Infineon Technologies SPB80N03S203GATMA1
- Part No.:
- SPB80N03S203GATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SPB80N03S203GATMA1.pdf
- Description:
- MOSFET N-CH 30V 80A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPB80N03S203GATMA1 from Infineon Technologies is an N-channel enhancement-mode OptiMOS™ power MOSFET in TO-263-3 (D²PAK) package, rated for 30 V VDS, 80 A continuous drain current at TC = 25 °C, and 2.3 mΩ typical RDS(on) at VGS = 10 V. It features 175 °C maximum junction temperature, avalanche rating (EAS = 810 mJ), and dv/dt ruggedness (6 kV/µs), designed for high-efficiency DC-DC converters and motor drive half-bridges.
For engineers reviewing the SPB80N03S203GATMA1 datasheet, SPB80N03S203GATMA1 pinout, SPB80N03S203GATMA1 application, or SPB80N03S203GATMA1 equivalent, key selection criteria include its low gate charge × RDS(on) figure of merit (Qg = 110–150 nC, RDS(on) ≤ 3.1 mΩ), thermal resistance (RthJC = 0.3–0.5 K/W), and integrated body diode with trr = 65–80 ns and Qrr = 87–110 nC.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low conduction and switching losses in high-current, high-frequency synchronous rectification and PWM motor control. Its gate threshold voltage (VGS(th) = 2.1–4.0 V) ensures robust turn-on with standard 5 V or 10 V logic-level drivers, while the 66–132 S transconductance supports fast current slew rates under heavy load.
The device integrates a monolithic body diode with controlled reverse recovery characteristics-Qrr ≤ 110 nC and trr ≤ 80 ns-enabling reliable operation in hard-switched topologies without external snubbers. Thermal design is supported by validated transient impedance curves and a 0.5 K/W max junction-to-case resistance under PCB mounting per JEDEC standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 24 V nominal bus systems with margin against transients. |
| RDS(on) max | 3.1 mΩ at VGS = 10 V, ID = 80 A - Enables <1.9 W conduction loss at full current, critical for thermally constrained PCB layouts. |
| ID cont | 80 A at TC = 25 °C - Supports high-current phases in BLDC motor drives and server VRMs without paralleling. |
| EAS | 810 mJ single-pulse avalanche energy - Withstands inductive turn-off surges in relay drivers and solenoid controls without failure. |
| dv/dt rating | 6 kV/µs - Ensures immunity to false turn-on during fast voltage transients in noisy industrial environments. |
| Qg | 110–150 nC - Balances switching speed and gate driver power loss for 100–500 kHz operation in LLC resonant converters. |
| tr/tf | 325–490 ns / 110–160 ns - Enables clean edge transitions with minimal EMI generation in Class-D audio amplifiers. |
Pinout & Package
SPB80N03S203GATMA1 is housed in a surface-mount TO-263-3 (D²PAK) package with exposed drain pad for thermal conduction. The package complies with JEDEC MO-211 and supports solder reflow per IPC-J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Low-side reference node; connects to ground or low-side switch node; carries full load current in low-side configuration. |
| Pin 2 (Gate) | Control input (G) | High-impedance MOSFET gate; requires <150 nC charge for full enhancement; sensitive to ESD (±20 V absolute max). |
| Pin 3 (Drain) | Power output (D) | Exposed copper pad on backside; primary heat path to PCB; electrically connected to drain; must be routed with minimum trace inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized FOM (Qg × RDS(on)) | ≤ 465 nC·mΩ - Reduces total switching + conduction loss in high-frequency SMPS, improving efficiency >95% at 200 kHz. |
| 175 °C operating temperature | Junction-rated for extended life in sealed enclosures or high-ambient automotive under-hood zones. |
| Avalanche-rated (EAS) | 810 mJ tested - Eliminates need for external clamping in inductive load switching, reducing BOM count. |
| Low RthJC | 0.3 K/W typ - Enables 300 W power dissipation with <15 °C rise above heatsink, supporting compact thermal design. |
| Fast body diode (trr) | 65–80 ns - Minimizes reverse recovery loss in synchronous buck converters, especially at light loads. |
Applications
| Motor Drive Half-Bridge | Server VRM High-Side Switch |
|---|---|
Use Scenario: Driving 24 V brushed DC or 3-phase BLDC motors in industrial automation actuators with PWM frequencies up to 25 kHz. IC Role / Device Role / Timing Role: Low-side switching element in half-bridge topology; handles bidirectional current during PWM commutation and regenerative braking. Use Value: 2.3 mΩ RDS(on) limits I²R loss to <15 W at 80 A peak, enabling air-cooled designs without forced convection. |
Use Scenario: High-current phase-leg switch in 48 V–12 V intermediate bus converters for AI accelerator cards. IC Role / Device Role / Timing Role: High-side synchronous rectifier in multiphase buck converter; switched at 300–500 kHz with precise dead-time control. Use Value: 110–150 nC Qg allows gate drive with <2 W loss using discrete 2 A drivers, maintaining >94% efficiency at 100 A output. |
| Automotive HVAC Blower Control | Industrial Solenoid Driver |
Use Scenario: PWM-controlled blower fan in vehicle cabin HVAC systems, operating continuously at ambient up to 105 °C. IC Role / Device Role / Timing Role: Low-side power switch interfacing microcontroller GPIO; subjected to load dump and jump-start transients. Use Value: 6 kV/µs dv/dt rating prevents spurious turn-on during alternator load dump (ISO 7637-2 Pulse 5a), eliminating latch-up risk. |
