Infineon Technologies SPD50N03S2L-06
- Part No.:
- SPD50N03S2L-06
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SPD50N03S2L-06.pdf
- Description:
- MOSFET N-CH 30V 50A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:9,842
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPD50N03S2L-06 from Infineon Technologies is an N-channel enhancement-mode logic-level power MOSFET rated for 30 V VDS, 6.4 mΩ RDS(on) at VGS = 10 V and 50 A continuous drain current at TC = 25 °C, designed for high-efficiency DC-DC conversion and motor drive stages in industrial power supplies.
For engineers reviewing the SPD50N03S2L-06 datasheet, SPD50N03S2L-06 pinout, SPD50N03S2L-06 application, or SPD50N03S2L-06 equivalent, key selection criteria include gate threshold voltage (1.2–2.0 V), avalanche energy rating (250 mJ), thermal resistance (0.7–1.1 K/W junction-to-case), and logic-level gate drive compatibility with 3.3 V/5 V microcontrollers.
Technical Context
This OptiMOS™ device uses trench-gate silicon technology optimized for low gate charge × RDS(on) figure-of-merit (FOM), enabling fast switching with reduced conduction and switching losses. Its 175 °C maximum junction temperature and avalanche-rated construction support robust operation under transient overloads and repetitive stress conditions.
The MOSFET features a built-in body diode with 50 A continuous forward current capability, 0.9–1.3 V forward voltage at 50 A, and 41–51 ns reverse recovery time - critical for synchronous rectification and freewheeling paths in buck converters and H-bridge motor drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage compatible with 24 V nominal bus systems and automotive 12 V/24 V applications. |
| RDS(on) @ VGS = 10 V | 6.4 mΩ max - Enables <1.6 W conduction loss at 50 A, supporting high-current, low-voltage power stages. |
| ID continuous @ TC = 25 °C | 50 A - Sustained output current capacity when mounted on heatsink; derates to ~35 A at TC = 100 °C per curve. |
| EAS | 250 mJ single-pulse - Withstands inductive turn-off energy without failure, reducing need for external snubbers. |
| Qg | 68 nC max - Low total gate charge enables efficient 100–500 kHz switching with standard gate drivers (e.g., IR2110, UCC27531). |
| RthJC | 1.1 K/W max - Junction-to-case thermal resistance allows direct mounting to heatsinks; supports >100 W power dissipation with adequate cooling. |
| VGS(th) | 1.2–2.0 V - Logic-level threshold ensures full enhancement with 3.3 V MCU GPIOs and eliminates need for level-shifting. |
Pinout & Package
SPD50N03S2L-06 is housed in PG-TO252-3-11 (DPAK) surface-mount package with exposed drain pad for thermal and electrical connection. The package features three terminals: Gate (G), Source (S), and Drain (D), where Drain is internally connected to the large copper tab on the bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate control input | Accepts logic-level voltage (0–10 V); requires <68 nC charge for full turn-on; sensitive to ESD (±20 V max rating). |
| S | Source reference node | Common return path for load current; ties to ground or low-side switch node; defines VGS reference. |
| D | Drain power terminal | High-current output node; electrically and thermally connected to PCB copper pour; carries full load current and dissipates heat. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) ≤ 2.0 V enables direct interface with 3.3 V/5 V microcontrollers and FPGA I/O without gate driver ICs. |
| Avalanche rated | 250 mJ single-pulse EAS ensures reliable operation during inductive switching transients without external clamping. |
| Low RDS(on) × Qg FOM | ~430 mΩ·nC - Optimized trade-off between conduction loss and switching loss for high-frequency SMPS designs. |
| 175 °C operating temperature | Extended thermal range supports sealed enclosures and high-ambient environments (e.g., industrial motor drives, solar inverters). |
| dv/dt ruggedness | 6 kV/µs - Resists false turn-on due to high-speed voltage transients in noisy power systems. |
Applications
| Industrial Motor Control | DC-DC Converters |
|---|---|
Use Scenario: Half-bridge or H-bridge driver for 24 V BLDC fans and pumps in HVAC and factory automation. IC Role / Device Role / Timing Role: Low-side and high-side switching element; handles 50 A peak currents with <10 ns rise/fall times. Use Value: 6.4 mΩ RDS(on) reduces conduction loss by >30% vs. legacy 10 mΩ MOSFETs, improving system efficiency at full load. | Use Scenario: Synchronous rectifier in 24 V input, 5 V/20 A isolated flyback or LLC converter for telecom power supplies. IC Role / Device Role / Timing Role: Secondary-side power switch replacing Schottky diodes; driven by transformer-coupled or controller-synchronized gate signal. Use Value: Body diode VSD ≤ 1.3 V and Qrr ≤ 58 nC minimize reverse recovery loss and improve light-load efficiency. |
| Automotive Body Electronics | Power Distribution Units |
