STMicroelectronics ST33KTPM2X32DKG9

Overview

ST33KTPM2X32DKG9 from STMicroelectronics is a certified Trusted Platform Module (TPM) 2.0 security IC compliant with TCG Library 2.0 rev 1.59 errata 1.5 and PC Client PTP v1.06, featuring flash-based firmware, dual SPI/I²C interfaces (up to 66 MHz / 1 Mb/s), −40 °C to 105 °C operation, and FIPS 140-3 Level 3 physical security. It serves as a hardware root of trust in PC, server, and industrial edge platforms for secure boot, key attestation, and platform integrity verification.

For engineers reviewing the ST33KTPM2X32DKG9 datasheet, ST33KTPM2X32DKG9 pinout, ST33KTPM2X32DKG9 application, or ST33KTPM2X32DKG9 equivalent, this page delivers verified interface configurations, certified cryptographic capabilities (RSA up to 4096-bit, ECC NIST P-521, SHA-3, AES-256, SP800-90B TRNG), fault-tolerant firmware update with LMS PQC signature, and EAL4+ Common Criteria certification details - all essential for secure system integration and compliance validation.

Technical Context

The ST33KTPM2X32DKG9 implements a hardened ARM SecurCore SC300 CPU with active shield, environmental monitoring, and countermeasures against fault injection and side-channel attacks. Its firmware version 0x00.09.01.01 (9.257) supports configurable background RSA key generation, SHA-512, hibernate state, and PQC-secured updates using LMS (SP800-208) alongside ECC NIST P-384.

It integrates NIST SP800-90A/B-compliant DRBG and TRNG, AIS20/AIS31-certified entropy sources, and cryptographic accelerators for RSA, ECC, AES, HMAC, and SHA-1/2/3. The device ships with four pre-provisioned endorsement keys (RSA2048/3072, ECC P-256/P-384) and three factory-loaded 2048-bit RSA key pairs to accelerate provisioning.

Key Specifications

Pinout & Package

UFQFPN32 package: 5 × 5 × 0.55 mm, 32-pin ultra-thin fine-pitch quad flat no-lead with exposed thermal pad (pin 33, unconnected to die but recommended soldered to PCB ground).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar TPM 2.0 security module applications.

Compared with SLB9670 and ATTPM20, the ST33KTPM2X32DKG9 uniquely combines dual SPI/I²C flexibility, FIPS 140-3 Level 3 physical security, −40 °C to 105 °C operation, and LMS-based PQC firmware updates - making it the only option qualified for next-generation server, industrial edge, and high-assurance PC platforms requiring quantum-resilient trust anchors.

Availability

ST33KTPM2X32DKG9 is available at Aetrix Electronics and suitable for server platform integrity, industrial edge device authentication, and PC client secure boot requiring stable component supply, long-term lifecycle assurance, and certified cryptographic functionality.

Supply support for ST33KTPM2X32DKG9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and secure elements for industrial, automotive, and computing markets.

The STSAFE-TPM product line delivers standardized, certified Trusted Platform Modules targeting Common Criteria EAL4+, FIPS 140-3 Level 3, and TCG compliance - engineered specifically for hardware-rooted trust in PCs, servers, industrial controllers, and edge AI devices.

FAQ

What firmware version is shipped on ST33KTPM2X32DKG9?

This part ships with factory firmware version 0x00.09.01.01 (9.257), which supports SHA-512, hibernate power state, configurable background RSA key generation (including RSA 4096), and PQC firmware updates requiring both LMS (SP800-208) and ECC NIST P-384 signatures. It does not include the SHA-512 or PQC enhancements introduced in later firmware 9.512.

Does ST33KTPM2X32DKG9 support both SPI and I²C simultaneously?

No - the interface is selected at boot time via the GPI_I2C_Select pin (Pin 6). Pulling it low activates I²C mode; leaving it unconnected (default internal weak pull-up) selects SPI mode. Both protocols are supported on the same silicon, but only one can operate at a time, as confirmed in the DB5174 data brief Section 3.

What certifications apply specifically to ST33KTPM2X32DKG9 with firmware 9.257?

This variant is certified to Common Criteria EAL4+ (TPM 2.0 PP augmented with AVA_VAN.5), TCG TPM 2.0 certification, and Microsoft Windows 10/11 and Linux driver compliance. While FIPS 140-3 Level 3 certification applies to the ST33KTPM2X family, ST confirms that firmware 9.257 is included in the validated configuration for that certification per official ST documentation.

How is the exposed thermal pad (Pin 33) handled in the UFQFPN32 package?

Pin 33 is an unconnected exposed pad on the underside of the UFQFPN32 package. Though not electrically connected to the die, ST recommends soldering it to PCB ground to improve thermal dissipation (θJB = 20 °C/W) and reduce EMI. Mechanical data in DB5174 Section 5.1 confirms it has no electrical function but contributes to thermal performance when grounded.