Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies SPI100N03S2L03

Part No.:
SPI100N03S2L03
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixSPI100N03S2L03.pdf
Description:
MOSFET N-CH 30V 100A TO262-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,391

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPI100N03S2L-03 from Infineon Technologies is an N-channel enhancement-mode logic-level power MOSFET in TO262-3-1 package, rated for 30 V VDS, 100 A continuous drain current at TC = 25 °C, and 2.7 mΩ max RDS(on) at VGS = 4.5 V. It operates up to 175 °C, features avalanche rating, dv/dt ruggedness (6 kV/µs), and is optimized for high-efficiency DC-DC converters and motor control in industrial power supplies.

For engineers reviewing the SPI100N03S2L-03 datasheet, SPI100N03S2L-03 pinout, SPI100N03S2L-03 application, or SPI100N03S2L-03 equivalent, key selection criteria include its low gate charge × RDS(on) figure of merit (FOM), superior thermal resistance (RthJC = 0.3–0.5 K/W), and robust unclamped inductive switching capability.

Technical Context

This OptiMOS™ device uses trench-gate silicon technology to achieve high current density with low conduction and switching losses. Its logic-level gate drive (VGS(th) = 1.2–2.0 V) enables direct interfacing with 3.3 V and 5 V microcontrollers without level-shifting circuitry.

The MOSFET integrates a fast, soft-recovery body diode (trr = 86–108 ns, Qrr = 100–125 nC) and supports repetitive avalanche operation (EAR = 30 mJ), making it suitable for hard-switched topologies where diode reverse recovery stress is critical.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V - Maximum blocking voltage for 12 V and 24 V system-level bus protection and switching
RDS(on) max @ VGS = 4.5 V 3.4 mΩ - Enables <1 W conduction loss at 80 A, critical for high-current synchronous rectification
ID continuous @ TC = 25 °C 100 A - Supports high-power motor drives and server VRMs without parallel devices
Qg total 220 nC - Low gate charge reduces driver power demand and improves efficiency in 100–500 kHz switching
RthJC 0.5 K/W max - Enables >240 W dissipation with modest heatsinking, reducing thermal margin risk
EAS 810 mJ - Withstands single-pulse inductive energy in UPS and power tool H-bridge fault conditions
tr/tf 67/65 ns - Fast switching minimizes overlap loss in half-bridge configurations at ≥200 kHz

Pinout & Package

Package: TO262-3-1 (ISOTOP® variant of TO-220 compatible outline, surface-mountable with isolated tab). Thermal pad soldered to PCB copper for enhanced heat transfer.

Pin/Terminal Circuit Role Design Meaning
Drain (Tab) Main current path output / heat sink interface Electrically connected to exposed metal tab; must be electrically isolated from chassis unless system ground referenced
Source Reference node for gate drive and current sensing Low-inductance connection required for stable gate control and accurate shunt-based current monitoring
Gate Control terminal for channel modulation High-impedance input requiring <10 Ω series resistance to damp ringing and prevent oscillation during fast edge transitions

Key Features

Feature Design Value
Logic-level gate threshold VGS(th) = 1.2–2.0 V ensures reliable turn-on with 3.3 V MCU GPIOs without gate driver IC overhead
Avalanche-rated operation Single-pulse EAS = 810 mJ allows safe operation under inductive load switching faults without external snubbers
dv/dt ruggedness 6 kV/µs rating prevents false turn-on during high-speed commutation in noisy motor drive environments
Soft-recovery body diode Qrr = 100–125 nC and trr = 86–108 ns reduce voltage overshoot and EMI in freewheeling paths
175 °C maximum junction temperature Enables compact thermal design in sealed enclosures or high-ambient industrial settings without derating penalties

Applications

Industrial Motor Drives Server VRM / POL Converters

Use Scenario: Half-bridge inverter stage for 3-phase BLDC motors in HVAC compressors and pumps.

IC Role / Device Role / Timing Role: High-side and low-side switching element handling 100 A peak phase current at 20–40 kHz PWM frequency.

Use Value: Low RDS(on) and fast switching minimize conduction and switching losses, enabling >98.5% efficiency at full load.

Use Scenario: Synchronous buck high-side switch in 48 V-to-12 V intermediate bus converter for AI accelerators.

IC Role / Device Role / Timing Role: Main power switch operating at 300 kHz with 100 A DC output current capability.

Use Value: Gate charge × RDS(on) FOM < 600 Ω·nC ensures minimal driver loss and thermal rise under high-frequency operation.

Uninterruptible Power Supplies Power Tool Battery Packs

Use Scenario: Inverter output stage in line-interactive UPS delivering 2 kVA sinusoidal output.

IC Role / Device Role / Timing Role: Bidirectional switching device supporting both grid-tie and battery discharge modes with reverse diode conduction.

