Taiwan Semiconductor Corporation SRS2030
- Part No.:
- SRS2030
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SRS2030.pdf
- Description:
- DIODE ARR SCHOTT 30V 20A TO263AB
- Quantity:
- Payment:

- Shipping:

Inventory:2,418
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Product details
Overview
SRS2030 from Taiwan Semiconductor is a 20A, 30V repetitive peak reverse voltage Schottky barrier rectifier in TO-263AB (D2PAK) package, designed for high-efficiency DC/DC conversion and SMPS secondary-side rectification with low forward voltage drop and high surge current capability.
For engineers reviewing the SRS2030 datasheet, SRS2030 pinout, SRS2030 application, or SRS2030 equivalent, key selection criteria include its 0.55 V forward voltage at 10 A/25°C, 200 A non-repetitive surge rating, 1.5 °C/W junction-to-case thermal resistance, and dual-die configuration enabling high-current handling in compact surface-mount form.
Technical Context
The SRS2030 employs a dual-die Schottky barrier structure housed in a single TO-263AB (D2PAK) package, delivering 20 A average forward current with thermal performance optimized via low RθJC of 1.5 °C/W. Its guard ring design provides overvoltage protection while maintaining fast switching behavior and low reverse recovery charge.
Rated for operation up to +150°C junction temperature, the device supports high-density power designs requiring robust surge immunity (200 A IFSM, 8.3 ms half-sine) and moisture-insensitive assembly (J-STD-020 Level 1). Reverse leakage remains ≤500 µA at 25°C and ≤15 mA at 100°C under rated VRRM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum reverse blocking voltage before breakdown; defines usable input/output voltage range in buck, flyback, or OR-ing applications |
| IF | 20 A - Continuous forward current rating; determines minimum heatsink sizing and PCB copper area for thermal management |
| IFSM | 200 A - Peak non-repetitive surge current; enables reliable operation during power-up inrush or transient load events |
| VF | 0.55 V @ 10 A, 25°C - Low conduction loss per diode; reduces power dissipation and improves system efficiency vs. silicon rectifiers |
| RθJC | 1.5 °C/W - Junction-to-case thermal resistance; allows direct thermal coupling to heatsink or copper plane for stable high-current operation |
| TJ max | +150°C - Maximum operating junction temperature; supports extended ambient operation in enclosed or high-power-density enclosures |
| IR | ≤500 µA @ 30 V, 25°C - Low reverse leakage; minimizes standby power loss in offline adapters and isolated DC/DC converters |
Pinout & Package
Package: TO-263AB (D2PAK), surface-mount, 3-terminal configuration with anode-cathode-anode layout (dual common-cathode die structure). Matte tin-plated leads meet J-STD-002 solderability requirements; polarity marked on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Left) | Anode 1 | Input terminal for first Schottky die; connects to transformer secondary or switch node in synchronous rectification |
| Pin 2 (Center tab) | Cathode (common) | Electrically tied cathodes of both dies; primary thermal path to PCB copper pour or heatsink |
| Pin 3 (Right) | Anode 2 | Input terminal for second Schottky die; enables dual-phase or interleaved rectification without external parallel devices |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die configuration | Two independent 20A Schottky dies share common cathode; enables 40A-equivalent current handling with single-package footprint and thermal interface |
| Guard ring structure | Integrated edge termination enhances voltage ruggedness and prevents premature avalanche failure under transient overvoltage conditions |
| Moisture sensitivity level 1 | No bake requirement prior to reflow; compatible with standard automated SMT lines without special handling or dry-pack protocols |
| UL 94V-0 molding compound | Flame-retardant encapsulation meets safety standards for industrial and consumer power supplies without additional conformal coating |
| Halogen-free construction | Complies with IEC 61249-2-21; eliminates brominated flame retardants for RoHS-compliant and environmentally regulated end equipment |
Applications
| Server VRM Output Rectification | Laptop Adapter Secondary Side |
|---|---|
Use Scenario: High-current, low-voltage output stage of multiphase buck converter supplying CPU/GPU core power. IC Role / Device Role / Timing Role: Dual-anode Schottky rectifier replacing MOSFETs in synchronous rectification; leverages low VF to minimize conduction loss at 1–2 V output. Use Value: Enables >92% efficiency at 100 A load with reduced thermal stress versus single-die alternatives due to distributed current sharing across two dies. | Use Scenario: Isolated AC/DC adapter converting 19 V DC output from flyback transformer secondary. IC Role / Device Role / Timing Role: Primary output rectifier handling continuous 20 A load with minimal voltage drop and ripple generation. Use Value: Delivers 0.55 V forward drop at 10 A, reducing heat generation by ~35% compared to standard 40 V Schottky alternatives in same package. |
| Industrial DC/DC Converter | Telecom Power Shelf Rectification |
Use Scenario: 48 V input to 12 V output isolated DC/DC module for programmable logic controllers and I/O modules. IC Role / Device Role / Timing Role: Secondary-side rectifier operating continuously at 60°C ambient with forced air cooling. Use Value: Rated for +150°C junction temperature and 200 A surge withstand ensures reliability during motor startup transients and brownout recovery. | Use Scenario: N+1 redundant 54 V to 12 V intermediate bus converter in telecom shelf with hot-swap capability. IC Role / Device Role / Timing Role: OR-ing diode array implementing fault-isolation between parallel power modules. Use Value: Dual-anode topology allows single-device implementation of back-to-back OR-ing function with shared cathode return path and simplified layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-20CPH03-M3 | Single-die 20 A, 30 V Schottky in TO-263AB; higher VF (0.62 V @ 10 A); no guard ring | Lacks dual-die current sharing; less suitable for high-surge or high-reliability OR-ing | Prefer SRS2030 where dual-die redundancy, lower VF, or guard ring protection is required |
| ON Semiconductor SB2030 | 20 A, 30 V Schottky in TO-220AC; higher RθJC (2.5 °C/W); leaded through-hole package | Requires through-hole assembly and larger board area; unsuitable for high-density SMT designs | Select SRS2030 for surface-mount compatibility, superior thermal resistance, and automated placement support |
Compared with VS-20CPH03-M3 and SB2030, the SRS2030 delivers lower conduction loss, integrated overvoltage protection, and dual-die current distribution-making it optimal for space-constrained, high-reliability power stages where thermal performance and surge resilience are critical.
