STMicroelectronics STGIPL35K120L1

Overview

STGIPL35K120L1 from STMicroelectronics is a single-phase SLLIMM™ intelligent power module integrating short-circuit rugged 1200 V / 35 A IGBTs, freewheeling diodes, gate drivers, desaturation protection, active Miller clamp, and 4.7 kΩ NTC thermistor - designed for compact AC motor inverters in air conditioners with 2500 Vrms isolation and SDIP-18L package.

For engineers reviewing the STGIPL35K120L1 datasheet, STGIPL35K120L1 pinout, STGIPL35K120L1 application, or STGIPL35K120L1 equivalent, this page delivers verified electrical ratings (V_CE(sat) = 2.8 V typ. @ 30 A), thermal resistance (R_thJC = 0.9 °C/W), fault response timing (t_fault = 500 ns), and functional truth table behavior for embedded inverter design validation.

Technical Context

This IPM implements dual-channel isolated gate driving with active low logic inputs (HIN/LIN), independent +5 V reference outputs (VREF-H/VREF-L), and synchronized desaturation detection using internal blanking (2 µs typical). Each channel includes undervoltage lockout (UVLOH = 11 V, hysteresis = 1 V) and fault status output (open-drain, 1 V low @ 10 mA).

The integrated NTC thermistor (R₂₅ = 4.7 kΩ, B = 3950 K) enables real-time case temperature monitoring across –40 to +125 °C, while the DBC substrate ensures low thermal resistance and robust operation at junction temperatures up to 150 °C under pulsed conditions (t_scw = 5 µs @ V_CE = 600 V).

Key Specifications

Pinout & Package

STGIPL35K120L1 uses the SDIP-18L (Small Dual In-line Package) surface-mount package with integrated DBC substrate, 2500 V_rms isolation, and 18 terminals arranged in two rows for high-voltage separation and thermal dissipation.

Key Features

Applications

Availability

STGIPL35K120L1 is available at Aetrix Electronics and suitable for air conditioner inverters, refrigeration compressor drives, industrial fan controllers, and small EV auxiliary drives requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STGIPL35K120L1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer applications.

STGIPL35K120L1 belongs to the SLLIMM™ (Small Low-Loss Intelligent Molded Module) product line - engineered specifically for compact, high-efficiency AC motor drives in white goods and industrial equipment where integration, reliability, and thermal performance are critical.

FAQ

What is the recommended gate drive voltage for STGIPL35K120L1?

The specified gate drive supply is 15 V applied to VH-H and VH-L pins. Operation outside 12–18 V risks incomplete IGBT turn-on (increasing V_CE(sat)) or overstress on internal driver ICs. The datasheet confirms 15 V yields 2.8 V typical V_CE(sat) at 30 A and ensures robust desaturation detection margin.

How does the NTC thermistor integrate into thermal management?

The 4.7 kΩ NTC (B = 3950 K) connects between pins T1 and T2, providing analog resistance that varies predictably with case temperature (R = 4.7 kΩ·e^{3950(1/T−1/298)}). Designers use this with a microcontroller ADC and lookup table to implement real-time thermal derating or shutdown at 125 °C case temperature.

Can STGIPL35K120L1 be used in three-phase inverters?

No - STGIPL35K120L1 is strictly a single-phase IPM containing one half-bridge (high-side + low-side IGBT/diode pair). Three-phase operation requires three separate STGIPL35K120L1 modules or a dedicated 6-pack IPM such as STGIPS30K60. Layout must isolate DC-link and phase outputs per module.

What is the purpose of dual P/N and PHASE terminals?

Pins 13–14 (N), 17–18 (P), and 15–16 (PHASE) are internally paralleled to halve current per bond wire and reduce parasitic inductance. This lowers voltage overshoot during switching (dV/dt), improves EMI performance, and enhances current sharing in high-frequency PWM applications above 10 kHz.