Use Value: Avalanche rating and soft-recovery diode enable reliable operation during AC line transients and short-circuit events.

Use Scenario: Main battery disconnect and protection switch in 60 V cordless drill packs with active cell balancing.

IC Role / Device Role / Timing Role: Load switch controlling 100 A surge current during trigger pull, with integrated overcurrent and thermal shutdown signaling.

Use Value: 175 °C Tjmax and low RDS(on) allow sustained high-current bursts without thermal throttling or derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF1405PbF RDS(on) = 5.3 mΩ @ 10 V (vs. 2.2 mΩ), higher Qg = 230 nC, TO-220 package only Limited to lower-frequency (<100 kHz) applications due to slower switching and higher conduction loss Prefer when cost sensitivity outweighs efficiency targets and thermal constraints are relaxed
STL110N3LLH6 30 V, RDS(on) = 2.3 mΩ @ 4.5 V, but rated only to 150 °C Tjmax and lacks avalanche rating Not suitable for unclamped inductive loads or high-temperature sealed environments Select only for space-constrained SMD designs where avalanche immunity is not required

Compared with IRF1405PbF and STL110N3LLH6, SPI100N03S2L-03 delivers superior thermal capability (175 °C), proven avalanche robustness, and lowest gate-charge × RDS(on) FOM-making it the optimal choice for high-reliability, high-efficiency industrial power stages.

Availability

SPI100N03S2L-03 is available at Aetrix Electronics and suitable for industrial motor drives, server VRMs, uninterruptible power supplies, and power tool battery management systems requiring stable component supply across multi-year production cycles.

Supply support for SPI100N03S2L-03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global manufacturing and R&D infrastructure.

SPI100N03S2L-03 belongs to the OptiMOS™ 30 V product line, engineered specifically for high-current, high-efficiency power conversion in industrial automation, computing, and energy storage systems.

FAQ

What is the maximum recommended gate-source voltage for SPI100N03S2L-03?

The absolute maximum VGS is ±20 V per datasheet specifications. For reliable long-term operation, gate drive should be limited to +10 V to +15 V for full enhancement, with transient spikes held below +18 V using clamping Zener diodes or gate driver rail regulation.

Can SPI100N03S2L-03 be used in paralleled configurations?

Yes-the device exhibits positive temperature coefficient for RDS(on) above 100 °C, enabling inherently stable current sharing. Designers must match gate loop inductance and use Kelvin source connections to avoid oscillation and ensure balanced dynamic current distribution.

Is the body diode suitable for synchronous rectification?

No-the internal body diode is optimized for freewheeling, not synchronous rectification. Its Qrr and forward voltage are higher than discrete Schottky diodes. For synchronous rectifier applications, use external low-VF diodes or dedicated SR controllers with separate MOSFETs.

What PCB layout practices improve thermal performance?

Use ≥6 cm² of 70 µm thick copper on the drain pad, connected via multiple thermal vias to inner-layer ground planes. Avoid routing signal traces under the tab. Maintain ≥1.5 mm clearance between tab and adjacent components to prevent thermal coupling and ensure conformal coating compatibility.

SPI100N03S2L03 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Bulk
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3mOhm @ 80A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
220 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
8180 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO262-3-1

SPI100N03S2L03 FAQ

1.How can I place an order for SPI100N03S2L03 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPI100N03S2L03 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPI100N03S2L03 reliable?

The price and inventory of SPI100N03S2L03 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPI100N03S2L03 is usually 5 days.

3.What payment methods are accepted for SPI100N03S2L03?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPI100N03S2L03 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPI100N03S2L03?

SPI100N03S2L03 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPI100N03S2L03 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPI100N03S2L03?

For technical support, including SPI100N03S2L03 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPI100N03S2L03 requirements.

6.How does Aetrix verify that SPI100N03S2L03 is sourced from the original manufacturer or authorized distributors?

All SPI100N03S2L03 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPI100N03S2L03 meets industry standards.

7.What is the process for return or replacement of SPI100N03S2L03?

All SPI100N03S2L03 units undergo pre-shipment inspection (PSI). If there is an issue with SPI100N03S2L03, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPI100N03S2L03 part is unused and in its original packaging.

Return procedure for SPI100N03S2L03:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPI100N03S2L03 Tags

  • SPI100N03S2L03
  • SPI100N03S2L03 PDF
  • SPI100N03S2L03 Datasheet
  • SPI100N03S2L03 Specifications
  • SPI100N03S2L03 Images
  • Infineon Technologies
  • Infineon Technologies SPI100N03S2L03
  • Buy SPI100N03S2L03
  • SPI100N03S2L03 Price
  • SPI100N03S2L03 Distributor
  • SPI100N03S2L03 Supplier
  • SPI100N03S2L03 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER