Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics SPSB0813-TR

Part No.:
SPSB0813-TR
Manufacturer:
STMicroelectronics
Category:
Power Management - Specialized
Package:
32-TFQFN Exposed Pad
Datasheet:
AetrixSPSB0813-TR.pdf
Description:
LINEAR IC'S
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:475

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPSB0813-TR from STMicroelectronics is an AEC-Q100 qualified automotive power management IC integrating dual LDO regulators (V1 = 3.3 V, V2 = 3.3 V tracker), four 0.14 A high-side drivers, LIN transceiver (ISO 17987-4/2016), CAN-FD transceiver (ISO 11898-2/2016, SAE J2284), programmable watchdog, reset generator, and contact monitoring (WU1/WU2) - deployed in body control modules for low-quiescent-current (<15 µA standby) power sequencing and fail-safe diagnostics.

For engineers reviewing the SPSB0813-TR datasheet, SPSB0813-TR pinout, SPSB0813-TR application, or SPSB0813-TR equivalent, this device supports SPI-controlled voltage regulation, open-load/overcurrent diagnosis per HS driver, thermal warning/shutdown (140 °C / 165–185 °C), and ASIL-aware safety features including DIAGN assertion and current monitor (CM) output - critical for automotive ECU power architecture validation.

Technical Context

The SPSB0813-TR implements two independent LDOs: V1 delivers fixed 3.3 V @ 250 mA with overvoltage protection and thermal shutdown coordination; V2 operates as a ±20 mV tracking regulator of V1, configurable via SPI CR2 register bit V2_TKR, supporting 3.3 V output with 100 mA capability and reverse-bias protection.

Its communication stack includes a LIN transceiver compliant with ISO 17987-4/2016 and a CAN-FD physical layer compliant with ISO 11898-2/2016 and SAE J2284, both featuring local/bus failure diagnosis, while four high-side drivers integrate internal 10-bit PWM timers, RON = 7 Ω, and per-channel current monitoring via multiplexed CM pin.

Key Specifications

Parameter Value and Actual Design Meaning
V1 Output Voltage 3.3 V fixed (OTP-configured); supplies MCU and integrated CAN-FD transceiver with 250 mA continuous load capacity.
V2 Configuration 3.3 V tracker of V1 (V2_TKR = 1); ±20 mV tracking accuracy enables synchronized peripheral supply without external feedback.
HS Driver Current 0.14 A per channel (OUT1–OUT4); RON = 7 Ω supports direct LED/sensor drive and high-input-capacitance loads.
Standby Quiescent Current Typ. 15 µA in VBAT_standby mode; enables ultra-low-power wake-up monitoring for battery-sensitive automotive modules.
LIN Compliance ISO 17987-4/2016 compliant; supports bidirectional communication on LIN bus with RxD_L/TxD_L pins and built-in fault detection.
CAN-FD Compliance ISO 11898-2/2016 & SAE J2284 compliant; supports data rates up to 5 Mbps with local/bus failure diagnosis via CAN_H/CAN_L pins.
Thermal Protection Warning at 140–160 °C (TW_ON), shutdown at 165–185 °C (TSD1), hysteresis ≥5 °C; ensures safe operation under sustained overload.

Pinout & Package

SPSB0813-TR uses QFN32L Epad (5.0 × 5.0 × 1.0 mm) package with exposed thermal pad; pin layout optimized for automotive PCB layout with separate signal (SGND) and power (PGND) grounds, VSREG/V1/V2 supply isolation, and dedicated diagnostic outputs (DIAGN, CM, NINT).

