

IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology operating at 100–200 kHz.

Use Value: 1 K/W RthJC supports compact heatsink integration; low Qgd/Qg ratio improves ZVS initiation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPP65R041C7650 V, RDS(on) = 0.041 Ω, Qg = 62 nC, TO-220FP packageHigher voltage rating but higher gate charge and larger RDS(on) at 500 V operation pointBetter for 600 V systems; less optimal for 400 V DC-link where SPB12N50C3ATMA1 offers lower conduction loss
STP12NM50N500 V, RDS(on) = 0.36 Ω, Qg = 55 nC, TO-220 package, no avalanche ratingLacks periodic avalanche capability and has higher gate chargeLower cost alternative where transient overvoltage protection is handled externally

Compared with IPP65R041C7 and STP12NM50N, SPB12N50C3ATMA1 delivers superior dv/dt immunity (50 V/ns), certified periodic avalanche performance, and lower gate charge-making it preferred for high-reliability, high-frequency 400–450 V DC-link applications requiring robustness and efficiency.

Availability

SPB12N50C3ATMA1 is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, photovoltaic inverters, and EV onboard chargers requiring stable component supply and long-term lifecycle support.

Supply support for SPB12N50C3ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The CoolMOS™ C3 product line targets high-efficiency, high-reliability power conversion in offline SMPS, PFC, and industrial inverters-designed to replace older planar MOSFETs with superior switching performance and ruggedness.

FAQ

What is the maximum continuous drain current for SPB12N50C3ATMA1 at 100 °C case temperature?

The maximum continuous drain current is 7 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the PG-TO263 package and ensures safe junction temperature operation below 150 °C under typical heatsink conditions.

Does SPB12N50C3ATMA1 have an integrated body diode, and what are its key recovery parameters?

Yes, it includes a monolithic body diode with trr = 380 ns and Qrr = 5.5 µC at Tj = 25 °C, VR = 400 V, and dIF/dt = 100 A/µs. These values are measured under standardized conditions and support design of snubberless or low-loss commutation circuits in bridge topologies.

Can SPB12N50C3ATMA1 be used in synchronous rectification applications?

No-it is not optimized for synchronous rectification due to its relatively high VSD (1.0–1.2 V) and moderate reverse recovery characteristics. Its body diode is intended for freewheeling and fault clamping, not bidirectional conduction; dedicated low-VF MOSFETs or Schottky diodes are recommended for SR stages.

What is the gate threshold voltage range, and how does it affect drive circuit design?

VGS(th) ranges from 2.1 V to 3.9 V at Tj = 25 °C. This narrow window ensures consistent turn-on behavior across temperature and process variation, allowing reliable operation with 5 V or 10 V gate drive-no negative bias is required, simplifying isolated gate driver selection.

SPB12N50C3ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
560 V
Current - Continuous Drain (Id) @ 25°C:
11.6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
380mOhm @ 7A, 10V
Vgs(th) (Max) @ Id:
3.9V @ 500µA
Gate Charge (Qg) (Max) @ Vgs:
49 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1200 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
125W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

SPB12N50C3ATMA1 FAQ

1.How can I place an order for SPB12N50C3ATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPB12N50C3ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPB12N50C3ATMA1 reliable?

The price and inventory of SPB12N50C3ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB12N50C3ATMA1 is usually 5 days.

3.What payment methods are accepted for SPB12N50C3ATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB12N50C3ATMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPB12N50C3ATMA1?

SPB12N50C3ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPB12N50C3ATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPB12N50C3ATMA1?

For technical support, including SPB12N50C3ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB12N50C3ATMA1 requirements.

6.How does Aetrix verify that SPB12N50C3ATMA1 is sourced from the original manufacturer or authorized distributors?

All SPB12N50C3ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB12N50C3ATMA1 meets industry standards.

7.What is the process for return or replacement of SPB12N50C3ATMA1?

All SPB12N50C3ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with SPB12N50C3ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPB12N50C3ATMA1 part is unused and in its original packaging.

Return procedure for SPB12N50C3ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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