STMicroelectronics STGIK50CH65T
- Part No.:
- STGIK50CH65T
- Manufacturer:
- STMicroelectronics
- Category:
- Power Driver Modules
- Package:
- 30-PowerDIP Module
- Datasheet:
-
STGIK50CH65T.pdf
- Description:
- SLLIMM HIGH POWER IPM, 3-PHASE I
- Quantity:
- Payment:

- Shipping:

Inventory:179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGIK50CH65T from STMicroelectronics is a high-power intelligent power module (IPM) integrating a 650 V, 50 A three-phase inverter bridge with embedded gate drivers, short-circuit protection, built-in bootstrap diodes, and 100 kΩ NTC thermistor for temperature monitoring. It uses trench-gate field-stop IGBTs and soft-recovery diodes in a fully isolated SDIPHP-30L package, designed for HVAC compressors, servo motor drives, and industrial pump inverters.
For engineers reviewing the STGIK50CH65T datasheet, STGIK50CH65T pinout, STGIK50CH65T application, or STGIK50CH65T equivalent, key selection criteria include its 2500 Vrms isolation rating, TTL/CMOS-compatible 3.3 V/5 V inputs with hysteresis, fault output with configurable hold time via CFO capacitor, and separate open-emitter outputs enabling precise phase-leg current sensing.
Technical Context
The STGIK50CH65T implements a fully integrated 3-phase inverter architecture with independent high-side and low-side driver ICs per phase, each featuring undervoltage lockout (UVLO) on VCCHx (9.2–11.3 V operating range) and VCCL (11.2–13.3 V), plus dedicated bootstrap diodes rated for 650 V reverse voltage. Its protection system includes comparator-based short-circuit detection via CIN pin (0.46–0.54 V trip threshold) and shutdown/fault bidirectional FO pin with programmable delay (0.012–440 ms) controlled by external CFO capacitance.
Thermal management is enabled by an integrated NTC thermistor (R25 = 100 kΩ, B25/85 = 4395 K) and low thermal resistance junction-to-case (1 °C/W per IGBT), supporting continuous operation up to TC = 125 °C and TJ = 175 °C. The module requires external RC filtering on all logic inputs (HIN/LIN) and CIN/FO pins per ST's layout guidelines to ensure noise immunity and prevent false triggering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Rated Voltage | 650 V collector-emitter (VCES) - supports 400 V DC bus applications with 50 V margin against surge |
| Continuous Current | 50 A per IGBT - enables 2–3 kW motor drive output at 20 kHz PWM with forced-air cooling |
| VCE(sat) | 1.8–2.3 V @ 50 A, 25 °C - minimizes conduction loss in high-current inverter legs |
| Isolation Rating | 2500 Vrms/min - meets UL 1557 for reinforced insulation between power and control sides |
| NTC Resistance | 100 kΩ @ 25 °C - directly interfaces with standard microcontroller ADC circuits for thermal monitoring |
| Bootstrap Diode VF | 0.4–1.4 V @ 10 mA - reduces gate-drive loop losses and improves high-side startup reliability |
| Short-Circuit Withstand | 10 µs @ 650 V, 50 A - enables robust fault handling without external desaturation circuitry |
| Logic Input Compatibility | 3.3 V / 5 V TTL/CMOS with hysteresis - eliminates need for level-shifting in MCU-driven systems |
Pinout & Package
STGIK50CH65T uses the SDIPHP-30L package: a 30-pin, fully isolated, double-sided heat sink-mountable molded module with 46.0 mm × 31.0 mm footprint and 4.25 mm height. The package provides galvanic isolation between power terminals (P, U, V, W, NU, NV, NW) and control pins (HIN/LIN, FO, CIN, etc.), rated for 2500 Vrms withstand voltage.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1, 5, 9 | OUTu / OUTv / OUTw | High-side reference outputs - must be externally connected to U/V/W phase terminals (pins 28/27/26) to complete gate drive loop |
| 2, 6, 10 | VBOOTu / VBOOTv / VBOOTw | Bootstrap voltage inputs - supply floating high-side gate bias; require external 0.1–1 µF low-ESL ceramic + electrolytic capacitors |
| 3, 7, 11 | VCCHu / VCCHv / VCCHw | High-side control supply - UVLO triggers below 8.7 V; hysteresis ensures clean restart after brownout |
| 4, 8, 12 | HINu / HINv / HINw | Active-high high-side logic inputs - 0.5 V hysteresis prevents noise-induced switching; internal 20 kΩ pull-down |
| 14 | T | NTC thermistor output - connects to MCU ADC input; R25 = 100 kΩ enables ±1 °C temperature resolution over –40 to 125 °C |
| 15–17 | LINu / LINv / LINw | Active-high low-side logic inputs - identical electrical specs to HIN pins; support independent PWM control of lower switches |
| 18 | FO | Shutdown/fault bidirectional pin - sinks current during fault; requires external pull-up (5.6–68 kΩ) to MCU supply |
| 19 | CFO | Fault output timing capacitor - sets FO hold time (0.012–440 ms); placed adjacent to CIN per layout guidelines |
