Infineon Technologies SPI08N50C3XKSA1
- Part No.:
- SPI08N50C3XKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
SPI08N50C3XKSA1.pdf
- Description:
- MOSFET N-CH 560V 7.6A TO262-3
- Quantity:
- Payment:

- Shipping:

Inventory:8,779
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Product details
Overview
SPI08N50C3 from Infineon Technologies is a 500 V, 7.6 A N-channel CoolMOS™ C3 superjunction power MOSFET in PG-TO262 (TO-262) package, designed for high-efficiency SMPS primary-side switching in offline AC/DC converters, PFC stages, and industrial DC-DC supplies. It features RDS(on) = 0.6 Ω at Tj = 25°C, ultra-low gate charge (Qg = 32 nC), and periodic avalanche rating up to 230 mJ.
For engineers reviewing the SPI08N50C3 datasheet, SPI08N50C3 pinout, SPI08N50C3 application, or SPI08N50C3 equivalent, key selection criteria include its 500 V V(BR)DSS, 7.6 A continuous drain current at 25°C, 50 V/ns dv/dt capability, and thermal resistance RthJC = 1.5 K/W - critical for high-power density flyback and LLC resonant converter designs.
Technical Context
This device implements Infineon's third-generation CoolMOS™ C3 technology, optimized for reduced conduction and switching losses in hard-switched topologies. Its low effective output capacitance (Co(er) = 56 pF) and minimized reverse transfer capacitance (Crss = 12 pF) enable faster switching with lower EMI generation and reduced gate drive loss.
The MOSFET supports robust operation under repetitive avalanche stress (IAR = 7.6 A, EAR = 0.5 mJ) and extreme dv/dt conditions (50 V/ns at Tj = 125°C), making it suitable for unclamped inductive load switching and high-noise industrial environments where voltage transients exceed standard MOSFET limits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 500 V - Withstands 400 V DC-link voltage with 25% margin in 380–400 VAC input SMPS designs |
| RDS(on) | 0.6 Ω @ Tj = 25°C - Enables <1.8 W conduction loss at 7.6 A, supporting compact heatsink sizing |
| Qg | 32 nC - Reduces gate driver power requirement and enables >100 kHz operation with low-cost drivers |
| EAS | 230 mJ - Supports single-pulse inductive energy absorption without failure in flyback snubberless designs |
| dv/dt | 50 V/ns @ Tj = 125°C - Immune to false turn-on during fast voltage transients in high-side configurations |
| RthJC | 1.5 K/W - Allows 83 W power dissipation at 25°C case temperature, enabling high-power density layouts |
| VSD | 1.2 V @ IF = 7.6 A - Limits body diode conduction loss during ZVS/ZCS transitions in resonant topologies |
Pinout & Package
PG-TO262 (TO-262) package: 3-pin, straight-lead variant of TO-220 with improved thermal performance over TO-220FP and electrical isolation comparable to TO-220-3-31. Mounting surface is electrically isolated (2500 VAC, 1 min).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path from source to load | Electrically connected to metal tab - must be mounted to heatsink with insulating pad or isolated mounting hardware |
| Source | Reference node for gate drive and current sensing | Low-inductance connection point for Kelvin source routing and shunt-based current monitoring |
| Gate | Control terminal for channel formation | High-impedance input requiring low-ESR gate resistor (12 Ω typical) to damp ringing and control dV/dt |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate charge (Qg = 32 nC) | Reduces gate driver power consumption by >40% vs. legacy 500 V MOSFETs, enabling smaller gate drivers |
| Periodic avalanche rated (EAR = 0.5 mJ) | Supports reliable operation in unclamped inductive switching without external snubbers in PFC boost stages |
| Extreme dv/dt immunity (50 V/ns) | Eliminates need for negative gate bias or active Miller clamp in high-side half-bridge configurations |
| Low effective output capacitance (Co(er) = 56 pF) | Minimizes turn-off energy loss and improves light-load efficiency in resonant LLC converters |
| Improved transconductance (gfs typ. 6 S) | Provides tighter VGS(th) control (2.1–3.9 V) and stable current regulation across temperature |
Applications
| Server PSU Primary Switch | Industrial PFC Boost Stage |
|---|---|
Use Scenario: High-density 1U server power supply operating at 100–300 kHz with universal AC input (90–264 VAC). IC Role / Device Role: Main switch in asymmetric half-bridge or flyback topology handling 380 V DC-link voltage. Use Value: 0.6 Ω RDS(on) and 32 nC Qg reduce total switching + conduction loss to <2.1 W at full load, enabling >95% efficiency at 50% load. | Use Scenario: Active front-end PFC stage in programmable logic controller (PLC) power module with 230 VAC nominal input. IC Role / Device Role: Boost switch subjected to repetitive 7.6 A peak currents and 400 V DC-link voltage. Use Value: Periodic avalanche rating (0.5 mJ) and 50 V/ns dv/dt immunity prevent failure during line dips and transient overvoltage events. |
| LED Driver Flyback Primary | Motor Drive Inverter Stage |
