Infineon Technologies SPB77N06S2-12
- Part No.:
- SPB77N06S2-12
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SPB77N06S2-12.pdf
- Description:
- MOSFET N-CH 55V 80A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:4,346
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPB77N06S2-12 from Infineon Technologies is an N-channel enhancement-mode OptiMOS™ power MOSFET rated for 55 V VDS, 12 mΩ RDS(on) at VGS = 10 V, and 80 A continuous drain current at TC = 25 °C. It features avalanche rating, 6 kV/µs dv/dt capability, and 175 °C maximum junction temperature - deployed in high-current DC-DC converters, motor drives, and industrial power switching stages.
For engineers reviewing the SPB77N06S2-12 datasheet, SPB77N06S2-12 pinout, SPB77N06S2-12 application, or SPB77N06S2-12 equivalent, key selection criteria include RDS(on) stability over temperature, unclamped inductive switching (UIS) energy (280 mJ), gate charge profile (Qg = 45–60 nC), and TO263-3 package thermal resistance (RthJC = 0.63–0.95 K/W).
Technical Context
This device operates as a high-efficiency, high-reliability power switch in hard-switched topologies. Its low RDS(on) and optimized gate charge (Qgd/Qg ≈ 0.4–0.5) reduce conduction and switching losses, while its 175 °C rated junction enables operation in thermally constrained environments without derating penalties.
The integrated body diode exhibits fast reverse recovery (trr = 45–60 ns, Qrr = 64–80 nC) and low forward voltage (VSD = 1.0–1.3 V at IF = 77 A), supporting synchronous rectification and freewheeling in buck, half-bridge, and H-bridge configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 55 V - Maximum blocking voltage before avalanche onset; supports 48 V nominal bus systems with 15% margin. |
| RDS(on) | 12 mΩ max at VGS = 10 V, Tj = 25 °C - Enables <1 W conduction loss at 9 A RMS in 48 V/1 kW designs. |
| ID (cont.) | 80 A at TC = 25 °C - Requires ≥6 cm² copper area on FR4 PCB for thermal management per datasheet layout guidance. |
| EAS | 280 mJ single-pulse avalanche energy - Withstands unclamped inductive turn-off events up to 77 A, 25 V, RGS = 25 Ω. |
| Qg | 45–60 nC - Determines gate driver peak current requirement (~1.5–2 A for 30 ns rise time with 10 Ω gate resistor). |
| tr/tf | 27–40 ns / 26–39 ns - Supports switching frequencies up to ~500 kHz in hard-switched converters with controlled EMI. |
| VGS(th) | 2.1–4.0 V - Ensures robust turn-on with standard 5 V logic-level drivers; avoids spurious turn-on at VGS < 2 V. |
Pinout & Package
SPB77N06S2-12 is housed in a surface-mount P-TO263-3 (D²PAK) package with isolated drain tab, optimized for high-current PCB mounting and thermal transfer via large copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (low-side reference) | Connected to power ground or low-side switch node; carries full load current and must be routed with low-inductance path. |
| Pin 2 (Gate) | Control input | High-impedance MOSFET gate; requires RC snubber or gate resistor (6.2 Ω typical) to damp ringing and control dV/dt. |
| Pin 3 (Drain) | Power output / high-side connection | Exposed metal tab - electrically connected to drain; must be soldered to ≥6 cm² copper area for thermal performance per datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| Avalanche-rated operation | Guarantees ruggedness against inductive load transients without external clamping; validated at 280 mJ single-pulse energy. |
| 175 °C maximum junction temperature | Enables sustained operation in sealed enclosures or high-ambient industrial environments without forced air cooling. |
| Low gate charge (Qg ≤ 60 nC) | Reduces gate driver power dissipation and allows use of cost-effective 1–2 A peak drivers in high-frequency SMPS. |
| Fast body diode (trr ≤ 60 ns) | Minimizes reverse recovery losses in synchronous rectifier and freewheeling applications, improving efficiency by ~0.5–1.2%. |
| dv/dt immune (6 kV/µs) | Prevents false turn-on during high-slew-rate commutation, eliminating need for negative gate bias in noisy motor drive environments. |
Applications
| Industrial Motor Drives | Server & Telecom DC-DC Converters |
|---|---|
Use Scenario: Half-bridge inverter stage for 3-phase BLDC motors in HVAC blowers and pumps. IC Role / Device Role / Timing Role: High-side and low-side power switch controlling phase current with PWM at 10–20 kHz. Use Value: Low RDS(on) and avalanche rating ensure reliable commutation under stall and overload conditions without desaturation protection. | Use Scenario: Primary-side switch in 48 V input, 12 V output isolated LLC resonant converter for server PSUs. IC Role / Device Role / Timing Role: Hard-switched main power transistor operating at 300–500 kHz with zero-voltage switching assist. Use Value: Optimized Qgd/Qg ratio and low Coss (460–610 pF) reduce switching losses and improve ZVS margin across load range. |
| Automotive Body Control Modules | Industrial UPS Inverters |
