STMicroelectronics SPV1001N30
- Part No.:
- SPV1001N30
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- 8-PowerVDFN
- Datasheet:
-
SPV1001N30.pdf
- Description:
- DIODE GEN PURP 30V 12.5A 8PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:6,147
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Product details
Overview
SPV1001N30 from STMicroelectronics is a smart bypass switch for photovoltaic panel strings, replacing Schottky diodes with active MOSFET-based rectification. It delivers 12.5 A forward current, 30 V reverse blocking, 120 mV typical average forward voltage at 10 A/25°C, <1 µA reverse leakage at 30 V/25°C, and operates up to 150 °C junction temperature - enabling cooler, more efficient hot-spot protection in solar modules.
For engineers reviewing the SPV1001N30 datasheet, SPV1001N30 pinout, SPV1001N30 application, or SPV1001N30 equivalent, this device offers verified low-loss bypass functionality with documented thermal resistance (4 °C/W), duty-cycle-controlled conduction (95% TON/T at 5 A/25°C), and PQFN 5 × 6 mm package compatibility for high-reliability PV string designs.
Technical Context
The SPV1001N30 implements an autonomous self-powered gate-drive architecture: during OFF time, an internal capacitor charges from the string current; during ON time, that stored charge drives the MOSFET gate to achieve ultra-low conduction loss. No external supply or control signal is required.
Its operation relies on adaptive timing - TON/T ratio drops from 95% at 25°C to 75% at 125°C - maintaining low average forward voltage (120 mV typ. @10 A/25°C) while limiting reverse leakage (<10 µA @30 V/125°C) and ensuring stable thermal behavior up to 150 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max reverse voltage (VR) | 30 V - supports standard PV string configurations without breakdown risk under partial shading |
| Max forward current (IF) | 12.5 A - handles full-string current in residential and commercial solar arrays |
| Avg forward voltage (VF,AVG) | 120 mV @10 A/25°C - reduces power loss by >60% vs. typical Schottky diodes (~450–600 mV) |
| Reverse leakage (IR) | 1 µA @30 V/25°C - minimizes parasitic power drain and thermal runaway risk in shaded cells |
| TON/T ratio | 95% @5 A/25°C - maximizes conduction time to sustain low average VF while managing switching losses |
| Junction temp range (TJ) | −40 to +150 °C - enables direct mounting on PV module backsheets without derating |
| Thermal resistance (RthJC) | 4 °C/W - allows effective heatsinking via PCB copper area under exposed tab |
Pinout & Package
PQFN 5 × 6 mm package with exposed thermal pad (ECOPACK® compliant); surface-mount, leadless design optimized for automated assembly and thermal performance in outdoor PV environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1–3, 5–7) | Input terminal (cathode-side connection point) | Connected to cathode of upstream PV string segment; carries full string current during bypass |
| Cathode (Pin 4, 8) | Output terminal (anode-side connection point) | Connected to anode of downstream segment; forms low-impedance path when MOSFET is ON |
| Exposed thermal pad | Thermal and electrical ground reference | Must be soldered to ≥5 cm² Cu pour for RthJC = 4 °C/W; electrically tied to cathode internally |
Key Features
| Feature | Design Value |
|---|---|
| Self-powered gate drive | No external bias required - energy harvested from string current enables autonomous operation |
| Adaptive duty-cycle control | TON/T adjusts with temperature (95% → 75%) to balance VF reduction and leakage suppression |
| Ultra-low VF,AVG | 120 mV @10 A/25°C - cuts conduction loss vs. Schottky diodes by >60%, directly improving module efficiency |
| Low IR at high TJ | 10 µA @30 V/125°C - prevents thermal runaway in sustained partial-shading conditions |
| PQFN thermal optimization | 4 °C/W RthJC with standard PCB layout - simplifies thermal design for field-deployed modules |
Applications
| Residential Rooftop PV Arrays | Commercial Solar Carports |
|---|---|
Use Scenario: Multiple series-connected panels on sloped roofs subject to chimney, tree, or vent shadowing during morning/evening hours. IC Role / Device Role / Timing Role: Bypass switch activated automatically during cell-level shading; conducts string current around affected substring without user intervention or control signal. Use Value: Prevents localized overheating (hot spots) and permanent cell degradation while maintaining >92% of nominal string output under partial shading. | Use Scenario: Large-scale carport installations with fixed-tilt arrays exposed to vehicle-induced shading and seasonal sun-angle variation. IC Role / Device Role / Timing Role: Autonomous bypass element integrated into junction boxes; responds to reverse-bias condition within microseconds without auxiliary power. Use Value: Eliminates need for external gate drivers or controllers, reducing BOM cost and failure points in harsh outdoor enclosures. |
| Off-Grid Telecom Power Systems | Building-Integrated Photovoltaics (BIPV) |
