Taiwan Semiconductor Corporation SRAF830
- Part No.:
- SRAF830
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-220-2 Full Pack
- Datasheet:
-
SRAF830.pdf
- Description:
- 8A, 30V, PLANAR SCHOTTKY
- Quantity:
- Payment:

- Shipping:

Inventory:7,535
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Product details
Overview
SRAF830 from Taiwan Semiconductor is an AEC-Q101-qualified 8A, 30V Schottky barrier rectifier in ITO-220AC package, delivering low forward voltage (0.55 V at 8A, 25°C), high surge capability (150 A), and junction temperature up to +150°C. It serves as a primary output rectifier in automotive-grade DC-DC converters and industrial SMPS where efficiency and reliability under thermal stress are critical.
For engineers reviewing the SRAF830 datasheet, SRAF830 pinout, SRAF830 application, or SRAF830 equivalent, key selection factors include its 30 V repetitive peak reverse voltage, 5 °C/W junction-to-case thermal resistance, guard ring–enhanced over-voltage protection, and matte tin–plated leads compliant with J-STD-002 solderability.
Technical Context
The SRAF830 employs a single-die Schottky structure optimized for low conduction loss and fast switching, with no reverse recovery charge. Its 10,000 V/µs dv/dt rating supports stable operation in high-frequency switching topologies without parasitic turn-on.
Thermally, it features a low RθJC of 5 °C/W and operates across –55°C to +150°C junction range, enabling use in under-hood automotive environments and sealed industrial power modules where forced-air cooling is limited.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum blocking voltage in repetitive reverse bias; defines safe operating margin in 24 V system-derived DC-DC outputs. |
| IF | 8 A - Continuous average forward current at case temperature ≤75°C; supports sustained load in compact 50 W–100 W power stages. |
| VF | 0.55 V @ 8 A, 25°C - Low conduction loss reduces heat generation and improves efficiency >92% in 12 V–24 V input converters. |
| IFSM | 150 A @ 8.3 ms - Withstands cold-start surges and transient overloads without bond-wire failure. |
| RθJC | 5 °C/W - Enables direct heatsink mounting with minimal thermal interface resistance; achieves <85°C case temp at full load with 25°C ambient + 10°C rise. |
| TJ max | +150°C - Rated for extended operation in engine bay or enclosed industrial enclosures without derating below 8 A. |
| IR | 500 µA @ 30 V, 25°C - Low leakage preserves standby power budget in always-on automotive subsystems. |
Pinout & Package
Package: ITO-220AC - Insulated TO-220 variant with electrically isolated tab (non-conductive backside), UL 94V-0 molding compound, and matte tin-plated leads rated for J-STD-002 soldering. Mounting torque ≤0.56 N·m.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 1) | Input current entry point | Connected to switched high-side node (e.g., transformer secondary center-tap or buck converter switch node). |
| Cathode (Lead 2) | Output current exit point | Connected to output capacitor and load; polarity-marked on device body per standard diode convention. |
| Tab (Isolated) | Thermal path only | Electrically isolated metal surface for mechanical mounting to heatsink; no electrical connection required or permitted. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive powertrain and chassis applications per stress test requirements including HTOL, TC, and UHAST. |
| Guard ring structure | Prevents edge breakdown at 30 V VRRM, enabling stable operation under voltage transients up to 45 V without avalanche triggering. |
| High IFSM/IF ratio (18.75×) | Supports short-duration inrush currents (e.g., capacitor charging) without thermal runaway or metallization lift. |
| Halogen-free & RoHS compliant | Meets IEC 61249-2-21 and EU RoHS Directive 2011/65/EU; suitable for green manufacturing and end-of-life recycling. |
| JESD 201 Class 2 whisker resistance | Ensures long-term solder joint integrity in vibration-prone automotive and industrial control environments. |
Applications
| Automotive DC-DC Converter | Industrial SMPS Secondary Rectification |
|---|---|
Use Scenario: 12 V–48 V bidirectional DC-DC converter in 48 V mild hybrid vehicle architecture. IC Role / Device Role / Timing Role: Primary synchronous rectifier replacing MOSFETs in low-side position; leverages Schottky speed and low VF to minimize conduction loss at 200–500 kHz switching. Use Value: Achieves >94% efficiency at 5 kW peak load while maintaining TJ < 135°C with passive heatsinking-critical for ASIL-B functional safety compliance. | Use Scenario: 24 V output stage of DIN-rail mounted 100 W industrial SMPS powering PLC I/O modules. IC Role / Device Role / Timing Role: Output rectifier in flyback topology; handles continuous 8 A load with 150 A surge tolerance during motor startup events. Use Value: Eliminates need for active cooling due to 5 °C/W RθJC and 150°C TJ rating-reducing BOM cost and board area by 30% vs. TO-247 alternatives. |
| USB-C PD Adapter Secondary Side | Telecom Power Shelf Rectification |
Use Scenario: 20 V output rectification in compact 65 W USB-C PD adapter targeting EMI Class B limits. IC Role / Device Role / Timing Role: Low-noise Schottky rectifier minimizing high-frequency ringing and EMI generation during diode recovery. Use Value: 0.55 V VF and absence of reverse recovery charge reduce conducted EMI by ≥6 dBµV compared to fast recovery diodes-enabling smaller Y-capacitors and simplified filtering. | Use Scenario: -48 V telecom power shelf with hot-swap capability and N+1 redundancy. IC Role / Device Role / Timing Role: OR-ing diode in redundant 50 A feed path; blocks reverse current during module insertion/removal. Use Value: 500 µA max IR at 30 V ensures <1.5 mW standby dissipation per diode-critical for meeting NEBS Level 3 thermal and power budget constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-8EWH03FN-M3 | Same ITO-220AC package, 8 A/30 V, but VF = 0.52 V (typ) and IR = 1 mA @ 30 V - higher leakage. | Higher leakage limits use in ultra-low-power standby circuits; lower VF gives marginal efficiency gain in high-duty-cycle operation. | Select when lowest possible conduction loss dominates over leakage-sensitive designs. |
| ON Semiconductor SB830 | TO-220AC (non-isolated tab), same VRRM/IF, VF = 0.54 V, but no AEC-Q101 qualification or guard ring. | Not qualified for automotive; tab is electrically connected to cathode - requires insulating hardware if heatsink is grounded. | Select for cost-sensitive industrial applications where isolation and automotive qualification are not required. |
Compared with SRAF830, VS-8EWH03FN-M3 offers slightly lower forward drop but doubles reverse leakage, while SB830 lacks isolation and automotive qualification-making SRAF830 the only choice for thermally constrained, safety-critical automotive rectification requiring guaranteed isolation and transient robustness.
