STMicroelectronics ST33HTPH2X32AHE1
- Part No.:
- ST33HTPH2X32AHE1
- Manufacturer:
- STMicroelectronics
- Category:
- Application Specific Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
ST33HTPH2X32AHE1.pdf
- Description:
- LINEAR IC'S
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ST33HTPH2X32AHE1 from STMicroelectronics is a Flash-memory-based Trusted Platform Module (TPM) 2.0 compliant with TCG Library Specification 2.0 Level 0 Rev 138 (errata 1.12) and PC Client TPM Platform Spec 1.04 rev 37. It features I²C interface up to 400 kHz, operates at 1.8 V or 3.3 V, supports −40 °C to 105 °C extended temperature range, and integrates hardware-enforced SP800-193-compliant fault detection and self-recovery for firmware upgrades. It serves as a root-of-trust security anchor in industrial edge gateways requiring certified cryptographic integrity.
For engineers reviewing the ST33HTPH2X32AHE1 datasheet, ST33HTPH2X32AHE1 pinout, ST33HTPH2X32AHE1 application, or ST33HTPH2X32AHE1 equivalent, key selection criteria include TPM 2.0 certification scope (FIPS 140-2 Level 2, CC EAL4+), I²C timing compliance (min. guard time 20 µs, burst up to 1936 bytes), GPIO mapping to NV storage indices, SHA-2/SHA-3 and ECC NIST P-256/P-384 support, and VFQFPN32 package thermal resistance (θJA = 35.8 °C/W).
Technical Context
The ST33HTPH2X32AHE1 implements a smartcard-class secure MCU architecture with active shield, environmental sensors, and dual random-number generators: FIPS SP800-90A/AIS20-compliant DRBG and SP800-90B/AIS31-compliant TRNG. Its cryptographic engine supports RSA (1024/2048/3072-bit), AES-128/192/256, TDES-192, HMAC-SHA-1/2/3, and ECDSA/ECDH on NIST P-256/P-384 curves - all executed within tamper-resistant boundaries.
I²C communication follows TCG PTP 2.0 r1.04 with five localities, dynamic burst count, data checksum, and interrupt support for "Locality Change" and "Data Available". The device uses dedicated registers (e.g., TPM_ACCESS at 0x04, TPM_DATA_FIFO at 0x24) mapped to the FIFO-based TPM 2.0 interface, with slave address reconfigurable from 0x08 to 0x77 and no clock stretching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| TPM Standard | TCG TPM Library Spec 2.0 Level 0 Rev 138 (errata 1.12); PC Client TPM Platform Spec 1.04 rev 37 - ensures interoperability with Windows IoT Core and Linux TCG drivers. |
| I²C Interface | Up to 400 kHz; supports 7-bit addressing (0x08–0x77), 20 µs min. guard time, and burst transfers up to 1936 bytes - enables high-throughput command/response exchange without bus contention. |
| Operating Voltage | 1.8 V ±10% or 3.3 V ±10%; POR threshold 1.45–1.61 V - allows direct integration with low-voltage SoCs or legacy 3.3 V industrial controllers. |
| Temperature Range | −40 °C to +105 °C (3.3 V only); −25 °C to +85 °C (1.8 V or 3.3 V) - validated for under-hood automotive gateways and factory-floor edge servers. |
| Cryptographic Support | RSA 1024/2048/3072, ECC NIST P-256/P-384, SHA-1/256/384/3, AES-128/192/256, HMAC, TDES - provides algorithm agility for PKI bootstrapping and firmware attestation. |
| Security Certifications | FIPS 140-2 Level 2 (physical security level 3), Common Criteria EAL4+ (AVA_VAN.5, ALC_FLR.1), TCG-certified - meets regulatory requirements for government and critical infrastructure deployments. |
| Power Consumption | 17.5 mA typical run current; 4 mA idle; 60 µA standby - enables always-on security in battery-backed industrial controllers. |
Pinout & Package
VFQFPN32 package: 32-pin, 5 × 5 mm, 0.5 mm pitch, 0.9 mm max height, ECOPACK2-compliant. Central thermal pad (Pin 33) is unconnected but recommended for PCB thermal relief.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VPS | Power supply input | Accepts 1.8 V or 3.3 V DC; requires mandatory 100 nF + 10 µF decoupling per layout guidelines - ensures stable core voltage during cryptographic operations. |
| GND | Ground reference | Must connect to main system ground plane; forms return path for all digital and analog circuits - critical for EMI control and sensor accuracy. |
| SCL | I²C clock input | Open-drain, no internal pull-up; supports 10–400 kHz; tLOW ≥1.3 µs - defines timing window for command synchronization and interrupt latency. |
| SDA | I²C bidirectional data | Open-drain, no internal pull-up; supports dynamic burst reads/writes up to 1936 bytes - enables efficient bulk PCR extension and sealed storage access. |
| IRQ | Interrupt output | Active-low, open-drain; signals "Data Available" or "Locality Change" - eliminates polling overhead and reduces host CPU wake cycles. |
| RESET | Hardware reset input | Active-low, min. pulse width 1 ms; triggers warm reset with tINIT ≤25 ms - guarantees deterministic state recovery after power glitches. |