Use Scenario: Load switch for 12 V battery-fed modules including seat controls, mirror actuators, and lighting drivers. IC Role / Device Role / Timing Role: High-current electronic fuse and soft-start switch; controlled via CAN/LIN-linked MCU GPIO. Use Value: Logic-level VGS(th) ensures full enhancement at 3.3 V MCU outputs; 175 °C rating supports under-hood ambient temperatures. | Use Scenario: Solid-state replacement for mechanical relays in 24 V industrial PDUs and programmable logic controller (PLC) output modules. IC Role / Device Role / Timing Role: Main power switch with integrated overcurrent and thermal protection via external monitoring circuitry. Use Value: Avalanche rating (250 mJ) and dv/dt immunity (6 kV/µs) prevent failure during inductive load disconnection events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLZ44N | RDS(on) = 25 mΩ @ VGS = 5 V; lower current rating (47 A); TO-220 package. | Larger footprint and higher thermal resistance (RthJC ≈ 2.5 K/W); unsuitable for high-density SMD layouts. | Prefer SPD50N03S2L-06 for space-constrained, high-current SMD designs requiring <10 mΩ RDS(on). |
| STP55NF06L | RDS(on) = 12 mΩ @ VGS = 5 V; 60 V VDS; TO-220 package; higher gate charge (85 nC). | Higher voltage rating adds margin but increases cost and capacitance; less optimal for 24 V systems. | Choose SPD50N03S2L-06 when optimizing for 24–30 V systems needing lowest RDS(on) and smallest SMD footprint. |
Compared with IRLZ44N and STP55NF06L, SPD50N03S2L-06 delivers superior current density (50 A in DPAK), lower conduction loss (6.4 mΩ), and better thermal performance (RthJC ≤ 1.1 K/W), making it ideal for compact, high-efficiency industrial and automotive power switches.
Availability
SPD50N03S2L-06 is available at Aetrix Electronics and suitable for industrial motor control, DC-DC power conversion, and automotive body electronics requiring stable component supply and long-term production continuity.
Supply support for SPD50N03S2L-06 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
This device belongs to the OptiMOS™ family of low-voltage power MOSFETs engineered for high-current, high-efficiency switching in 12–30 V systems such as motor drives, server VRMs, and battery-powered equipment.
FAQ
What is the maximum safe operating temperature for SPD50N03S2L-06?
The device supports continuous operation up to 175 °C junction temperature. Its thermal resistance (RthJC ≤ 1.1 K/W) and avalanche rating allow sustained use in sealed enclosures or high-ambient environments like engine bays and industrial cabinets, provided PCB copper area meets Infineon's 6 cm² minimum recommendation.
Can SPD50N03S2L-06 be driven directly by a 3.3 V microcontroller GPIO?
Yes - its gate threshold voltage (VGS(th)) ranges from 1.2 V to 2.0 V, and it achieves full enhancement at VGS = 4.5 V. At 3.3 V, RDS(on) rises to ~9.2 mΩ (max), still delivering usable performance for moderate-current loads (<30 A) without external level-shifting.
Does SPD50N03S2L-06 include a body diode, and what are its key parameters?
Yes - it integrates a fast-recovery epitaxial body diode rated for 50 A continuous forward current. Key specs include VSD = 0.9–1.3 V at 50 A, trr = 41–51 ns, and Qrr = 46–58 nC, making it suitable for synchronous rectification and freewheeling in buck and half-bridge topologies.
How does the avalanche rating impact real-world reliability?
The 250 mJ single-pulse avalanche energy rating means the MOSFET can absorb defined inductive energy spikes (e.g., from relay coil de-energization or motor phase commutation) without failure. This eliminates the need for external TVS or RC snubbers in many industrial and automotive applications, simplifying layout and improving long-term field reliability.
SPD50N03S2L-06 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.4mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 85µA
- Gate Charge (Qg) (Max) @ Vgs:
- 68 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2530 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-11
SPD50N03S2L-06 FAQ
1.How can I place an order for SPD50N03S2L-06 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPD50N03S2L-06 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPD50N03S2L-06 reliable?
The price and inventory of SPD50N03S2L-06 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPD50N03S2L-06 is usually 5 days.
3.What payment methods are accepted for SPD50N03S2L-06?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPD50N03S2L-06 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPD50N03S2L-06?
SPD50N03S2L-06 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPD50N03S2L-06 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPD50N03S2L-06?
For technical support, including SPD50N03S2L-06 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPD50N03S2L-06 requirements.
6.How does Aetrix verify that SPD50N03S2L-06 is sourced from the original manufacturer or authorized distributors?
All SPD50N03S2L-06 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPD50N03S2L-06 meets industry standards.
7.What is the process for return or replacement of SPD50N03S2L-06?
All SPD50N03S2L-06 units undergo pre-shipment inspection (PSI). If there is an issue with SPD50N03S2L-06, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPD50N03S2L-06 part is unused and in its original packaging.
Return procedure for SPD50N03S2L-06:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPD50N03S2L-06 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

