Taiwan Semiconductor Corporation SRF1690

Overview

SRF1690 from Taiwan Semiconductor is a 16A, 90V Schottky barrier rectifier in ITO-220AB package with dual-die configuration, 4.0°C/W junction-to-case thermal resistance, 200A surge rating, and 100µA reverse leakage at 25°C - used in high-efficiency DC/DC converters and industrial SMPS.

For engineers reviewing the SRF1690 datasheet, SRF1690 pinout, SRF1690 application, or SRF1690 equivalent, key selection criteria include V_RRM=90V, I_F=16A, T_J max=150°C, low VF (0.90V @ 8A), and AEC-Q101 qualification availability via SRF1690H variant.

Technical Context

The SRF1690 employs dual Schottky die in a single ITO-220AB thermally optimized package, enabling parallel conduction paths for improved current handling and thermal distribution. Its guard ring structure provides overvoltage protection, and matte tin-plated leads meet J-STD-002 solderability standards.

Rated for continuous operation up to 150°C junction temperature, the device delivers 0.90V forward voltage at 8A and 25°C, with reverse leakage limited to 100µA at rated 90V and 25°C - critical for minimizing conduction loss in high-frequency switching topologies.

Key Specifications

Pinout & Package

Package: ITO-220AB - insulated thermoplastic case with integral metal tab, UL 94V-0 rated molding compound, matte tin-plated leads, 1.70g mass, and 0.56 N·m max mounting torque.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-16CTQ090 and SB1690, the SRF1690 uniquely offers dual-anode topology within the same ITO-220AB footprint - enabling compact, low-inductance multi-path rectification without board-level paralleling or added layout complexity.

Availability

SRF1690 is available at Aetrix Electronics and suitable for industrial SMPS, automotive DC/DC converters, high-density adapters, and telecom power rectification requiring stable component supply and long-term lifecycle support.

Supply support for SRF1690 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS devices, and MOSFETs since 1979.

The SRF16xx series was designed specifically for high-efficiency, high-reliability power conversion in industrial and automotive applications - emphasizing thermal robustness, surge resilience, and AEC-Q101 scalability.

FAQ

What is the maximum junction temperature rating for the SRF1690?

The SRF1690 has a maximum junction temperature (T_J) rating of +150°C, verified per absolute maximum ratings table in the official datasheet. This allows operation in high-ambient environments such as enclosed industrial power supplies or under-hood automotive locations. Derating curves confirm usable current capacity down to 125°C ambient when mounted on an appropriate heatsink. The SRF1690 maintains specified electrical performance within this full range.

Does the SRF1690 have AEC-Q101 qualification?

The base SRF1690 is not AEC-Q101 qualified; however, the SRF1690H variant - identical in all electrical and thermal specifications - is fully AEC-Q101 qualified per J2105 revision. It carries the "H" suffix in ordering code and is subject to additional stress testing including temperature cycling, HTRB, and ESD. For automotive applications requiring qualification, specify SRF1690H - not SRF1690 - during procurement.

What is the pin configuration and polarity marking for the SRF1690?

The SRF1690 uses an ITO-220AB package with three external terminals: Anode 1, Cathode (shared), and Anode 2 - arranged left-to-right as A1–K–A2 when viewing the marked side with tab down. Polarity is indicated by a white bar adjacent to Anode 1 and the "SRF1690" laser marking. The metal tab is electrically connected to the cathode and must be isolated unless referenced to system ground.

How does the dual-die structure of the SRF1690 improve thermal performance compared to single-die alternatives?

The dual-die structure in the SRF1690 distributes power dissipation across two Schottky junctions while sharing one cathode and thermal path. Though R_θJC is 4.0°C/W (vs. 3.0°C/W for some single-die 16A devices), the distributed layout lowers localized junction hot spots and improves thermal time constant response. This results in more uniform temperature rise across the die area during pulsed loads, enhancing reliability in intermittent high-current applications like motor drive snubbers.

What is the reverse leakage current specification for the SRF1690 at elevated temperature?

At rated 90V reverse voltage and 125°C junction temperature, the SRF1690 exhibits ≤5 mA total reverse leakage per diode, as confirmed in the Electrical Specifications table. At 100°C, leakage is unspecified in the datasheet; at 25°C it is guaranteed ≤100 µA. This elevated-temperature leakage behavior is critical for standby power budgeting in always-on telecom or IoT power supplies where thermal derating directly impacts system-level efficiency targets.