| GPIO_PP | Physical Presence input | Active-high, internal pull-down; used to assert hardware-level admin consent for sensitive commands (e.g., Clear) - enforces human-in-the-loop policy enforcement. |
| GPIO_LP | Low-power mode control | Input; activates Deep Sleep mode (60 µA ICC) when asserted - extends uptime in battery-powered remote monitoring nodes. |
Key Features
| Feature | Design Value |
|---|---|
| Fault-tolerant firmware loader | Self-recovery mechanism maintains full TPM functionality if upgrade is interrupted - eliminates field failures due to power loss during field updates. |
| SP800-193 compliance | Hardware-enforced protection, detection, and recovery against firmware corruption - satisfies NIST requirements for resilient boot-chain components. |
| 4 configurable GPIOs | Each mapped to NV storage indices; enables platform-specific state signaling (e.g., tamper latch, secure boot status) without host software intervention. |
| Triple endorsement keys | Pre-provisioned RSA2048, ECC P-256, and ECC P-384 EKs with certificates - accelerates OEM provisioning and eliminates key-generation delays in mass production. |
| Environmental monitoring | Active shield + power/voltage/temperature sensors detect fault injection attempts - triggers zeroization of sensitive keys upon anomaly detection. |
Applications
| Industrial Edge Gateway | Automotive Telematics Control Unit |
|---|---|
|
Use Scenario: Secure OTA firmware update and hardware-rooted device identity in DIN-rail-mounted edge gateways deployed in manufacturing plants. IC Role / Device Role / Timing Role: Root-of-trust anchor performing SHA-384 hash verification of signed firmware images and sealing decryption keys to PCR values tied to boot firmware. Use Value: Prevents unauthorized firmware execution via measured boot; leverages 3.3 V operation and −40 °C to 105 °C rating for uncontrolled cabinet environments. |
Use Scenario: Secure vehicle-to-cloud authentication and encrypted CAN message signing in telematics units operating across global temperature zones. IC Role / Device Role / Timing Role: TPM 2.0 endpoint generating ECDSA signatures on vehicle telemetry using pre-provisioned ECC P-384 keys and validating cloud-signed commands. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements; GPIO_PP enables physical presence confirmation before key deletion. |
| Medical Imaging Workstation | Smart Grid Substation Controller |
|
Use Scenario: HIPAA-compliant audit logging and encrypted DICOM image storage in FDA-cleared diagnostic imaging systems. IC Role / Device Role / Timing Role: Cryptographic co-processor storing sealed encryption keys for AES-256-encrypted patient data and generating HMAC-SHA3 integrity tags. Use Value: Achieves FIPS 140-2 Level 2 validation required for healthcare data handling; 1.8 V option enables low-noise integration near ADC subsystems. |
Use Scenario: IEC 62351-8-compliant secure remote configuration and firmware integrity verification in utility substation RTUs. IC Role / Device Role / Timing Role: Hardware-enforced trust anchor verifying digital signatures on IEC 61850 GOOSE messages and protecting private keys used for TLS client authentication. Use Value: Supports CC EAL4+ certification needed for grid cyber-physical systems; IRQ pin enables real-time alerting on security policy violations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TPM 2.0 security module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon SLB9670 | Supports SPI and LPC interfaces only; no I²C; uses different GPIO mapping scheme and lacks GPIO_LP for low-power mode activation. | Requires redesign of host interface driver and power management logic; not drop-in for I²C-based platforms. | Select when SPI/LPC is preferred and extended temperature operation is not required (rated −40 °C to +85 °C only). |
| NXP A71CH | Secure element (not full TPM 2.0 stack); supports only limited subset of TPM commands (no PCR, no NV storage); lacks SP800-193 compliance. | Suitable for lightweight authentication only; cannot replace ST33HTPH2X32AHE1 in measured boot or sealed storage use cases. | Select only for cost-sensitive consumer devices where full TPM 2.0 feature set is unnecessary. |
Compared with SLB9670 and A71CH, the ST33HTPH2X32AHE1 uniquely delivers full TPM 2.0 compliance with I²C, SP800-193 resilience, and extended temperature support - making it the only choice for industrial and automotive platforms requiring certified, self-healing, and thermally robust root-of-trust.
Availability
ST33HTPH2X32AHE1 is available at Aetrix Electronics and suitable for industrial edge gateways, automotive telematics units, medical imaging workstations, and smart grid substation controllers requiring stable component supply across long product lifecycles.