Use Scenario: Remote telecom shelters powered by compact PV arrays where reliability and thermal margin are critical due to limited maintenance access. IC Role / Device Role / Timing Role: High-temperature-tolerant bypass device operating continuously at 125–140 °C ambient near rooftop enclosures. Use Value: Sustains <1 µA leakage at elevated temperature, avoiding cumulative power loss and thermal drift over 20+ year field life. | Use Scenario: Solar-integrated façades and roofing tiles with constrained airflow and non-standard mounting angles causing persistent asymmetric irradiation. IC Role / Device Role / Timing Role: Low-profile PQFN device mounted directly on module backsheet; leverages exposed thermal pad for passive dissipation without heatsinks. Use Value: Enables <1.0 mm profile increase over standard modules while delivering 3× lower conduction loss than legacy Schottky solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photovoltaic bypass switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay SI7850DP-T1-GE3 | Discrete N-channel MOSFET (60 V, 50 A); requires external gate driver and bootstrap circuit | Higher board space, BOM count, and design complexity; no integrated timing or self-powering | Only suitable when custom control logic and layout resources are available |
| Diodes Inc. DSSK30-0025 | Schottky diode (25 V, 30 A); VF ≈ 480 mV @10 A/25°C, IR ≈ 250 µA @25 V/125°C | Higher conduction loss and leakage; no thermal adaptation; simpler drop-in replacement but lower efficiency | Acceptable only for cost-sensitive, low-efficiency legacy designs with ample thermal margin |
Compared with SI7850DP-T1-GE3 and DSSK30-0025, SPV1001N30 uniquely integrates timing, gate drive, and energy harvesting - delivering lowest system-level power loss, smallest footprint, and highest reliability in unattended PV deployments without increasing design effort.
Availability
SPV1001N30 is available at Aetrix Electronics and suitable for residential solar inverters, commercial PV monitoring systems, and off-grid telecom power supplies requiring stable component supply across multi-year production cycles.
Supply support for SPV1001N30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing silicon solutions for automotive, industrial, and power management applications.
The SPV1001N belongs to ST's photovoltaic system IC portfolio, engineered specifically to replace passive bypass diodes with intelligent, self-powered switches that reduce thermal stress and improve energy harvest in real-world shading conditions.
FAQ
What is the recommended PCB layout for thermal performance?
Use ≥5 cm² of 35 µm copper connected to the exposed thermal pad on the bottom side of the PQFN package. Thermal vias (≥8 × 0.3 mm) should connect the pad to inner-layer ground planes. Avoid solder mask over the pad to ensure optimal thermal transfer and maintain RthJC ≤ 4 °C/W.
Does SPV1001N30 require external gate drive components?
No. The device incorporates an internal charge-pump circuit that harvests energy from the PV string current during OFF time to autonomously drive the MOSFET gate during ON time. No external capacitors, drivers, or bias supplies are needed - it operates as a true 2-terminal drop-in solution.
How does SPV1001N30 behave under partial shading at high ambient temperature?
At 125 °C junction temperature, its TON/T ratio reduces to 75%, and VF,AVG rises to 240 mV @5 A, while reverse leakage remains ≤10 µA @30 V. This adaptive response maintains safe power dissipation and avoids thermal runaway, unlike fixed-duty Schottky diodes whose leakage increases exponentially with temperature.
Can SPV1001N30 be used in 40 V PV string configurations?
No. SPV1001N30 is rated for 30 V DC reverse voltage. For 40 V systems, use SPV1001N40 - identical architecture and package but qualified to 40 V VR. Substituting SPV1001N30 in 40 V strings risks avalanche breakdown and irreversible damage during shading events.
SPV1001N30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 12.5A
- Voltage - Forward (Vf) (Max) @ If:
- 850 mV @ 5 A
- Speed:
- -
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 µA @ 30 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-PQFN (5x6)
- Operating Temperature - Junction:
- -45°C ~ 150°C
SPV1001N30 FAQ
1.How can I place an order for SPV1001N30 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPV1001N30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPV1001N30 reliable?
The price and inventory of SPV1001N30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPV1001N30 is usually 5 days.
3.What payment methods are accepted for SPV1001N30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPV1001N30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPV1001N30?
SPV1001N30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPV1001N30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPV1001N30?
For technical support, including SPV1001N30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPV1001N30 requirements.
6.How does Aetrix verify that SPV1001N30 is sourced from the original manufacturer or authorized distributors?
All SPV1001N30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPV1001N30 meets industry standards.
7.What is the process for return or replacement of SPV1001N30?
All SPV1001N30 units undergo pre-shipment inspection (PSI). If there is an issue with SPV1001N30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPV1001N30 part is unused and in its original packaging.
Return procedure for SPV1001N30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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