Use Scenario: Driving 24 V DC solenoids in factory pneumatic valves with 100 ms on-time and 10 Hz cycling. IC Role / Device Role / Timing Role: Single-ended switch with integrated freewheeling path; absorbs inductive kickback during turn-off. Use Value: 810 mJ EAS withstands repetitive 25 V × 80 A inductive spikes without derating, removing need for TVS or flyback diode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF8720PbF | RDS(on) = 4.0 mΩ (max), Qg = 22 nC, TO-220 package, no avalanche rating | Limited to lower-current (<60 A) and non-avalanche-critical circuits; higher thermal resistance (RthJC = 1.2 K/W) | Choose when cost sensitivity outweighs thermal performance and surge robustness. |
| STL220N3LLH6 | RDS(on) = 2.2 mΩ (typ), Qg = 125 nC, PowerFLAT 5x6 package, 175 °C rated, no published EAS | Suitable for space-constrained SMT-only designs but lacks validated avalanche capability for inductive loads | Prefer for ultra-compact DC-DC modules where board area is critical and inductive stress is managed externally. |
Compared with IRF8720PbF and STL220N3LLH6, SPB80N03S203GATMA1 uniquely combines sub-3 mΩ RDS(on), 810 mJ avalanche rating, and 0.5 K/W thermal resistance in a D²PAK package-making it optimal for high-reliability, high-power industrial switching where both efficiency and ruggedness are mandatory.
Availability
SPB80N03S203GATMA1 is available at Aetrix Electronics and suitable for motor drive half-bridges, server VRM phase-legs, and automotive HVAC blower control requiring stable component supply across multi-year production cycles.
Supply support for SPB80N03S203GATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q101.
This device belongs to the OptiMOS™ 3rd generation power MOSFET product line, engineered specifically for high-current, high-efficiency switching in automotive body electronics, industrial motor drives, and computing power supplies.
FAQ
What is the maximum safe operating temperature for SPB80N03S203GATMA1?
The device is rated for continuous operation up to Tj = 175 °C, verified per JEDEC JESD22-A108. Derating begins at TC > 25 °C per the ID vs. TC curve on page 4 of the datasheet; at TC = 100 °C, continuous current drops to ~45 A. Thermal design must maintain case temperature below 125 °C for 10-year reliability in industrial use.
Does SPB80N03S203GATMA1 require a gate resistor for stability?
Yes-a series gate resistor (RG = 2.2 Ω typical) is recommended to dampen ringing and limit peak gate current during switching, as confirmed in the dynamic test conditions (td(on), tr, etc.) on page 3. Without it, parasitic inductance may cause oscillation or overshoot exceeding ±20 V VGS rating, risking gate oxide damage.
Can SPB80N03S203GATMA1 replace older OptiMOS 2nd-gen parts like SPB80N03S2L-03?
No-SPB80N03S203GATMA1 is not a drop-in replacement for SPB80N03S2L-03 due to differences in gate threshold (2.1–4.0 V vs. 1.8–3.2 V) and RDS(on) distribution (3.1 mΩ max vs. 3.5 mΩ max). Layout and drive strength must be revalidated; gate drive timing margins change by ±15 ns per the td(on)/td(off) specs.
Is the body diode suitable for synchronous rectification in buck converters?
Yes-the integrated body diode has trr = 65–80 ns and Qrr = 87–110 nC, enabling efficient synchronous rectification up to 300 kHz. However, for best light-load efficiency, external Schottky diodes remain preferred; this MOSFET's diode is optimized for robustness-not ultra-low VSD-with VSD = 0.9–1.3 V at 80 A.
SPB80N03S203GATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3.1mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 150 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 7020 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
SPB80N03S203GATMA1 FAQ
1.How can I place an order for SPB80N03S203GATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPB80N03S203GATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPB80N03S203GATMA1 reliable?
The price and inventory of SPB80N03S203GATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB80N03S203GATMA1 is usually 5 days.
3.What payment methods are accepted for SPB80N03S203GATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB80N03S203GATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPB80N03S203GATMA1?
SPB80N03S203GATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPB80N03S203GATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPB80N03S203GATMA1?
For technical support, including SPB80N03S203GATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB80N03S203GATMA1 requirements.
6.How does Aetrix verify that SPB80N03S203GATMA1 is sourced from the original manufacturer or authorized distributors?
All SPB80N03S203GATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB80N03S203GATMA1 meets industry standards.
7.What is the process for return or replacement of SPB80N03S203GATMA1?
All SPB80N03S203GATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with SPB80N03S203GATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPB80N03S203GATMA1 part is unused and in its original packaging.
Return procedure for SPB80N03S203GATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPB80N03S203GATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

