Infineon Technologies SPD30N03S2L-07
- Part No.:
- SPD30N03S2L-07
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SPD30N03S2L-07.pdf
- Description:
- MOSFET N-CH 30V 30A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:8,094
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPD30N03S2L-07 from Infineon Technologies is a 30 V, 30 A N-channel logic-level OptiMOS™ power MOSFET in TO-252 (DPAK) package, featuring 6.7 mΩ RDS(on) at VGS = 10 V, 175 °C maximum junction temperature, and avalanche-rated operation. It serves as a high-efficiency synchronous rectifier or main switch in DC-DC converters for telecom power supplies.
For engineers reviewing the SPD30N03S2L-07 datasheet, SPD30N03S2L-07 pinout, SPD30N03S2L-07 application, or SPD30N03S2L-07 equivalent, key selection criteria include RDS(on) at 4.5 V (7.4 mΩ typ), gate charge (Qg = 51–68 nC), thermal resistance (RthJC = 0.7–1.1 K/W), and dv/dt rating (6 kV/µs).
Technical Context
This device employs an optimized trench-gate silicon process to achieve low gate charge × RDS(on) figure-of-merit (FOM) and superior thermal performance. Its logic-level gate threshold (VGS(th) = 1.2–2.0 V) enables direct drive from 3.3 V or 5 V microcontrollers without level-shifting.
The MOSFET integrates a robust body diode with trr = 41–51 ns and Qrr = 46–58 nC, supporting high-frequency hard-switched topologies. Avalanche energy rating (EAS = 250 mJ) and dv/dt immunity (6 kV/µs) ensure ruggedness in inductive load switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; suitable for 24 V nominal bus systems with margin. |
| RDS(on) @ VGS = 10 V | 6.7 mΩ max - Enables ≤1.5 W conduction loss at 30 A continuous current. |
| RDS(on) @ VGS = 4.5 V | 9.8 mΩ max - Ensures reliable turn-on with standard logic-level drivers (e.g., MCU GPIO). |
| Qg | 68 nC max - Determines gate drive power requirement and switching speed in 100–500 kHz converters. |
| Tj max | 175 °C - Supports operation in sealed enclosures or high-ambient industrial environments. |
| EAS | 250 mJ - Withstands single-pulse inductive energy without failure in motor gate-drive or solenoid control. |
| dv/dt rating | 6 kV/µs - Prevents spurious turn-on during fast voltage transients in half-bridge configurations. |
Pinout & Package
Package: TO-252-3-11 (DPAK), surface-mount, single-drain-tab configuration with exposed drain pad for thermal enhancement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Reference node for gate drive; connects to low-side return path and PCB ground plane. |
| Pin 2 (Gate) | Control input | High-impedance MOS gate requiring <100 nA leakage; driven via series resistor to damp ringing. |
| Pin 3 (Drain) | Power output | Exposed copper tab - must be soldered to ≥6 cm² copper pour for RthJA ≤50 K/W. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) = 1.2–2.0 V enables direct interface with 3.3 V/5 V controllers without external level shifters. |
| Low FOM (Qg × RDS(on)) | ~360–450 mΩ·nC - Reduces combined switching + conduction losses in high-frequency SMPS. |
| Avalanche-rated | 250 mJ single-pulse EAS - Eliminates need for external snubbers in relay or motor coil driving. |
| Enhanced thermal resistance | RthJC = 0.7 K/W typ - Allows >100 W power dissipation with minimal heatsink in compact layouts. |
| dv/dt immune | 6 kV/µs rated - Prevents false triggering in noisy half-bridge or phase-leg applications. |
Applications
| DC-DC Buck Converter | Automotive Body Control Module |
|---|---|
Use Scenario: 12 V input to 3.3 V/5 V point-of-load regulation in server VRMs. IC Role / Device Role / Timing Role: Synchronous high-side switch operating at 300–500 kHz with 30 A peak current. Use Value: 6.7 mΩ RDS(on) reduces conduction loss by >35% vs. comparable 8 mΩ devices, improving full-load efficiency by 0.8–1.2%. | Use Scenario: Power distribution to door locks, window lifts, and lighting in 12 V vehicle architectures. IC Role / Device Role / Timing Role: Low-side load switch controlled by CAN/LIN microcontroller GPIO pins. Use Value: Logic-level VGS(th) ensures full enhancement at 3.3 V MCU outputs, eliminating external driver ICs and saving board space. |
| Industrial Motor Gate Driver | Telecom Hot-Swap Circuit |
