Taiwan Semiconductor Corporation SS15 R3G

Overview

SS15 R3G from Taiwan Semiconductor is a 1A, 50V Schottky barrier surface-mount rectifier in DO-214AC (SMA) package, featuring 0.75V forward voltage at 1A/25°C, 40A peak surge current, and junction temperature rating up to +150°C. It serves as a high-efficiency output rectifier in low-voltage DC/DC converters and AC/DC adapters.

For engineers reviewing the SS15 R3G datasheet, SS15 R3G pinout, SS15 R3G application, or SS15 R3G equivalent, key selection criteria include its 50V V_RRM, low VF at elevated temperature, moisture sensitivity level 1 compliance, RoHS/halogen-free status, and suitability for automated SMT assembly in power supply front-end and secondary-side rectification.

Technical Context

The SS15 R3G implements a single-die Schottky junction optimized for low conduction loss in continuous forward-biased operation. Its guard ring structure enhances ruggedness against transient overvoltage events, while the matte tin-plated leads ensure reliable solderability per J-STD-002.

Thermal performance is defined by 28°C/W junction-to-lead and 88°C/W junction-to-ambient resistance. The device operates across -55°C to +150°C junction range and supports repetitive 8.3ms half-sine surge currents up to 40A without degradation.

Key Specifications

Pinout & Package

DO-214AC (SMA) surface-mount package with cathode-indicated band; molded plastic body meets UL 94V-0; weight ≈ 0.060 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB150-E3/54, SS15 R3G offers SMT compatibility and lower profile; versus SS15H, it lacks AEC-Q101 qualification but maintains identical electrical and thermal specs for industrial/commercial use.

Availability

SS15 R3G is available at Aetrix Electronics and suitable for switching mode power supplies, DC/DC converters, and AC/DC adapters requiring stable component supply, consistent parametric performance, and full RoHS/halogen-free compliance.

Supply support for SS15 R3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Company (TSC) is a vertically integrated Taiwanese manufacturer specializing in discrete semiconductors, including rectifiers, TVS diodes, and MOSFETs, with ISO 9001 and IATF 16949 certification.

The SS1x series targets cost-sensitive, high-volume power conversion applications where efficiency, manufacturability, and regulatory compliance are primary design drivers.

FAQ

What is the maximum repetitive peak reverse voltage (V_RRM) for SS15 R3G?

The SS15 R3G has a V_RRM of 50 V, meaning it can block up to 50 volts in reverse bias without breakdown. This rating is confirmed in the Absolute Maximum Ratings table on page 1 of the Taiwan Semiconductor SS12–SS115 datasheet (Rev R2305). Exceeding this voltage risks irreversible avalanche failure. The SS15 R3G is therefore suited for 36V nominal output rails with appropriate safety margin.

Does SS15 R3G have a specified forward voltage at elevated temperature?

Yes, SS15 R3G specifies V_F = 0.65 V max at 1 A and T_J = 100°C. This value is critical for thermal design, as forward drop decreases with rising junction temperature in Schottky devices. At full load and high ambient, the SS15 R3G maintains lower conduction loss than room-temperature measurements suggest, directly improving system efficiency stability. This parameter is documented in the Electrical Specifications table on page 2.

Is SS15 R3G compatible with lead-free reflow soldering processes?

Yes, SS15 R3G uses matte tin-plated leads compliant with J-STD-002 for solderability and is rated for moisture sensitivity level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/60% RH without baking. It supports standard Pb-free reflow profiles (peak 260°C), and its UL 94V-0 molding compound ensures flame resistance during thermal cycling. These attributes are verified in the Mechanical Data and Packaging sections of the datasheet.

What is the junction-to-lead thermal resistance (R_θJL) of SS15 R3G?

The SS15 R3G has a typical R_θJL of 28°C/W, measured from junction to lead under standardized test conditions. This low value enables effective heat transfer from the die to the PCB copper via the leads, allowing designers to rely on board-level copper pours instead of external heatsinks. The parameter appears in the Thermal Performance table on page 2 and supports thermal modeling for continuous 1A operation in confined layouts.

How does the guard ring feature benefit SS15 R3G in real-world circuits?

The guard ring in SS15 R3G improves edge termination robustness, raising the critical rate of rise of off-state voltage (dV/dt) to 10,000 V/µs. This prevents spurious conduction during fast-switching transients-common in QR flyback or active-clamp topologies-without requiring snubbers or voltage derating. The feature is explicitly cited in the FEATURES section and contributes directly to system reliability in noisy power environments.