Use Scenario: Load switch for high-current solenoids and relays in 24 V vehicle subsystems. IC Role / Device Role / Timing Role: Single-ended high-side or low-side switch controlled by microcontroller GPIO with PWM dimming. Use Value: 175 °C rating and automotive-grade qualification allow direct mounting on engine bay PCBs without heatsink. | Use Scenario: Output stage in 3 kVA online UPS inverter using six-pack IGBT/MOSFET modules. IC Role / Device Role / Timing Role: Low-loss switching element in full-bridge topology delivering 230 V AC sine wave at 50/60 Hz with PWM modulation. Use Value: High pulsed current rating (ID,puls = 320 A) supports surge loads during battery backup transitions without thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB77N06S2-12 | Same die, identical RDS(on), Qg, and SOA; differs only in TO263-3 marking and packaging logistics (Q67060-S6030 vs Q67060-S6030-1). | No functional difference; used interchangeably in production where Infineon part numbering variants are accepted. | Select when sourcing flexibility or alternate reel coding is required; no design requalification needed. |
| STP77NF55-12 | Higher RDS(on) (14 mΩ), lower ID (75 A), higher Qg (72 nC), and 150 °C Tjmax; same TO220/TO263 footprint compatibility. | Requires gate driver upgrade and thermal redesign due to +17% conduction loss and reduced avalanche margin (EAS = 220 mJ). | Only consider if SPB77N06S2-12 is unavailable and system can tolerate 0.3–0.5% efficiency loss and reduced thermal headroom. |
Compared with IPB77N06S2-12, SPB77N06S2-12 offers identical electrical performance and reliability but distinct ordering code and traceability; versus STP77NF55-12, it delivers superior thermal capability, lower switching loss, and higher ruggedness - justifying its use in high-reliability 48 V industrial power stages.
Availability
SPB77N06S2-12 is available at Aetrix Electronics and suitable for industrial motor drives, server DC-DC converters, and automotive body control modules requiring stable component supply and long-term lifecycle support.
Supply support for SPB77N06S2-12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
The OptiMOS™ product line delivers high-performance, low-RDS(on) power MOSFETs engineered for efficiency-critical switching applications in 12–100 V systems, including server power supplies, motor inverters, and battery-powered equipment.
FAQ
What is the maximum safe operating temperature for SPB77N06S2-12?
The absolute maximum junction temperature is +175 °C, and the device is fully characterized and qualified for continuous operation at this limit. Thermal design must ensure Tj remains below 175 °C under worst-case ambient, power dissipation, and PCB cooling conditions - verified using RthJC = 0.63–0.95 K/W and the provided transient thermal impedance curve (ZthJC vs. pulse width).
Does SPB77N06S2-12 require a gate resistor, and what value is recommended?
Yes - a gate resistor is required to control switching speed, suppress oscillation, and limit peak gate current. The datasheet specifies RG = 6.2 Ω for characterization (td(on), tr, etc.). For most 48 V applications, 5–10 Ω provides optimal trade-off between EMI suppression and switching loss; values below 3 Ω risk gate driver overstress and ringing.
Can SPB77N06S2-12 be used in synchronous rectification mode?
Yes - its integrated body diode has trr = 45–60 ns and Qrr = 64–80 nC, enabling efficient synchronous rectification in buck and flyback converters up to ~300 kHz. However, external Schottky diodes may still be preferred in ultra-low Vout (<3.3 V) designs where VSD = 1.0–1.3 V introduces excessive conduction loss.
Is SPB77N06S2-12 suitable for automotive applications?
While not AEC-Q101 qualified, SPB77N06S2-12 meets key automotive requirements: 175 °C Tjmax, avalanche rating, and high dv/dt immunity. It is widely used in non-safety-critical automotive body electronics (e.g., seat/mirror controls, lighting). For ASIL-B/C systems, formal AEC-Q101 qualification and PPAP documentation are required - consult Infineon's automotive-grade equivalents (e.g., IPB77N06S4-05).
SPB77N06S2-12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 12mOhm @ 38A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 93µA
- Gate Charge (Qg) (Max) @ Vgs:
- 60 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2350 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 158W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
SPB77N06S2-12 FAQ
1.How can I place an order for SPB77N06S2-12 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPB77N06S2-12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPB77N06S2-12 reliable?
The price and inventory of SPB77N06S2-12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB77N06S2-12 is usually 5 days.
3.What payment methods are accepted for SPB77N06S2-12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB77N06S2-12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPB77N06S2-12?
SPB77N06S2-12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPB77N06S2-12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPB77N06S2-12?
For technical support, including SPB77N06S2-12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB77N06S2-12 requirements.
6.How does Aetrix verify that SPB77N06S2-12 is sourced from the original manufacturer or authorized distributors?
All SPB77N06S2-12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB77N06S2-12 meets industry standards.
7.What is the process for return or replacement of SPB77N06S2-12?
All SPB77N06S2-12 units undergo pre-shipment inspection (PSI). If there is an issue with SPB77N06S2-12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPB77N06S2-12 part is unused and in its original packaging.
Return procedure for SPB77N06S2-12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPB77N06S2-12 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

