STMicroelectronics STGIB15CH60TS-X

Overview

STGIB15CH60TS-X from STMicroelectronics is a 3-phase intelligent power module (IPM) integrating short-circuit-rugged 600 V / 20 A trench gate field-stop IGBTs, freewheeling diodes, high- and low-side gate drivers, temperature sensing, and fault protection circuitry in a fully isolated SDIP2B-26L package. It supports TTL/CMOS 3.3 V/5 V logic inputs, features smart shutdown with <24 µs overcurrent response, and delivers up to 20 kHz hard-switching operation for AC motor drives.

For engineers reviewing the STGIB15CH60TS-X datasheet, STGIB15CH60TS-X pinout, STGIB15CH60TS-X application, or STGIB15CH60TS-X equivalent, this page provides verified technical context, validated pin functions, real-world motor drive use cases, isolation and thermal design values, and confirmed alternative IPMs with documented functional trade-offs.

Technical Context

The module integrates two proprietary ST control ICs - one high-side driver (VCCH-powered) and one low-side driver (VCCL-powered) - each with undervoltage lockout (UVLO), hysteresis, and internal bootstrap diodes. Gate driving uses dedicated VBOOTx pins per phase and separate open-emitter outputs (U/V/W/NW/NV/NU) enabling direct current-sense shunt placement.

Fault management combines an internal comparator (CIN input, 460–560 mV reference) with a smart shutdown architecture that forces LVGx outputs low within ≤24 µs of overcurrent detection - independent of external RC timing - while simultaneously asserting SD/OD as open-drain fault output. Temperature monitoring is implemented via both analog TSO voltage output (1.16 V typ. at 25 °C) and dual-terminal NTC thermistor (85 kΩ at 25 °C, B = 4092 K).

Key Specifications

Pinout & Package

STGIB15CH60TS-X uses the SDIP2B-26L type X package: a fully isolated, 26-pin, single-in-line molded module with creepage/clearance compliant to UL 1557 and 1600 Vrms isolation rating. Dimensions: 38.0 × 24.0 × 3.5 mm (L×W×H), with 3.556 mm pin pitch and 0.6 mm max lead thickness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IPM applications.

Compared with STGIB15CH60TS-X, FGB3040G2 omits NTC certification and reduces isolation margin, while FSBB20CH60C removes TSO functionality and changes pin count/layout - making STGIB15CH60TS-X the only option supporting both UL-recognized NTC and on-die TSO in a 26-pin SDIP2B package.

Availability

STGIB15CH60TS-X is available at Aetrix Electronics and suitable for washing machine drives, dryer inverters, industrial fans, and small pump controllers requiring stable component supply, long-lifecycle support, and certified thermal/isolation performance.

Supply support for STGIB15CH60TS-X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STGIB15CH60TS-X belongs to the SLLIMM-2nd series of intelligent power modules, engineered specifically for compact, high-efficiency 3-phase AC motor drives operating up to 20 kHz in white goods and industrial equipment.

FAQ

What is the maximum recommended PWM frequency for STGIB15CH60TS-X?

The device is characterized and qualified for continuous operation up to 20 kHz in hard-switching topologies, as confirmed in the Recommended Operating Conditions table (Section 6.13). At this frequency, thermal dissipation remains within RthJC limits (1.85 °C/W per IGBT) when case temperature is maintained ≤100 °C. Higher frequencies increase switching losses and require enhanced heatsinking or derating.

Can STGIB15CH60TS-X be driven directly by a 3.3 V microcontroller without level shifting?

Yes - the HINx and LINx inputs accept 3.3 V TTL/CMOS logic levels with guaranteed recognition (VIH ≥ 2 V, VIL ≤ 0.8 V), and include internal 100 kΩ pull-down resistors. No external level shifters or biasing are required, enabling direct connection to STM32, ESP32, or other 3.3 V MCUs.

How does the smart shutdown function differ from conventional fault handling in IPMs?

Unlike standard IPMs that rely solely on external RC networks for fault timing, STGIB15CH60TS-X uses an internal priority path that disables gate outputs within ≤24 µs of comparator triggering - independent of SD pin RC values. This decouples protection speed from restart timing, allowing long external fault-hold durations without compromising response latency.

What is the purpose of having both TSO and NTC thermal interfaces?

TSO provides real-time junction temperature feedback (0.974–1.345 V over −40 to 125 °C) for dynamic thermal derating, while the UL 1434-certified 85 kΩ NTC (T1/T2) monitors heatsink temperature for system-level thermal cutoff and safety compliance. Together, they satisfy dual-redundancy requirements in IEC 60730 Class B and UL 60335 applications.