Supply support for ST33HTPH2X32AHE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management, and secure elements for industrial, automotive, and consumer markets.
The STSAFE-TPM product line delivers certified, turnkey TPM 2.0 solutions targeting embedded platforms needing hardware-rooted security, cryptographic agility, and seamless integration with Windows IoT Core and Linux TCG stacks.
FAQ
What certifications does the ST33HTPH2X32AHE1 hold?
The ST33HTPH2X32AHE1 holds FIPS 140-2 Level 2 (physical security level 3), Common Criteria EAL4+ with AVA_VAN.5 and ALC_FLR.1 augmentations, and TCG certification. It is also compliant with Microsoft Windows IoT Core and Linux TCG drivers, and meets SP800-193 requirements for firmware protection, detection, and recovery.
Does the device support both 1.8 V and 3.3 V operation simultaneously?
No - the ST33HTPH2X32AHE1 operates exclusively at either 1.8 V ±10% or 3.3 V ±10%, selected at power-on. The 3.3 V supply enables operation from −40 °C to +105 °C; the 1.8 V supply supports −25 °C to +85 °C. Mixed-voltage operation is not supported, and VPS must remain stable within its selected range during all functional states.
How many GPIOs can be configured for NV storage index mapping?
Four GPIOs (GPIO_C, GPIO_D, GPIO_PP, GPIO_LP) can be individually mapped to NV storage indices via firmware configuration. Each GPIO's function is programmable - for example, GPIO_PP defaults to Physical Presence input but may be reassigned to signal tamper event status or secure boot completion.
What is the maximum I²C burst size supported by the ST33HTPH2X32AHE1?
The ST33HTPH2X32AHE1 supports a maximum I²C burst size of 1936 bytes via the TPM_DATA_FIFO register (0x24). This enables efficient transfer of large PCR quotes, sealed blobs, or certificate chains without repeated start/stop conditions - reducing host-side I²C transaction overhead and improving throughput in high-frequency attestation workflows.
ST33HTPH2X32AHE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- ST33
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Applications:
- Trusted Platform Module (TPM)
- Core Processor:
- SecurCore® SC300™
- Program Memory Type:
- FLASH
- Controller Series:
- ST33TPHF2ESPI
- RAM Size:
- -
- Interface:
- I2C
- Number of I/O:
- 4
- Voltage - Supply:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VFQFPN (5x5)
ST33HTPH2X32AHE1 FAQ
1.How can I place an order for ST33HTPH2X32AHE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for ST33HTPH2X32AHE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ST33HTPH2X32AHE1 reliable?
The price and inventory of ST33HTPH2X32AHE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST33HTPH2X32AHE1 is usually 5 days.
3.What payment methods are accepted for ST33HTPH2X32AHE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST33HTPH2X32AHE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ST33HTPH2X32AHE1?
ST33HTPH2X32AHE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ST33HTPH2X32AHE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ST33HTPH2X32AHE1?
For technical support, including ST33HTPH2X32AHE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST33HTPH2X32AHE1 requirements.
6.How does Aetrix verify that ST33HTPH2X32AHE1 is sourced from the original manufacturer or authorized distributors?
All ST33HTPH2X32AHE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST33HTPH2X32AHE1 meets industry standards.
7.What is the process for return or replacement of ST33HTPH2X32AHE1?
All ST33HTPH2X32AHE1 units undergo pre-shipment inspection (PSI). If there is an issue with ST33HTPH2X32AHE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ST33HTPH2X32AHE1 part is unused and in its original packaging.
Return procedure for ST33HTPH2X32AHE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ST33HTPH2X32AHE1 Tags

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CYPD3175-24LQXQ
Infineon Technologies

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SLB9672VU20FW1523XTMA1
Infineon Technologies

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SLB9670VQ20FW785XTMA1
Infineon Technologies

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SLB9672XU20FW1523XTMA1
Infineon Technologies

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SLB9673XU20FW2613XTMA1
Infineon Technologies

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CYPD3125-40LQXIT
Infineon Technologies

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AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

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SLB9672AU20FW1613XTMA1
Infineon Technologies

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SLB9673AU20FW2613XTMA1
Infineon Technologies
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