My Inquiry
My Account
Taiwan Semiconductor Corporation SRS2050HMNG
- Part No.:
- SRS2050HMNG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SRS2050HMNG.pdf
- Description:
- DIODE ARRAY GP 50V 20A TO263AB
- Quantity:
- Payment:
- Shipping:
Inventory:8,894
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SRS2050HMNG from Taiwan Semiconductor is a 20A, 50V Schottky barrier rectifier in TO-263AB (D2PAK) package, designed for high-efficiency DC/DC conversion and SMPS secondary-side rectification. It features 0.70 V forward voltage at 10 A and 25°C, 200 A non-repetitive surge current capability, and junction temperature rating up to +150°C.
For engineers reviewing the SRS2050HMNG datasheet, SRS2050HMNG pinout, SRS2050HMNG application, or SRS2050HMNG equivalent, key selection criteria include reverse voltage margin, thermal resistance (1.5°C/W), moisture sensitivity level (J-STD-020 Level 1), RoHS/halogen-free compliance, and dual-die configuration for parallel operation support.
Technical Context
This Schottky rectifier uses dual-die construction in a single TO-263AB package, enabling higher current handling without paralleling discrete devices. Its guard ring structure provides overvoltage protection, and matte tin-plated terminals ensure reliable solderability per J-STD-002.
The device operates across -55°C to +150°C junction range with 1.5°C/W junction-to-case thermal resistance, supporting high-power density designs where thermal management is critical. Reverse leakage remains ≤500 µA at 25°C and ≤10 mA at 125°C under rated 50 V reverse bias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 50 V - Maximum repetitive reverse blocking voltage; defines safe operating limit in flyback or forward converter output stages |
| IF | 20 A - Continuous average forward current; supports high-output-current 12 V/24 V DC/DC rails |
| IFSM | 200 A - Peak non-repetitive surge current (8.3 ms half-sine); withstands inrush and transient overload events |
| VF | 0.70 V @ 10 A, 25°C - Low conduction loss improves system efficiency and reduces heatsink requirements |
| RθJC | 1.5 °C/W - Enables direct thermal coupling to PCB copper or heatsink; critical for power density optimization |
| TJ max | +150°C - Extended junction temperature rating allows operation in thermally constrained industrial environments |
| MSL | Level 1 (J-STD-020) - No floor life limitation; suitable for standard SMT reflow without dry pack or baking |
Pinout & Package
Package: TO-263AB (D2PAK), surface-mount, 3-terminal configuration with anode-cathode-anode layout (dual common-cathode die). Case meets UL 94V-0; terminals are matte tin-plated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Left) | Anode 1 | First Schottky die anode; connects to input node in dual-output or interleaved topologies |
| Pin 2 (Center Tab) | Cathode (Common) | Internally bonded cathode for both dies; serves as primary thermal and electrical return path |
| Pin 3 (Right) | Anode 2 | Second Schottky die anode; enables independent control or redundancy in split-rail designs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die configuration | Two independent 20A Schottky junctions in one D2PAK; eliminates board space and interconnect losses of discrete paralleling |
| Guard ring overvoltage protection | Enhances ruggedness against voltage transients in unregulated or loosely regulated DC/DC outputs |
| 1.5°C/W RθJC | Enables >15 W dissipation with minimal ΔT to heatsink; supports compact 50–100 W adapter designs |
| J-STD-020 Level 1 MSL | Zero floor life restriction simplifies manufacturing logistics and eliminates pre-reflow baking steps |
| RoHS & halogen-free | Complies with IEC 61249-2-21; meets global environmental compliance requirements for industrial and consumer end equipment |
Applications
| Server Power Supply | Laptop Adapter |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 48 V to 12 V intermediate bus converters within rack-mounted servers. IC Role / Device Role / Timing Role: High-current Schottky rectifier replacing MOSFETs in low-voltage, high-frequency buck-derived topologies. Use Value: 0.70 V VF reduces conduction loss by ~30% vs. comparable 60 V MOSFETs at 10 A, improving full-load efficiency by 0.8–1.2%. | Use Scenario: Output rectification in compact 65 W GaN-based laptop adapters operating at 100–300 kHz. IC Role / Device Role / Timing Role: Dual-anode Schottky enabling interleaved output stage for ripple cancellation and EMI reduction. Use Value: Dual-die layout allows independent gate drive timing per anode, supporting phase-shifted control without external current sharing components. |
| Industrial DC/DC Module | Telecom Rectifier Board |
Use Scenario: 24 V output stage in wide-input (36–75 V) isolated DC/DC modules for factory automation controllers. IC Role / Device Role / Timing Role: Primary output rectifier with thermal coupling to internal heatsink via center tab. Use Value: 1.5°C/W RθJC sustains 20 A continuous current at TC = 90°C, eliminating need for forced air cooling. | Use Scenario: Redundant 48 V output rectification on telecom shelf power boards requiring N+1 fault tolerance. IC Role / Device Role / Timing Role: Dual-anode configuration used for current splitting between two independent output paths. Use Value: Independent anodes allow separate fusing and monitoring per leg, meeting GR-1089-CORE lightning surge survivability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-20CPH05-M3 | 50 V VRRM, 20 A IF, TO-247AC package; 1.0°C/W RθJC; VF = 0.62 V @ 10 A | Higher thermal performance but larger footprint and through-hole mounting | Preferred when board-level thermal resistance dominates and through-hole assembly is acceptable |
| ON Semiconductor MBR2050CT | 50 V VRRM, 20 A IF, TO-220AB package; VF = 0.75 V @ 10 A; RθJC = 2.0°C/W | Lower cost, but higher conduction loss and inferior thermal resistance than SRS2050HMNG | Selected for cost-sensitive, lower-power (<15 A continuous) applications where thermal headroom exists |
Compared with VS-20CPH05-M3 and MBR2050CT, the SRS2050HMNG delivers optimal balance of surface-mount compatibility, thermal performance (1.5°C/W), and low VF (0.70 V), making it especially suited for space-constrained, high-efficiency 20 A DC/DC modules requiring J-STD-020 Level 1 manufacturability.
