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Infineon Technologies SPB80N06S2-09

Part No.:
SPB80N06S2-09
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSPB80N06S2-09.pdf
Description:
MOSFET N-CH 55V 80A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,931

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Product details

Overview

SPB80N06S2-09 from Infineon Technologies is an N-channel enhancement-mode OptiMOS™ power MOSFET rated for 55 V VDS, 9.1 mΩ RDS(on) at VGS = 10 V, and 80 A continuous drain current at TC = 25 °C. It features avalanche rating, 6 kV/µs dv/dt capability, and 175 °C maximum junction temperature - deployed in high-current DC-DC converters, motor drives, and industrial power switches.

For engineers reviewing the SPB80N06S2-09 datasheet, SPB80N06S2-09 pinout, SPB80N06S2-09 application, or SPB80N06S2-09 equivalent, key selection criteria include RDS(on) vs. temperature stability, safe operating area (SOA) under pulsed load, gate charge profile for switching loss estimation, and TO263-3 thermal performance on PCB copper area.

Technical Context

This MOSFET uses trench-gate silicon technology optimized for low conduction and switching losses in hard-switched topologies. Its 7.6–9.1 mΩ RDS(on) range reflects process variation at 25 °C with VGS = 10 V, and RDS(on) increases to ~18 mΩ at Tj = 175 °C per Figure 9 - critical for thermal design margining.

The device integrates a robust body diode with 0.9–1.3 V VSD at IF = 80 A and 50–63 ns trr, enabling synchronous rectification and freewheeling in buck and half-bridge configurations without external Schottky supplementation.

Key Specifications

ParameterValue and Actual Design Meaning
VDS55 V - Maximum blocking voltage before avalanche onset; defines upper limit for bus voltage in 48 V systems.
RDS(on)9.1 mΩ max at VGS = 10 V, Tj = 25 °C - Determines conduction loss: ~5.8 W at 80 A DC, requiring heatsinking.
ID (cont)80 A at TC = 25 °C - Valid only with case temperature maintained at 25 °C; derates to ~70 A at TC = 100 °C.
EAS370 mJ single-pulse avalanche energy - Enables unclamped inductive switching survival in relay drivers or solenoid controls.
Qg60–80 nC total gate charge - Directly impacts gate driver power and switching speed; requires ≥2 A peak drive for <50 ns rise/fall.
RthJC0.52–0.8 K/W - Junction-to-case thermal resistance defines minimum heatsink interface requirement for 190 W Ptot.
tr/tf29–44 ns / 28–42 ns - Fast switching enables >200 kHz operation in resonant and hard-switched SMPS designs.

Pinout & Package

SPB80N06S2-09 is housed in a surface-mount TO263-3 (D²PAK) package with exposed drain pad for thermal and electrical connection. The package supports high-current PCB mounting using ≥6 cm² copper area per Figure 2 footnote 3.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminal (S)Low-side reference node; connects to ground or low-side switch node; carries full load current.
Pin 2 (Gate)Control input (G)High-impedance MOSFET control node; requires 10 V for full enhancement; sensitive to ESD.
Pin 3 (Drain)Power output (D)Exposed metal pad - electrically and thermally connected to drain; must be soldered to large copper pour.

Key Features

FeatureDesign Value
Avalanche-rated operation370 mJ single-pulse energy tolerance enables reliable unclamped inductive turn-off without snubbers.
175 °C maximum junction temperatureSupports operation in sealed enclosures or high-ambient environments without derating to 150 °C.
dv/dt ruggedness6 kV/µs immunity prevents false turn-on during fast voltage transients in motor drive half-bridges.
Low gate charge (Qg)60–80 nC reduces gate driver losses and simplifies selection of cost-effective 2 A drivers like IRS2007.
Optimized body diode50–63 ns reverse recovery time and 76–95 nC Qrr enable efficient freewheeling in synchronous rectifiers.

Applications

Motor Drive InverterIndustrial DC-DC Converter

Use Scenario: 3-phase BLDC inverter stage in HVAC compressors or conveyor drives operating at 48 V bus.

IC Role / Device Role / Timing Role: Low-side switching element in 6-pack IGBT/MOSFET module; handles 80 A peak phase current.

Use Value: 9.1 mΩ RDS(on) minimizes conduction loss at 25 °C; SOA curve supports 1 ms overload pulses up to 320 A.

Use Scenario: Primary-side synchronous rectifier in isolated 48 V → 12 V telecom DC-DC module.

IC Role / Device Role / Timing Role: High-efficiency secondary-side switch replacing Schottky diodes; driven by transformer-coupled gate signal.

