STMicroelectronics STA501013TR

Overview

STA501013TR from STMicroelectronics is a monolithic dual half-bridge audio power stage in MultiPower BCD technology, designed as the output stage for mono All-Digital High Efficiency (DDX™) amplifiers. It delivers 50W into 8Ω at THD = 10% with V_CC = 30V, features 200 mΩ R_ds(on) complementary DMOS outputs, CMOS-compatible logic inputs, and integrated thermal warning (TH_WAR) and fault reporting.

For engineers reviewing the STA501013TR datasheet, STA501013TR pinout, STA501013TR application, or STA501013TR equivalent, key selection criteria include its dual half-bridge topology, 3.5A continuous output current capability, thermal shutdown at 150°C, under-voltage lockout at 7V, and compatibility with DDX™ digital amplifier architectures requiring precise dead-time control and rail-synchronized logic thresholds.

Technical Context

The STA501013TR implements two independent half-bridge channels (OUTA/OUTB), each driven by matched P/N-channel DMOS transistors with 95% R_ds(on) matching. Logic inputs (INA/INB) reference IBIAS voltage to set dynamic high/low thresholds (e.g., VH = Ibias/2 + 300mV), enabling robust operation across supply variations.

It integrates protection circuitry including thermal warning at 130°C (open-drain TH_WAR), fault indication (open-drain FAULT), under-voltage lockout (7V), and thermal shutdown at 150°C with 25°C hysteresis. The device operates from 10–36V V_CC, supports tri-state (Hi-Z) and standby (PWRDN) modes, and achieves <50 ns dynamic dead time in bridge configurations with 22µH inductors and 470nF capacitors.

Key Specifications

Pinout & Package

STA501013TR uses PowerSO-36 package (slug-up, exposed thermal pad), with 36 leads arranged in dual-row configuration optimized for high-current audio output stage PCB layout and thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual half-bridge audio output stage applications.

Compared with TAS5102DAP and IRS2092SPBF, STA501013TR uniquely integrates matched DMOS half-bridges, Ibias-referenced logic, and dual thermal alerts (warning + shutdown) in a single PowerSO-36 package-enabling compact, self-protected DDX™ amplifier output stages without external sensing or discrete FETs.

Availability

STA501013TR is available at Aetrix Electronics and suitable for home audio amplifiers, automotive infotainment systems, and industrial audio signage requiring stable component supply and long-lifecycle support.

Supply support for STA501013TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, MEMS, and microcontrollers for industrial, automotive, and consumer markets.

The STA501013TR belongs to ST's DDX™-optimized audio power stage product line, engineered specifically to serve as the high-efficiency, protected output stage for all-digital Class-D amplifier architectures.

FAQ

What is the function of the IBIAS pin on STA501013TR?

The IBIAS pin sets the reference voltage for all logic input thresholds (VH and VL). With Ibias = 3.3V, VH = 1.7V and VL = 0.8V, ensuring noise margin and consistent switching behavior across temperature and supply variation. It also stabilizes internal 5V regulators (VDD/VSS) and must be decoupled with ≥100nF capacitor to GND-Clean.

Can STA501013TR be used in single-ended (non-bridge) configurations?

No - STA501013TR is strictly a dual half-bridge device with complementary P/N outputs per channel; it lacks independent high-side or low-side driver enablement. Its truth table and protection logic assume bridge-mode operation (e.g., dump, positive, negative states). Single-ended use would violate functional safety and thermal design assumptions.

How does the TH_WAR pin differ from the FAULT pin in thermal response?

TH_WAR asserts low at 130°C junction temperature to warn of thermal stress before shutdown; FAULT asserts low at 150°C (thermal shutdown) or during overcurrent/UVLO events. TH_WAR enables proactive system derating (e.g., reducing PWM duty), while FAULT requires full reset or PWRDN cycle to clear after fault removal.

What is the recommended PCB layout practice for the PowerSO-36 thermal pad?

The exposed thermal pad (slug-up) must be soldered to a large copper pour connected to multiple internal GND planes via ≥6 thermal vias (0.3mm diameter, spaced ≤1.2mm apart). This achieves the specified 2.5°C/W junction-to-case thermal resistance and prevents localized hot spots during 3.5A continuous operation.