Infineon Technologies SPI80N03S2L-04
- Part No.:
- SPI80N03S2L-04
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
SPI80N03S2L-04.pdf
- Description:
- MOSFET N-CH 30V 80A TO262-3
- Quantity:
- Payment:

- Shipping:

Inventory:7,882
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPI80N03S2L-04 from Infineon Technologies is an N-channel enhancement-mode logic-level power MOSFET in TO262-3-1 package, rated for 30 V VDS, 80 A continuous drain current at TC = 25 °C, and 3.9 mΩ RDS(on) at VGS = 10 V. It features avalanche rating, 175 °C maximum junction temperature, and optimized gate charge × RDS(on) figure-of-merit for high-efficiency DC-DC and motor drive stages.
For engineers reviewing the SPI80N03S2L-04 datasheet, SPI80N03S2L-04 pinout, SPI80N03S2L-04 application, or SPI80N03S2L-04 equivalent, key selection criteria include its 3.2–3.9 mΩ RDS(on) at 10 V drive, 79–105 nC total gate charge, 188 W power dissipation at TC = 25 °C, and robust dv/dt immunity up to 6 kV/µs.
Technical Context
This OptiMOS™ device uses trench-gate silicon technology to achieve low on-resistance with fast switching dynamics. Its gate threshold voltage (1.2–2.0 V) enables direct logic-level drive from 3.3 V or 5 V controllers, while the 2930–3900 pF input capacitance and 268–402 pF reverse transfer capacitance support stable operation in hard-switched topologies.
The MOSFET integrates a robust body diode with 50–62 ns reverse recovery time and 61–76 nC Qrr, enabling reliable synchronous rectification and freewheeling in buck converters and H-bridge motor drivers without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 24 V nominal bus systems with margin against transients. |
| RDS(on) @ VGS = 10 V | 3.2–3.9 mΩ - Enables <1.2 W conduction loss at 80 A, critical for high-current power stages. |
| ID (continuous) | 80 A @ TC = 25 °C - Sustains full load in industrial motor drives and server VRMs with heatsink mounting. |
| Qg | 79–105 nC - Determines gate driver strength requirement; compatible with common 2–4 A peak drivers. |
| EAS | 380 mJ - Withstands single-pulse inductive energy without failure, supporting unclamped inductive switching. |
| Tj(max) | 175 °C - Allows operation in high-ambient environments such as automotive under-hood or industrial enclosures. |
| dv/dt rating | 6 kV/µs - Resists false turn-on during fast voltage transients in half-bridge configurations. |
Pinout & Package
Package: PG-TO262-3-1 (standard through-hole variant of TO-262, 3-pin, isolated tab). Thermal resistance RthJC = 0.51–0.8 K/W supports efficient heat transfer to heatsink via drain-connected tab.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (low-side reference) | Connected to ground or low-side switch node; carries full load current return path. |
| Pin 2 (Gate) | Control electrode | Receives logic-level gate drive; requires <105 nC charge for full enhancement; sensitive to ESD. |
| Pin 3 (Drain) | High-side power terminal | Internally connected to metal tab; must be electrically isolated from heatsink unless system design permits common-drain configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive compatibility | Operates fully enhanced at VGS ≥ 4.5 V, eliminating need for gate boosters in 3.3 V/5 V microcontroller-driven systems. |
| Avalanche-rated ruggedness | Guaranteed single-pulse EAS = 380 mJ enables reliable operation in inductive load switching without snubbers. |
| Optimized FOM (Qg × RDS(on)) | Typical 312–410 pC·Ω - balances switching loss and conduction loss for high-frequency (>100 kHz) SMPS designs. |
| Enhanced thermal performance | RthJC ≤ 0.8 K/W allows >150 W power handling with modest heatsinking, reducing thermal derating in compact layouts. |
Applications
| DC-DC Converters | Motor Control |
|---|---|
|
Use Scenario: High-current synchronous buck converter in telecom power supply delivering 12 V/60 A output. IC Role / Device Role / Timing Role: Low-side power switch with fast turn-off (<28 ns fall time) and low RDS(on) to minimize conduction loss. Use Value: Achieves >95% efficiency at full load due to 3.9 mΩ on-resistance and 61–76 nC Qrr enabling clean dead-time management. |
Use Scenario: Half-bridge leg in 24 V brushed DC motor driver for automated guided vehicle (AGV) traction control. IC Role / Device Role / Timing Role: High-current switching element with 320 A pulsed capability and 6 kV/µs dv/dt immunity to suppress shoot-through risk. Use Value: Supports 100% duty-cycle operation and withstands repetitive inductive kickback without external clamping. |
| Power ORing | Industrial Power Supplies |
|
Use Scenario: Hot-swap ORing circuit in redundant 48 V server backplane distribution. IC Role / Device Role / Timing Role: Low-forward-drop replacement for Schottky diodes, controlled by ideal diode controller. Use Value: Reduces power loss by >60% versus 40 V Schottky (VSD = 0.9–1.2 V vs. ~0.45 V drop at 80 A), improving thermal density. |