Use Scenario: 150 W constant-current LED driver for street lighting with wide input range (100–305 VAC). IC Role / Device Role: Primary-side MOSFET in quasi-resonant flyback with valley-switching control. Use Value: Low Crss (12 pF) and fast turn-off delay (60 ns) enable precise zero-voltage switching detection and reduce EMI filter size by 30%. | Use Scenario: Half-bridge inverter stage for 750 W brushless DC motor drive in HVAC blower systems. IC Role / Device Role: High-side switch exposed to 400 V bus and fast commutation-induced voltage spikes. Use Value: 230 mJ single-pulse avalanche energy rating absorbs inductive kickback during emergency shutdown without external clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP8NK50ZFP | 500 V, 8 A, RDS(on) = 0.65 Ω, Qg = 45 nC, no avalanche rating | Lacks periodic avalanche rating and has higher gate charge - requires snubber in PFC | Lower cost but needs additional protection circuitry in high-reliability industrial PFC |
| IPP60R099C7 | 600 V, 52 A, RDS(on) = 0.099 Ω, Qg = 72 nC, TO-220FP package | Higher voltage rating and current capacity, but larger die and higher gate drive demand | Better for high-current, low-RDS(on) requirements; over-specified for 7.6 A flyback use cases |
Compared with STP8NK50ZFP and IPP60R099C7, SPI08N50C3 delivers optimal balance of avalanche ruggedness, gate drive efficiency, and thermal performance for 7–8 A, 400 V DC-link applications - especially where board space, reliability, and EMI compliance are prioritized over raw current headroom.
Availability
SPI08N50C3 is available at Aetrix Electronics and suitable for server power supplies, industrial PFC modules, LED driver flybacks, and HVAC motor inverters requiring stable component supply and long-term lifecycle support.
Supply support for SPI08N50C3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This part belongs to the CoolMOS™ C3 product line, engineered specifically for high-efficiency, high-reliability switching in offline SMPS, PFC, and resonant converter topologies - emphasizing low gate charge, avalanche robustness, and thermally efficient packaging.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The SPI08N50C3 supports 4.6 A continuous drain current at TC = 100°C, as specified in the Absolute Maximum Ratings table. This derating reflects junction-to-case thermal resistance (1.5 K/W) and safe operating area limitations - design must ensure case temperature remains ≤100°C under worst-case ambient and airflow conditions.
Does this MOSFET require a negative gate voltage for reliable turn-off?
No. The SPI08N50C3 has a gate threshold voltage range of 2.1–3.9 V and exhibits excellent dv/dt immunity (50 V/ns at 125°C), eliminating the need for negative gate bias. A standard 0–10 V gate drive with appropriate series resistance (12 Ω typical) ensures clean turn-off without Miller-induced false triggering.
Can SPI08N50C3 replace SPP08N50C3 in existing PCB layouts?
Yes - both share identical PG-TO220 and PG-TO262 packages respectively, and SPI08N50C3 (PG-TO262) is pin-compatible with SPP08N50C3 (PG-TO220) in terms of terminal assignment (Drain–Source–Gate). However, PG-TO262 has longer leads and different mounting hole spacing; mechanical verification is required before drop-in replacement.
What is the body diode reverse recovery charge (Qrr) and why does it matter?
Qrr is 3.6 µC at Tj = 25°C, measured at VR = 400 V and dIF/dt = 100 A/µs. This parameter directly impacts switching loss and EMI in hard-switched topologies - lower Qrr reduces turn-on loss in synchronous rectification and minimizes voltage overshoot during commutation in half-bridge circuits.
SPI08N50C3XKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 560 V
- Current - Continuous Drain (Id) @ 25°C:
- 7.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 600mOhm @ 4.6A, 10V
- Vgs(th) (Max) @ Id:
- 3.9V @ 350µA
- Gate Charge (Qg) (Max) @ Vgs:
- 32 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 750 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 83W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO262-3-1
SPI08N50C3XKSA1 FAQ
1.How can I place an order for SPI08N50C3XKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPI08N50C3XKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPI08N50C3XKSA1 reliable?
The price and inventory of SPI08N50C3XKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPI08N50C3XKSA1 is usually 5 days.
3.What payment methods are accepted for SPI08N50C3XKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPI08N50C3XKSA1 transactions.
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SPI08N50C3XKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPI08N50C3XKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPI08N50C3XKSA1?
For technical support, including SPI08N50C3XKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPI08N50C3XKSA1 requirements.
6.How does Aetrix verify that SPI08N50C3XKSA1 is sourced from the original manufacturer or authorized distributors?
All SPI08N50C3XKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPI08N50C3XKSA1 meets industry standards.
7.What is the process for return or replacement of SPI08N50C3XKSA1?
All SPI08N50C3XKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with SPI08N50C3XKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPI08N50C3XKSA1 part is unused and in its original packaging.
Return procedure for SPI08N50C3XKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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