Availability
SRS2050HMNG is available at Aetrix Electronics and suitable for switching mode power supplies, laptop adapters, and industrial DC/DC converters requiring stable component supply, RoHS/halogen-free compliance, and J-STD-020 Level 1 SMT process compatibility.
Supply support for SRS2050HMNG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.
The SRS20xx series targets high-efficiency, high-reliability power conversion applications, emphasizing low VF, rugged surge capability, and advanced packaging for automated manufacturing-specifically optimized for next-generation SMPS and adapter designs.
FAQ
What is the maximum junction temperature rating for the SRS2050HMNG?
The SRS2050HMNG has a maximum junction temperature rating of +150°C, confirmed in the Absolute Maximum Ratings table. This allows sustained operation in thermally demanding environments such as enclosed server power supplies or industrial motor drives where ambient temperatures exceed 85°C. The SRS2050HMNG maintains specified electrical performance up to this limit when thermal design respects its 1.5°C/W junction-to-case resistance.
Does the SRS2050HMNG support dual-anode independent operation?
Yes, the SRS2050HMNG integrates two independent Schottky dies sharing a common cathode (center tab), with separate anode terminals (Pins 1 and 3). This configuration enables true independent control-such as phase-shifted rectification or redundant current paths-without internal coupling. Each anode handles up to 20 A average current, and the SRS2050HMNG datasheet confirms isolation between anodes in the Mechanical Data and Pin Function sections.
Is the SRS2050HMNG compatible with lead-free reflow profiles?
Yes, the SRS2050HMNG is fully compatible with standard lead-free reflow profiles (J-STD-020 Class 3 peak: 260°C). Its matte tin-plated terminals meet J-STD-002 solderability requirements, and its MSL Level 1 rating means no dry-pack or baking is required prior to assembly. The SRS2050HMNG package molding compound also complies with UL 94V-0 flammability standards.
What is the reverse leakage current specification for the SRS2050HMNG at 125°C?
At 125°C junction temperature and rated 50 V reverse voltage, the SRS2050HMNG specifies a maximum reverse leakage current of 10 mA per diode, as stated in the Electrical Specifications table under "Reverse current @ rated VR" with condition TJ = 125°C. This value reflects worst-case behavior across production lots and ensures stable operation in high-temperature DC/DC outputs.
How does the guard ring feature improve reliability of the SRS2050HMNG?
The guard ring in the SRS2050HMNG enhances edge termination robustness, suppressing premature avalanche breakdown during voltage transients. Per the datasheet Features section, this structure increases ruggedness against line surges and switching spikes in SMPS and adapter applications. It directly contributes to the SRS2050HMNG's ability to sustain 200 A IFSM without degradation and supports long-term reliability in unregulated or dynamically loaded systems.
SRS2050HMNG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 50 V
- Current - Average Rectified (Io) (per Diode):
- 20A
- Voltage - Forward (Vf) (Max) @ If:
- 700 mV @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 50 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
SRS2050HMNG FAQ
1.How can I place an order for SRS2050HMNG through Aetrix?
Please submit a Request for Quotation (RFQ) for SRS2050HMNG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SRS2050HMNG reliable?
The price and inventory of SRS2050HMNG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SRS2050HMNG is usually 5 days.
3.What payment methods are accepted for SRS2050HMNG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SRS2050HMNG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SRS2050HMNG?
SRS2050HMNG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SRS2050HMNG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SRS2050HMNG?
For technical support, including SRS2050HMNG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SRS2050HMNG requirements.
6.How does Aetrix verify that SRS2050HMNG is sourced from the original manufacturer or authorized distributors?
All SRS2050HMNG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SRS2050HMNG meets industry standards.
7.What is the process for return or replacement of SRS2050HMNG?
All SRS2050HMNG units undergo pre-shipment inspection (PSI). If there is an issue with SRS2050HMNG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SRS2050HMNG part is unused and in its original packaging.
Return procedure for SRS2050HMNG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SRS2050HMNG Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
