STMicroelectronics STA515W13TR

Overview

STA515W13TR from STMicroelectronics is a monolithic quad half-bridge power stage in Multipower BCD technology, designed as the output stage for stereo all-digital high-efficiency amplifiers. It delivers 10 W × 4 channels into 4 Ω (10% THD, V_CC = 18 V, single-ended), or 20 W + 20 W into 8 Ω (BTL), or 40 W into 8 Ω (parallel-BTL, V_CC = 26 V). Key confirmed parameters: 40 V max supply, 3 A continuous output current, 200 mΩ R_dsON, thermal warning at 130 °C, and undervoltage lockout at 7 V.

For engineers reviewing the STA515W13TR datasheet, STA515W13TR pinout, STA515W13TR application, or STA515W13TR equivalent, this page provides verified electrical specifications, PowerSSO36 EPD package mapping, dual/quad bridge configuration logic, thermal protection behavior, and real-world audio amplifier use cases with DDX and binary PWM modes.

Technical Context

The STA515W13TR implements four independent half-bridge stages with complementary DMOS outputs, configurable via CONFIG pin to operate as two full H-bridges or one high-current parallel bridge. Its logic interface accepts CMOS-compatible inputs referenced to VL (2.7–5.0 V), with input thresholds scaling proportionally to VL voltage.

Protection architecture includes open-drain FAULT (short-circuit/thermal fault) and THWARN (130 °C thermal warning) outputs, undervoltage lockout (7 V), and automatic recovery mode when FAULT and TRISTATE pins are tied through an RC network. Dead time is dynamically adjusted: ≤50 ns under high-current switching (L = 22 μH, C = 470 nF, I_DD = 3.0 A).

Key Specifications

Pinout & Package

The STA515W13TR is housed in a 36-pin PowerSSO package with exposed pad down (EPD), optimized for thermal dissipation in audio power applications. The exposed thermal pad must be soldered to PCB copper for effective heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad half-bridge amplifier applications.

Compared with TAS5381AIPAG and IRS2092SPBF, the STA515W13TR uniquely integrates thermal warning, CONFIG-driven topology reconfiguration, and auto-recovery fault handling-reducing system-level BOM count and firmware overhead in cost-sensitive consumer audio designs.

Availability

STA515W13TR is available at Aetrix Electronics and suitable for home audio amplifiers, automotive infotainment systems, and active subwoofer modules requiring stable component supply across industrial temperature range (0 to 70 °C) and long-lifecycle support.

Supply support for STA515W13TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.

The STA515W13TR belongs to ST's STA5xx family of digital audio power amplifiers, engineered specifically for high-efficiency, low-EMI Class-D audio output stages in space-constrained consumer and professional audio equipment.

FAQ

What is the function of the CONFIG pin, and how does it affect output configuration?

The CONFIG pin selects between dual full-bridge and parallel-BTL operation: logic-low (0 V) configures two independent H-bridges (20 W × 2 @ 8 Ω); logic-high (tied to VDD) enables parallel connection of OUT1A/OUT2A and OUT1B/OUT2B for 40 W into 8 Ω. This reconfiguration requires synchronized IN1A/IN2A and IN1B/IN2B inputs and matching output LC filters.

How does the thermal warning (THWARN) differ from thermal shutdown, and what design actions does it enable?

THWARN asserts low at 130 °C-20 °C before thermal shutdown (150 °C)-providing early warning to reduce PWM duty cycle or mute audio. Its open-drain output requires a 10 kΩ pull-up to VDD. Unlike FAULT, THWARN does not disable outputs; it enables proactive thermal management in DSP-controlled systems without interrupting playback.

Can the STA515W13TR drive 4 Ω loads in BTL mode, and what are the voltage and current limits?

Yes: in BTL configuration, it delivers 20 W + 20 W into 8 Ω at V_CC = 18 V (10% THD), and up to 40 W into 4 Ω at V_CC = 19 V (per Figure 8). Absolute maximum V_CC is 40 V, and continuous output current is rated at 3 A per half-bridge; peak current capability exceeds 4.5 A under short-duration conditions with proper thermal design.

What are the critical PCB layout requirements for the PowerSSO36 EPD package?

The exposed thermal pad (EPD) must be fully soldered to a large internal or bottom-layer copper pour connected to GNDSUB (Pin 1) with ≥6 thermal vias (0.3 mm diameter, 0.6 mm pitch). Power traces (VCCx, OUTx) require ≥0.5 mm width and separate ground returns; INx and VL traces must be routed away from noisy power paths to avoid logic threshold instability.