Use Scenario: Primary-side switch in industrial AC-DC front-end with PFC + LLC stage. IC Role / Device Role / Timing Role: High-reliability main switch in continuous conduction mode (CCM) PFC boost stage. Use Value: 175 °C Tj(max) and 188 W Ptot ensure long-term stability under sustained 80 A peak currents and ambient >70 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF1404PbF | RDS(on) = 4.0 mΩ @ 10 V, Qg = 131 nC, Tj(max) = 175 °C, TO-220 package | Higher gate charge increases driver losses; larger RthJA limits power density in compact layouts. | Prefer when legacy TO-220 footprint compatibility is required and switching frequency < 50 kHz. |
| STL220N3LLH6 | RDS(on) = 2.2 mΩ @ 10 V, Qg = 120 nC, Tj(max) = 175 °C, PowerFLAT 5x6 package | Lower RDS(on) improves conduction loss but requires SMT assembly and has higher thermal resistance to ambient. | Prefer for space-constrained SMT designs where board-level thermal management exceeds discrete heatsink capability. |
Compared with IRF1404PbF and STL220N3LLH6, SPI80N03S2L-04 delivers optimal balance of low Qg (79–105 nC), moderate RDS(on) (3.2–3.9 mΩ), and through-hole TO262 thermal interface-making it ideal for medium-frequency, high-current applications requiring serviceability and heatsink flexibility.
Availability
SPI80N03S2L-04 is available at Aetrix Electronics and suitable for DC-DC converters, motor control systems, and industrial power supplies requiring stable component supply, long-lifecycle support, and traceable sourcing from authorized channels.
Supply support for SPI80N03S2L-04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
SPI80N03S2L-04 belongs to the OptiMOS™ 30 V product line, engineered for high-current, high-efficiency switching in battery-powered and mains-fed industrial equipment where thermal robustness and logic-level drivability are essential.
FAQ
What is the maximum continuous drain current for SPI80N03S2L-04 at 100 °C case temperature?
At TC = 100 °C, the continuous drain current is derated to approximately 52 A, based on the ID vs. TC curve (Page 4, Figure 2) and the 0.8 K/W RthJC limit. This reflects thermal constraints-not electrical limits-and assumes adequate heatsinking to maintain case temperature.
Does SPI80N03S2L-04 require a gate resistor for safe operation in a 100 kHz buck converter?
Yes-a gate resistor between 2.2 Ω and 10 Ω is recommended to damp ringing and control dV/dt during switching. The device's 268–402 pF Crss and 79–105 nC Qg make it susceptible to oscillation without proper gate impedance, especially with high-speed drivers and parasitic PCB inductance.
Can SPI80N03S2L-04 replace a standard 30 V MOSFET in an existing TO-220 layout?
No-it uses PG-TO262-3-1, which shares pinout alignment with TO-220 but has a different leadframe geometry and tab isolation. Mechanical fit may appear similar, but creepage/clearance, thermal pad contact, and mounting hole spacing differ; redesign of footprint and heatsink interface is required.
Is the body diode suitable for synchronous rectification in a 500 kHz LLC resonant converter?
Yes-the body diode has 50–62 ns trr and 61–76 nC Qrr, enabling use in synchronous rectification at ≤500 kHz with appropriate dead-time tuning. However, for best efficiency above 300 kHz, pairing with an external SiC Schottky is recommended to reduce recovery-related losses.
SPI80N03S2L-04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.2mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 130µA
- Gate Charge (Qg) (Max) @ Vgs:
- 105 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 188W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO262-3-1
SPI80N03S2L-04 FAQ
1.How can I place an order for SPI80N03S2L-04 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPI80N03S2L-04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPI80N03S2L-04 reliable?
The price and inventory of SPI80N03S2L-04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPI80N03S2L-04 is usually 5 days.
3.What payment methods are accepted for SPI80N03S2L-04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPI80N03S2L-04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPI80N03S2L-04?
SPI80N03S2L-04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPI80N03S2L-04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPI80N03S2L-04?
For technical support, including SPI80N03S2L-04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPI80N03S2L-04 requirements.
6.How does Aetrix verify that SPI80N03S2L-04 is sourced from the original manufacturer or authorized distributors?
All SPI80N03S2L-04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPI80N03S2L-04 meets industry standards.
7.What is the process for return or replacement of SPI80N03S2L-04?
All SPI80N03S2L-04 units undergo pre-shipment inspection (PSI). If there is an issue with SPI80N03S2L-04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPI80N03S2L-04 part is unused and in its original packaging.
Return procedure for SPI80N03S2L-04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPI80N03S2L-04 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