Pin Circuit Role Design Meaning
WU1 Wake-up input 1 Static or cyclic monitoring pin for external contacts; enables remote wake-up from VBAT_standby mode.
DIR/WU2 Dual-function terminal Configurable as direct HS driver enable (DIR) or second wake-up input (WU2) with programmable sense cycle.
V2 Tracker regulator output 3.3 V output tracking V1; protected against reverse bias and short-circuit; supplies peripherals or CAN-FD transceiver.
OUT1–OUT4 High-side driver outputs Four independent 0.14 A drivers with open-load diagnosis, overcurrent protection, and current mirror via CM pin.
DIAGN Failsafe error indicator Active-low open-drain output signaling latched faults (V1FAIL, V2FAIL, thermal, watchdog timeout, etc.).
CM Current monitor multiplexer Analog output sourcing scaled current image of selected HS driver (via SPI control register); enables real-time load monitoring.
NINT Interrupt notification Push-pull output indicating errors, warnings, or wake-up events (CAN/LIN/WU1/WU2/timer); replaces polling overhead.
RxD_L / TxD_L LIN transceiver I/O Full-duplex LIN interface compliant with ISO 17987-4/2016; supports node addressing and protocol-level diagnostics.
CAN_H / CAN_L CAN-FD physical layer Differential bus interface compliant with ISO 11898-2/2016; supports 5 Mbps FD operation with bus-failure detection.
VSREG Main supply input Input for internal regulators (V1/V2), LIN/CAN transceivers, and wake-up circuitry; requires ceramic + electrolytic decoupling.

Key Features

Feature Design Value
Integrated LIN + CAN-FD PHY Single-chip solution eliminates discrete transceivers; reduces BOM count and PCB area in gateway/BCM applications.
Programmable window watchdog SPI-configurable timeout and window size; DEBUG pin deactivation enables safe firmware debugging without system lockup.
Per-output open-load diagnosis Real-time detection of disconnected loads on all four HS drivers; prevents false fault reporting during sleep/wake transitions.
Thermal cluster monitoring Multiple junction temperature thresholds (warning + dual shutdown) with hysteresis ensure robust thermal management across mixed workloads.
Buffered regulator supplies V1 and V2 outputs buffered internally to maintain stability under fast transient loads; no electrolytic capacitors required.

Applications

Body Control Module (BCM) Telematic Control Unit (TCU)

Use Scenario: Centralized power distribution and wake-up control for door locks, lighting, and window actuators in 12 V automotive architectures.

IC Role / Device Role / Timing Role: Power management IC providing regulated 3.3 V (V1) for MCU, tracked 3.3 V (V2) for sensors, and four HS drivers for LED indicators and solenoid control.

Use Value: Enables <15 µA standby current with cyclic WU1/WU2 monitoring, reducing parasitic drain while maintaining ASIL-B–compatible fault logging via DIAGN/NINT.

Use Scenario: Power and communication interface for cellular modem, GNSS receiver, and OTA update controller in connected vehicle platforms.

IC Role / Device Role / Timing Role: Supplies 3.3 V to modem baseband processor (V1), tracks same rail for GNSS LNA (V2), and routes CAN-FD diagnostics and LIN sub-network commands.

Use Value: Integrates LIN/CAN-FD PHYs with current-monitoring HS drivers, eliminating discrete level-shifters and enabling precise load telemetry for modem power state validation.

Passive Keyless Entry (PKE) Seat Control Module

Use Scenario: Low-power RF receiver subsystem requiring wake-on-LIN/CAN and secure MCU supply with tamper-resistant reset generation.

IC Role / Device Role / Timing Role: Delivers 3.3 V (V1) to secure MCU with programmable POR reset and undervoltage detection; uses WU2 for RF receiver interrupt signaling.

Use Value: Achieves <15 µA quiescent current in VBAT_standby while retaining LIN/CAN wake capability and hardware-enforced reset timing - critical for anti-theft compliance.

Use Scenario: Motorized seat position control with heater, lumbar, and memory functions requiring multi-channel power switching and thermal supervision.

IC Role / Device Role / Timing Role: Four HS drivers (OUT1–OUT4) control seat motors/heaters; V2 supplies 3.3 V to position sensors; thermal cluster monitors junction temp during sustained actuation.

Use Value: Per-channel current monitoring (CM) and open-load diagnosis prevent motor stall damage; thermal shutdown (TSD1/TSD2) protects against overheating in confined cabin spaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPSB0815-TR V1 = 5.0 V (not 3.3 V); V2 = 3.3 V independent LDO (not tracker); includes same LIN/CAN-FD and HS drivers. Targets MCUs requiring 5 V supply; lacks V2 tracking capability needed for tightly coupled 3.3 V peripherals. Select when system MCU operates at 5 V and peripheral rail independence is preferred over tracking precision.
TLE9261-2QX Single 5 V LDO (no V2 tracker); 4x HS drivers (0.15 A); LIN-only (no CAN-FD); lower integration (no integrated transceivers). Designed for cost-sensitive LIN-only nodes; lacks CAN-FD, thermal cluster, and current monitor output. Choose for LIN-centric body modules where CAN-FD is unnecessary and BOM simplification outweighs diagnostic depth.