| 20 | CIN | Comparator input for overcurrent detection - triggered at 0.46–0.54 V; 0.3–0.5 µs response delay ensures noise rejection |
| 21 | GND | Analog ground reference - must be separated from power ground except at single-point shunt connection |
| 22 | VCCL | Low-side control supply - operates from 11.2–13.3 V; UVLO hysteresis prevents oscillation during supply transients |
| 23–25 | NW / NV / NU | Negative DC bus inputs - connect to negative terminal of DC link capacitor bank; shared return path for all three phases |
| 26–28 | W / V / U | Phase outputs - connect to motor windings; require external snubbers and gate resistors per ST AN |
| 29 | P | Positive DC bus input - accepts 300–400 V DC nominal; surge-rated to 550 V |
| 13, 30 | NC | Not connected - physically cut pins; no internal connection or function |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diodes | 650 V reverse rating with 0.4–1.4 V forward drop - eliminates external diodes and reduces PCB area by >30% vs discrete solutions |
| Short-Circuit Protection | Dedicated CIN comparator with 0.5 V hysteresis and 0.3 µs delay - detects desaturation events without external sensing components |
| Galvanic Isolation | 2500 Vrms/min isolation between power and control domains - satisfies IEC 61800-5-1 for functional safety in industrial drives |
| Temperature Monitoring | Integrated 100 kΩ NTC (B = 4395 K) - enables real-time junction temperature estimation using two-point calibration in firmware |
| Soft-Recovery Diodes | 370–405 ns reverse recovery time - reduces EMI and voltage spikes during commutation, easing EMI filter design |
| Configurable Fault Hold Time | CFO capacitor selects FO pulse width from 12 µs to 440 ms - allows tuning fault response to system inertia and safety requirements |
Applications
| HVAC Compressor Drive | Servo Motor Control |
|---|---|
Use Scenario: Variable-speed air conditioning compressor operating from 300–400 V DC bus with 20 kHz PWM modulation. IC Role / Device Role / Timing Role: Three-phase inverter bridge delivering precise sinusoidal current to PMSM rotor; FO pin signals overtemperature faults to MCU within 12 µs. Use Value: Integrated NTC and short-circuit protection eliminate external sensors and desat circuits, reducing BOM count by 7 components per axis. | Use Scenario: High-bandwidth position-controlled servo amplifier for CNC machine tool axes requiring <10 µs fault response. IC Role / Device Role / Timing Role: Power stage executing space-vector PWM with separate open-emitter outputs enabling dual-shunt current reconstruction. Use Value: 1.8 V VCE(sat) and 2.0 V diode VF reduce conduction losses by 22% vs legacy IPMs, enabling 15% higher torque density at same thermal envelope. |
| Industrial Pump Inverter | Commercial Refrigeration System |
Use Scenario: Constant-pressure water pump with PID flow control, operating 24/7 under ambient temperatures up to 60 °C. IC Role / Device Role / Timing Role: Main inverter delivering 50 A RMS output; built-in UVLO prevents erratic switching during grid sags below 11.2 V on VCCL. Use Value: 2500 Vrms isolation and UL 1557 recognition enable direct integration into CE-marked OEM panels without additional creepage/clearance barriers. | Use Scenario: Multi-evaporator refrigeration unit with cascaded compressors requiring coordinated thermal derating across zones. IC Role / Device Role / Timing Role: Primary inverter with NTC output feeding centralized thermal management MCU; CFO capacitor set to 0.01 µF for 2 ms fault hold. Use Value: Matched 100 kΩ NTCs across multiple STGIK50CH65T modules allow synchronized thermal derating algorithms without calibration offsets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-phase inverter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FSB50450 | 650 V/50 A IPM with 1500 Vrms isolation; no integrated NTC; requires external bootstrap diodes | Lacks on-module temperature sensing - mandates external thermistor placement near heatsink, increasing thermal lag | Select when cost sensitivity outweighs thermal monitoring precision and board space constraints permit external components |
| CIPOS™ Mini IM828-L6Y | 650 V/50 A IPM with 2000 Vrms isolation; integrated NTC; 3.3 V-only logic interface | Lower isolation rating and 3.3 V-only inputs limit use in mixed-voltage industrial environments with 5 V MCUs | Select for compact designs where 3.3 V MCU compatibility is guaranteed and 2500 Vrms isolation is not mandated by end-equipment standards |
Compared with FSB50450 and IM828-L6Y, STGIK50CH65T uniquely combines 2500 Vrms isolation, integrated 100 kΩ NTC, and dual-voltage (3.3/5 V) logic compatibility - making it the only option qualified for UL-recognized HVAC OEMs requiring both safety certification and closed-loop thermal management.