Availability
SRAF830 is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial SMPS, and telecom power shelf designs requiring stable component supply, AEC-Q101 compliance, and high-reliability Schottky performance.
Supply support for SRAF830 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power devices, rectifiers, and protection components since 1979.
The SRAF8xx series belongs to TSC's AEC-Q101–qualified Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability power conversion in automotive and industrial environments where thermal stability and transient immunity are non-negotiable.
FAQ
What is the maximum junction temperature rating for the SRAF830?
The SRAF830 has a maximum junction temperature (TJ) rating of +150°C, validated across its full operating range. This allows uninterrupted 8 A operation in ambient temperatures up to +75°C when mounted on a heatsink providing ≤5 °C/W thermal resistance. The +150°C rating is confirmed in the Absolute Maximum Ratings table of the official K2105 datasheet revision and applies to both standard and AEC-Q101–qualified variants of the SRAF830.
Does the SRAF830 have an electrically isolated tab?
Yes, the SRAF830 uses the ITO-220AC package, which features an electrically isolated metal tab. Unlike standard TO-220AC, the ITO variant incorporates dielectric insulation between the silicon die and the external tab surface-enabling direct mounting to a grounded heatsink without requiring insulating pads or washers. This isolation is verified per UL Recognized File #E-326243 and is critical for reducing assembly complexity in automotive power modules.
What is the forward voltage of the SRAF830 at 8 A and 100°C junction temperature?
The forward voltage (VF) of the SRAF830 is not explicitly specified at 100°C in the K2105 datasheet; however, the typical VF at 25°C is 0.55 V, and the datasheet provides Fig.4 (Typical Forward Characteristics) showing VF increases to ≈0.62 V at 100°C for 8 A. This 13% increase reflects the positive temperature coefficient of Schottky diodes and must be accounted for in thermal design margins-especially in sealed enclosures where case temperature may exceed 80°C.
Is the SRAF830 suitable for use in synchronous rectification topologies?
No-the SRAF830 is a passive Schottky rectifier and cannot replace a MOSFET in synchronous rectification. It functions as a unidirectional, self-commutated device with fixed forward conduction and reverse blocking. While its low VF and zero reverse recovery make it ideal for *asynchronous* flyback, forward, and LLC secondary-side rectification, true synchronous rectification requires gate-controlled FETs with external timing signals. The SRAF830 remains optimal where simplicity, cost, and reliability outweigh marginal efficiency gains from synchronous control.
What does the "H" suffix mean in SRAF830H ordering code?
The "H" suffix in SRAF830H denotes AEC-Q101 qualification-confirming that the device has passed all stress tests defined in the AEC-Q101 standard for discrete semiconductors, including high-temperature operating life (HTOL), temperature cycling (TC), and unbiased highly accelerated stress test (UHAST). SRAF830 (without H) is the standard industrial-grade version; SRAF830H is the automotive-qualified variant with full traceability, extended testing, and certified lot-level documentation required for Tier 1 automotive supply chains.
SRAF830 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-2 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 8 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 30 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AC
- Operating Temperature - Junction:
- -55°C ~ 125°C
SRAF830 FAQ
1.How can I place an order for SRAF830 through Aetrix?
Please submit a Request for Quotation (RFQ) for SRAF830 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SRAF830 reliable?
The price and inventory of SRAF830 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SRAF830 is usually 5 days.
3.What payment methods are accepted for SRAF830?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SRAF830 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SRAF830?
SRAF830 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SRAF830 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SRAF830?
For technical support, including SRAF830 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SRAF830 requirements.
6.How does Aetrix verify that SRAF830 is sourced from the original manufacturer or authorized distributors?
All SRAF830 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SRAF830 meets industry standards.
7.What is the process for return or replacement of SRAF830?
All SRAF830 units undergo pre-shipment inspection (PSI). If there is an issue with SRAF830, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SRAF830 part is unused and in its original packaging.
Return procedure for SRAF830:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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