Compared with SPSB0815-TR, the SPSB0813-TR provides tighter 3.3 V rail synchronization via V2 tracking - essential for noise-sensitive sensors - while TLE9261-2QX trades CAN-FD and advanced diagnostics for lower gate count and cost in LIN-only applications.

Availability

SPSB0813-TR is available at Aetrix Electronics and suitable for body control modules, telematic control units, passive keyless entry systems, and seat control modules requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.

Supply support for SPSB0813-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in automotive, industrial, and power management solutions, with deep expertise in functional safety and ASIL-compliant design.

The SPSB081 product line delivers integrated power management ICs for automotive ECUs, combining LDO regulation, high-side driving, and LIN/CAN-FD PHYs to reduce system complexity and improve diagnostic coverage in ASIL-B–capable architectures.

FAQ

What is the maximum continuous output current per high-side driver?

Each of the four high-side drivers (OUT1–OUT4) supports a maximum continuous output current of 0.14 A at ambient temperatures up to 125 °C, with RON = 7 Ω and integrated overcurrent protection that disables the channel upon fault detection. Current derating applies above 125 °C per thermal data in DS14048 Rev 3.

How does the V2 voltage tracker function differ from a standard LDO?

V2 operates as a ±20 mV tracking regulator of V1 when V2_TKR = 1, meaning its output precisely follows V1's 3.3 V rail without requiring external feedback components. Unlike a standalone LDO, it cannot operate independently at different voltages - its tracking behavior is enabled only when V1 and V2 share identical output levels (3.3 V for SPSB0813-TR).

Is the LIN transceiver compatible with standard ISO 17987-4/2016 implementations?

Yes - the integrated LIN transceiver fully complies with ISO 17987-4/2016, supporting standard baud rates (up to 20 kbps), bus fault detection (short-to-battery/ground), and dominant timeout protection. It uses dedicated RxD_L and TxD_L pins and requires no external components beyond a single pull-up resistor on the LIN bus line.

What safety mechanisms are implemented for thermal management?

The device embeds three-tier thermal protection: warning flag activation at 140–160 °C (TW_ON), first-stage shutdown at 165–185 °C (TSD1) disabling all outputs except V1, and second-stage shutdown at 175–195 °C (TSD2) deactivating V1 and all wake-up sources. Hysteresis ≥5 °C prevents oscillation during recovery, and status bits are latched in SR1/SR2 for SPI readback.

SPSB0813-TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
32-TFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
-
Current - Supply:
10mA
Voltage - Supply:
40V
Operating Temperature:
-40°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VFQFPN (5x5)

SPSB0813-TR FAQ

1.How can I place an order for SPSB0813-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for SPSB0813-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPSB0813-TR reliable?

The price and inventory of SPSB0813-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPSB0813-TR is usually 5 days.

3.What payment methods are accepted for SPSB0813-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPSB0813-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPSB0813-TR?

SPSB0813-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPSB0813-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPSB0813-TR?

For technical support, including SPSB0813-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPSB0813-TR requirements.

6.How does Aetrix verify that SPSB0813-TR is sourced from the original manufacturer or authorized distributors?

All SPSB0813-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPSB0813-TR meets industry standards.

7.What is the process for return or replacement of SPSB0813-TR?

All SPSB0813-TR units undergo pre-shipment inspection (PSI). If there is an issue with SPSB0813-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPSB0813-TR part is unused and in its original packaging.

Return procedure for SPSB0813-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPSB0813-TR Tags

  • SPSB0813-TR
  • SPSB0813-TR PDF
  • SPSB0813-TR Datasheet
  • SPSB0813-TR Specifications
  • SPSB0813-TR Images
  • STMicroelectronics
  • STMicroelectronics SPSB0813-TR
  • Buy SPSB0813-TR
  • SPSB0813-TR Price
  • SPSB0813-TR Distributor
  • SPSB0813-TR Supplier
  • SPSB0813-TR Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER