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Taiwan Semiconductor Corporation SS13 R3G

Part No.:
SS13 R3G
Manufacturer:
Taiwan Semiconductor Corporation
Category:
Single Diodes
Package:
DO-214AC, SMA
Datasheet:
AetrixSS13 R3G.pdf
Description:
DIODE SCHOTTKY 30V 1A DO214AC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:952

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Product details

Overview

SS13 R3G from Taiwan Semiconductor is a 1A, 30V Schottky barrier surface-mount rectifier in DO-214AC (SMA) package, featuring 0.50V forward voltage at 1A/25°C, 40A peak surge current, and junction temperature up to +150°C. It serves as a low-loss freewheeling or output rectifier in compact DC/DC converters and AC/DC adapters.

For engineers reviewing the SS13 R3G datasheet, SS13 R3G pinout, SS13 R3G application, or SS13 R3G equivalent, key selection criteria include its 30V VRRM, low VF at high temperature, moisture sensitivity level 1 compliance, RoHS/halogen-free status, and suitability for automated SMT assembly in space-constrained power supplies.

Technical Context

The SS13 R3G implements a single-die Schottky junction optimized for fast switching and minimal conduction loss. Its 10,000 V/µs dV/dt rating supports reliable operation in high-frequency SMPS topologies, while the guard ring structure provides overvoltage robustness without compromising leakage performance.

Thermal design is enabled by RθJL = 28°C/W and RθJA = 88°C/W, allowing 1A continuous operation with moderate PCB copper area. Reverse leakage remains ≤200 µA at 25°C and ≤6 mA at 100°C under rated 30V reverse bias.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM30 V - Maximum repetitive reverse blocking voltage; defines safe operating range in 24V-output DC/DC stages
IF1 A - Continuous forward current rating; supports typical adapter output stages without derating at ≤70°C ambient
VF @ 1A, 25°C0.50 V - Low conduction loss enabling >92% efficiency in 5–12V buck converters
IFSM40 A - Peak surge capability handles inrush and transient overload without failure
TJ max+150°C - Extended junction temperature rating allows operation in sealed or high-ambient industrial enclosures
RθJL28°C/W - Enables direct thermal transfer to PCB copper pour for passive cooling in cost-sensitive designs
MSLLevel 1 (per J-STD-020) - No floor life limitation; suitable for standard reflow without dry pack or baking

Pinout & Package

Package: DO-214AC (SMA), surface-mount plastic case with matte tin-plated leads, cathode indicated by band. Weight: 0.060 g.

Pin/TerminalCircuit RoleDesign Meaning
AnodeInput current terminalConnected to switch node or transformer secondary; requires adequate trace width for 1A RMS
CathodeOutput current terminalConnected to output filter capacitor; polarity marking ensures correct orientation during automated placement

Key Features

FeatureDesign Value
Low forward voltage0.50 V @ 1A/25°C reduces conduction loss by ~35% vs. comparable Si diodes, directly improving light-load efficiency
Guard ring protectionIntegrated overvoltage guard ring enhances ruggedness against line transients in offline adapters without external snubbers
High surge current rating40A IFSM withstands repeated cold-start surges in 12V/1A wall adapters without degradation
Moisture sensitivity level 1Eliminates pre-bake requirements and simplifies SMT line integration for high-volume manufacturing
RoHS & halogen-freeComplies with IPC-1752A material declaration standards for export to EU, Japan, and China markets

Applications

Adapter Power SupplyUSB-C PD Charger

Use Scenario: 5–20V output stage in compact wall-mounted AC/DC adapters delivering up to 12W.

IC Role / Device Role / Timing Role: Output rectifier replacing conventional PN diodes to reduce heat and improve efficiency.

Use Value: 0.50V VF cuts conduction loss by 0.3W vs. Si diode, enabling smaller heatsinks and higher power density.

Use Scenario: Secondary-side synchronous rectification in 18–20V USB-C PD 3.0 chargers.

IC Role / Device Role / Timing Role: Freewheeling diode in quasi-resonant flyback topology during dead-time intervals.

Use Value: 10,000 V/µs dV/dt rating prevents false turn-on during high dv/dt switching transitions.

Industrial DC/DC ModuleMonitor Power Board

Use Scenario: 12V-to-5V isolated DC/DC converter on factory automation control boards.

IC Role / Device Role / Timing Role: Input rectifier for auxiliary bias winding supplying gate drivers and feedback circuitry.

Use Value: +150°C TJ max enables reliable operation adjacent to MOSFETs in thermally dense layouts.

Use Scenario: Standby power supply rectifier in LCD monitor mainboard with tight height constraints.

IC Role / Device Role / Timing Role: Low-profile output rectifier mounted on bottom side of 1.6mm PCB.

Use Value: DO-214AC (SMA) footprint occupies only 4.6 × 2.8 mm, saving >40% board area vs. SMB packages.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor SS13HVF = 0.52V @ 1A/25°C; same DO-214AC package; MSL Level 1Identical electrical envelope but slightly higher forward drop increases conduction loss by ~4 mW at 1APreferred where ON Semi supply chain alignment is required; no layout change needed
Vishay VS-1SS3VRRM = 30V; IF = 1A; VF = 0.55V @ 1A/25°C; RθJA = 90°C/WHigher thermal resistance limits ambient operating range by ~5°C at full loadSuitable for lower-power applications (<800mW dissipation); verified compatibility in existing SMA footprints

Compared with SS13 R3G, SS13H offers identical form factor with marginally higher VF, while VS-1SS3 trades 0.05V higher forward drop and reduced thermal performance for broader global distribution-both require no PCB revision but may impact thermal margin in sealed enclosures.

Availability

SS13 R3G is available at Aetrix Electronics and suitable for adapter power supplies, USB-C PD chargers, and industrial DC/DC modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for SS13 R3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated Taiwanese semiconductor manufacturer specializing in discrete power devices, including Schottky rectifiers, TVS diodes, and MOSFETs, with ISO 9001 and IATF 16949 certification.

The SS12–SS115 family was designed for cost-sensitive, high-volume AC/DC and DC/DC power conversion applications demanding low VF, high surge tolerance, and automated assembly readiness-targeting consumer, industrial, and computing power systems.

FAQ

What is the maximum junction temperature rating for SS13 R3G?

The SS13 R3G has a maximum junction temperature (TJ) rating of +150°C, confirmed in the Absolute Maximum Ratings table. This allows sustained 1A operation in ambient temperatures up to +85°C with appropriate PCB copper area, making SS13 R3G suitable for enclosed industrial power supplies where thermal headroom is constrained.

Does SS13 R3G meet lead-free and RoHS requirements?

Yes, SS13 R3G is RoHS compliant and halogen-free, as explicitly stated in the FEATURES section. Its matte tin-plated leads are solderable per J-STD-002, and the molding compound meets UL 94V-0 flammability rating-fully satisfying WEEE and China RoHS II regulatory mandates for commercial and industrial end equipment.

What is the forward voltage of SS13 R3G at elevated temperature?

At 1A and +100°C junction temperature, SS13 R3G exhibits a typical forward voltage of 0.40V, per the Electrical Specifications table. This 20% reduction versus its 25°C value (0.50V) improves efficiency stability across operating temperature ranges, a key advantage over silicon diodes whose VF increases with temperature.

Is SS13 R3G suitable for high-frequency switching applications?

Yes, SS13 R3G supports high-frequency operation due to its Schottky architecture with negligible reverse recovery time and 10,000 V/µs critical dV/dt rating. These characteristics prevent false triggering in QR flyback or active clamp forward converters operating above 100 kHz, confirming SS13 R3G's suitability for modern high-density SMPS designs.

What packaging format is used for SS13 R3G?

SS13 R3G is supplied in 7,500-piece tape-and-reel packaging per the Ordering Information table, compatible with standard 8mm-width SMT feeders. The DO-214AC (SMA) case uses matte tin-plated leads and meets JESD201 Class 2 whisker resistance, ensuring reliable pick-and-place yield and solder joint integrity in high-volume manufacturing.

SS13 R3G Specifications

Product attributes
Attribute value
Manufacturer:
Taiwan Semiconductor Corporation
Series:
-
Package/Case:
DO-214AC, SMA
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
500 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
200 µA @ 30 V
Capacitance @ Vr, F:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DO-214AC (SMA)
Operating Temperature - Junction:
-55°C ~ 125°C

SS13 R3G FAQ

1.How can I place an order for SS13 R3G through Aetrix?

Please submit a Request for Quotation (RFQ) for SS13 R3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SS13 R3G reliable?

The price and inventory of SS13 R3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SS13 R3G is usually 5 days.

3.What payment methods are accepted for SS13 R3G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SS13 R3G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SS13 R3G?

SS13 R3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SS13 R3G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SS13 R3G?

For technical support, including SS13 R3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SS13 R3G requirements.

6.How does Aetrix verify that SS13 R3G is sourced from the original manufacturer or authorized distributors?

All SS13 R3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SS13 R3G meets industry standards.

7.What is the process for return or replacement of SS13 R3G?

All SS13 R3G units undergo pre-shipment inspection (PSI). If there is an issue with SS13 R3G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SS13 R3G part is unused and in its original packaging.

Return procedure for SS13 R3G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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