Use Scenario: Half-bridge leg in 24 V BLDC motor controller for HVAC blowers. IC Role / Device Role / Timing Role: High-speed switching element with 6 kV/µs dv/dt immunity to suppress shoot-through risk. Use Value: Robust avalanche rating (250 mJ) absorbs inductive kickback during PWM dead-time, increasing system reliability without added clamping diodes. | Use Scenario: Inrush current limiting and fault isolation in 48 V telecom rectifier shelves. IC Role / Device Role / Timing Role: Main pass transistor in hot-swap controller IC reference design (e.g., TPS2375x). Use Value: 175 °C Tj max and 136 W Ptot support sustained 30 A operation under ambient temperatures up to 85 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PbF | RDS(on) = 8.0 mΩ @ 10 V; Qg = 62 nC; TO-220 package | Higher RthJA (62 K/W) limits power density; requires heatsink for >15 A continuous | Prefer when through-hole mounting or legacy footprint compatibility is required. |
| BSC014N04LS6 | RDS(on) = 1.4 mΩ @ 10 V; Qg = 42 nC; SuperSO8 package | Lower voltage rating (40 V); not avalanche-rated; unsuitable for inductive switching stress | Choose only for ultra-low-loss 24 V buck stages where avalanche robustness is not needed. |
Compared with IRL3803PbF and BSC014N04LS6, SPD30N03S2L-07 uniquely balances low RDS(on), logic-level drive, avalanche ruggedness, and DPAK thermal performance-making it optimal for space-constrained, high-reliability 24–30 V industrial and telecom power stages.
Availability
SPD30N03S2L-07 is available at Aetrix Electronics and suitable for DC-DC converters, automotive body electronics, industrial motor drives, and telecom hot-swap circuits requiring stable component supply across multi-year production cycles.
Supply support for SPD30N03S2L-07 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
This part belongs to the OptiMOS™ 30 V product line, engineered specifically for high-efficiency, high-current switching in 12–24 V power conversion and load switching applications.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
At TC = 100 °C, the maximum continuous drain current is 24 A, as defined by the derating curve on Page 4 of the datasheet. This value assumes proper PCB thermal design with ≥6 cm² copper area and accounts for RDS(on) increase with temperature.
Does SPD30N03S2L-07 require a gate resistor for safe operation?
Yes-a gate resistor (typically 5–22 Ω) is required to control dV/dt and prevent oscillation during switching. The device's gate resistance (RG = 2.3 Ω typ) alone is insufficient to damp ringing caused by PCB trace inductance and driver output impedance.
Can this MOSFET replace a standard 30 V Schottky diode in synchronous rectification?
Yes-its low RDS(on) (6.7 mΩ) yields lower forward voltage drop than a 30 V Schottky at currents above ~3 A. Combined with its integrated body diode (VSD = 0.9–1.3 V), it enables efficient synchronous rectification in buck and flyback topologies up to 500 kHz.
Is the TO-252 package lead-free and RoHS-compliant?
Yes-SPD30N03S2L-07 is manufactured per Infineon's qualified lead-free process and meets RoHS Directive 2011/65/EU requirements. The package uses matte tin plating on leads and complies with JEDEC J-STD-020 moisture sensitivity level MSL3.
SPD30N03S2L-07 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.7mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 85µA
- Gate Charge (Qg) (Max) @ Vgs:
- 68 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2530 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-11
SPD30N03S2L-07 FAQ
1.How can I place an order for SPD30N03S2L-07 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPD30N03S2L-07 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPD30N03S2L-07 reliable?
The price and inventory of SPD30N03S2L-07 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPD30N03S2L-07 is usually 5 days.
3.What payment methods are accepted for SPD30N03S2L-07?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPD30N03S2L-07 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPD30N03S2L-07?
SPD30N03S2L-07 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPD30N03S2L-07 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPD30N03S2L-07?
For technical support, including SPD30N03S2L-07 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPD30N03S2L-07 requirements.
6.How does Aetrix verify that SPD30N03S2L-07 is sourced from the original manufacturer or authorized distributors?
All SPD30N03S2L-07 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPD30N03S2L-07 meets industry standards.
7.What is the process for return or replacement of SPD30N03S2L-07?
All SPD30N03S2L-07 units undergo pre-shipment inspection (PSI). If there is an issue with SPD30N03S2L-07, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPD30N03S2L-07 part is unused and in its original packaging.
Return procedure for SPD30N03S2L-07:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPD30N03S2L-07 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