Use Value: Body diode VSD = 0.9–1.3 V and trr = 50–63 ns reduce forward and recovery losses versus discrete diodes.

Automotive Battery DisconnectUPS Power Switch

Use Scenario: High-side battery protection switch in 48 V mild-hybrid vehicle subsystems.

IC Role / Device Role / Timing Role: Load switch controlling power to ADAS ECUs; activated via isolated gate driver.

Use Value: Avalanche rating ensures survivability during load dump transients; 175 °C rating accommodates under-hood ambient.

Use Scenario: Static transfer switch in online UPS handling 3 kW backup load.

IC Role / Device Role / Timing Role: Bidirectional power path switch enabling seamless mains/battery switchover.

Use Value: 320 A pulsed current rating supports short-circuit ride-through; low RDS(on) limits thermal stress during extended overload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPB80N06S2-09Same die, identical RDS(on), Qg, and SOA; differs only in TO263-3 marking and ordering code.No functional difference; qualified for same automotive and industrial use cases.Select when sourcing from alternate Infineon distribution channels or legacy BOM alignment required.
STP80NF55-0855 V VDS, 8.5 mΩ RDS(on), but higher Qg (105 nC) and lower EAS (250 mJ).Limited avalanche robustness and slower switching make it less suitable for inductive loads with high di/dt.Consider only if gate drive capability exceeds 3 A and avalanche stress is absent in system topology.

Compared with IPB80N06S2-09, SPB80N06S2-09 offers identical performance and qualification - differing only in packaging traceability; versus STP80NF55-08, it delivers superior dv/dt immunity and avalanche energy margin at the cost of slightly higher gate drive demand.

Availability

SPB80N06S2-09 is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and automotive battery management systems requiring stable component supply and long-term lifecycle support.

Supply support for SPB80N06S2-09 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global manufacturing and R&D centers.

SPB80N06S2-09 belongs to the OptiMOS™ 2nd generation power MOSFET product line, engineered for high-efficiency, high-current switching in industrial and automotive power conversion systems.

FAQ

What is the maximum allowable gate-source voltage for SPB80N06S2-09?

The absolute maximum VGS is ±20 V per datasheet Page 1. Operation beyond ±20 V risks permanent gate oxide damage. Recommended drive is 10–15 V for full enhancement with margin; gate resistors should limit dV/dt to avoid oscillation during switching transitions.

Can SPB80N06S2-09 be used in parallel configurations?

Yes - its positive temperature coefficient of RDS(on) (Figure 6) enables current sharing across paralleled units. Thermal coupling between devices must be matched, and individual gate resistors (≥10 Ω) are required to suppress oscillation and ensure simultaneous turn-on/turn-off.

Is SPB80N06S2-09 suitable for linear mode operation?

No - it is not characterized or guaranteed for linear (active region) operation. The Safe Operating Area (SOA) curve on Page 4 applies only to switching conditions; sustained linear operation risks thermal runaway due to localized hot-spot formation in the trench cell structure.

What PCB layout recommendations apply to the TO263-3 package?

The drain pad must be connected to ≥6 cm² of 70 µm thick copper on FR4 (per Page 2 footnote 3), with thermal vias to inner/ground planes. Source and gate traces require low-inductance routing; gate loop area should be minimized to reduce EMI and ringing. A 100 nF ceramic decoupling capacitor must be placed within 5 mm of the source pin.

SPB80N06S2-09 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
55 V
Current - Continuous Drain (Id) @ 25°C:
80A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
9.1mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
4V @ 125µA
Gate Charge (Qg) (Max) @ Vgs:
80 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3140 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
190W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

SPB80N06S2-09 FAQ

1.How can I place an order for SPB80N06S2-09 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPB80N06S2-09 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPB80N06S2-09 reliable?

The price and inventory of SPB80N06S2-09 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB80N06S2-09 is usually 5 days.

3.What payment methods are accepted for SPB80N06S2-09?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB80N06S2-09 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPB80N06S2-09?

SPB80N06S2-09 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPB80N06S2-09 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPB80N06S2-09?

For technical support, including SPB80N06S2-09 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB80N06S2-09 requirements.

6.How does Aetrix verify that SPB80N06S2-09 is sourced from the original manufacturer or authorized distributors?

All SPB80N06S2-09 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB80N06S2-09 meets industry standards.

7.What is the process for return or replacement of SPB80N06S2-09?

All SPB80N06S2-09 units undergo pre-shipment inspection (PSI). If there is an issue with SPB80N06S2-09, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPB80N06S2-09 part is unused and in its original packaging.

Return procedure for SPB80N06S2-09:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPB80N06S2-09 Tags

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