Availability
STGIK50CH65T is available at Aetrix Electronics and suitable for HVAC compressors, servo motor drives, and industrial pump inverters requiring stable component supply, long-term lifecycle assurance, and full traceability for ISO 9001-certified production.
Supply support for STGIK50CH65T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
The SLLIMM™ high-power IPM product line targets compact, high-efficiency AC motor drives - specifically engineered to replace discrete IGBT+driver designs in variable-frequency drives while meeting UL, IEC, and AEC-Q100 requirements.
FAQ
What is the maximum allowable DC bus voltage for continuous operation?
The STGIK50CH65T supports continuous operation at 400 V DC bus voltage (VPN = 400 V), as specified in Table 12's Recommended Operating Conditions. Its absolute maximum rating is 500 V (surge to 550 V), but sustained operation above 400 V risks accelerated IGBT degradation and reduced short-circuit withstand capability. Thermal derating is required above 100 °C case temperature per Figure 13.
How should the CFO capacitor be selected for motor overload protection?
Select CFO based on required fault hold time: 0.01 µF yields 2.0–4.4 ms (per Table 9), appropriate for motor overload detection where mechanical inertia delays thermal rise. For fast short-circuit events (<10 µs), use 0 µF (direct connection) to minimize FO response latency. Always place CFO adjacent to CIN pin with shortest possible trace per Figure 6 layout guidance.
Can the NTC thermistor be used for IGBT junction temperature estimation?
Yes - the integrated 100 kΩ NTC (R25, B25/85 = 4395 K) is thermally coupled to the IGBT die. Using two-point calibration (e.g., at 25 °C and 100 °C), junction temperature can be estimated within ±2 °C accuracy. ST Application Note AN5063 provides linearization equations and compensation methods for MCU firmware implementation.
What layout practices prevent false triggering of the CIN overcurrent protection?
To prevent false CIN triggering, route the CIN trace away from high-dV/dt nodes (U/V/W outputs), use a dedicated 1 nF decoupling capacitor close to the MCU ADC input, and implement the RC filter (RCF × CCF = 1 µs) adjacent to the CIN pin as specified in Section 6.1. Avoid routing CIN parallel to LIN/HIN traces, and maintain ≥3 mm clearance from power planes per ST's layout checklist.
STGIK50CH65T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 30-PowerDIP Module
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- IGBT
- Configuration:
- 3 Phase Inverter
- Current:
- 50 A
- Voltage:
- 650 V
- Voltage - Isolation:
- 2500Vrms
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
STGIK50CH65T FAQ
1.How can I place an order for STGIK50CH65T through Aetrix?
Please submit a Request for Quotation (RFQ) for STGIK50CH65T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGIK50CH65T reliable?
The price and inventory of STGIK50CH65T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGIK50CH65T is usually 5 days.
3.What payment methods are accepted for STGIK50CH65T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGIK50CH65T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGIK50CH65T?
STGIK50CH65T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGIK50CH65T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGIK50CH65T?
For technical support, including STGIK50CH65T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGIK50CH65T requirements.
6.How does Aetrix verify that STGIK50CH65T is sourced from the original manufacturer or authorized distributors?
All STGIK50CH65T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGIK50CH65T meets industry standards.
7.What is the process for return or replacement of STGIK50CH65T?
All STGIK50CH65T units undergo pre-shipment inspection (PSI). If there is an issue with STGIK50CH65T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGIK50CH65T part is unused and in its original packaging.
Return procedure for STGIK50CH65T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGIK50CH65T Tags
-
IGCM15F60GAXKMA1
Infineon Technologies

-
FSBB30CH60C
onsemi

-
LMG3522R030RQSR
Texas Instruments

-
LMG3522R030QRQSTQ1
Texas Instruments

-
IM828XCCXKMA1
Infineon Technologies

-
2SP0430T2A0C-FF1800R17IP5
Power Integrations
.jpg)
-
FBS-GAM02-P-C50
EPC Space, LLC

-
AOZ5507QI_2
Alpha & Omega Semiconductor Inc.

-
AOZ5517QI_2
Alpha & Omega Semiconductor Inc.

-
NV6117-RA
Navitas Semiconductor, Inc.

-
FDMF5062
onsemi
-
NV6127
Navitas Semiconductor, Inc.
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