Availability
SRS2030 is available at Aetrix Electronics and suitable for switching mode power supply (SMPS), DC/DC converters, and AC/DC adapters requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.
Supply support for SRS2030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and consumer markets.
The SRS2030 belongs to TSC's high-current Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in compact, thermally demanding power systems.
FAQ
What is the maximum junction temperature rating for the SRS2030?
The SRS2030 has a maximum junction temperature (TJ) rating of +150°C, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet. This allows sustained operation in high-ambient environments such as enclosed power supplies or industrial control cabinets. Derating curves confirm usable current capacity down to 12 A at 100°C case temperature. The SRS2030 must be mounted on adequate copper area to maintain this limit under full 20 A load.
Does the SRS2030 have a guard ring structure, and what benefit does it provide?
Yes, the SRS2030 incorporates a guard ring for overvoltage protection, explicitly stated in its features list. This structure improves edge termination uniformity and suppresses premature avalanche breakdown during voltage transients. In practice, this increases reliability in flyback or LLC resonant converters where reflected spikes may exceed nominal VRRM. The guard ring is integral to the SRS2030 die design and not present in many competing 30 V Schottky rectifiers.
Is the SRS2030 suitable for automated SMT assembly, and what is its moisture sensitivity level?
Yes, the SRS2030 is explicitly designed for automated placement, as confirmed in its features list. It carries J-STD-020 Moisture Sensitivity Level 1, meaning it can be stored indefinitely at ambient conditions and requires no baking prior to reflow soldering. Its matte tin-plated leads also comply with J-STD-002 for solderability, ensuring consistent wetting and joint integrity in high-volume SMT lines using standard lead-free profiles.
What is the forward voltage specification for the SRS2030, and under what test conditions is it measured?
The SRS2030 has a typical forward voltage (VF) of 0.55 V at 10 A and 25°C junction temperature, per electrical specifications table. This value is measured using a pulse test with 0.3 ms pulse width to avoid self-heating effects. At elevated temperatures (e.g., 100°C), VF decreases slightly, improving conduction efficiency in thermally stressed operation. The SRS2030's low VF directly contributes to reduced power loss versus higher-VF alternatives like the SB2030 or VS-20CPH03-M3.
How is the dual-die configuration of the SRS2030 implemented electrically and thermally?
The SRS2030 integrates two independent Schottky dies sharing a common cathode terminal (Pin 2), with separate anode terminals (Pins 1 and 3). Electrically, this enables parallel current paths without external paralleling components. Thermally, both dies bond to the same copper tab, allowing combined heat dissipation through a single low-RθJC path of 1.5 °C/W. This architecture is confirmed in the "Configuration: Dual dies" line of the KEY PARAMETERS section and distinguishes the SRS2030 from single-die equivalents such as the SRS2030's sibling SRS2030-1 (not offered).
SRS2030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io) (per Diode):
- 20A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 30 V
- Operating Temperature - Junction:
- -55°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
SRS2030 FAQ
1.How can I place an order for SRS2030 through Aetrix?
Please submit a Request for Quotation (RFQ) for SRS2030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SRS2030 reliable?
The price and inventory of SRS2030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SRS2030 is usually 5 days.
3.What payment methods are accepted for SRS2030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SRS2030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SRS2030?
SRS2030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SRS2030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SRS2030?
For technical support, including SRS2030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SRS2030 requirements.
6.How does Aetrix verify that SRS2030 is sourced from the original manufacturer or authorized distributors?
All SRS2030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SRS2030 meets industry standards.
7.What is the process for return or replacement of SRS2030?
All SRS2030 units undergo pre-shipment inspection (PSI). If there is an issue with SRS2030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SRS2030 part is unused and in its original packaging.
Return procedure for SRS2030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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