STMicroelectronics STGIPN3H60

Overview

STGIPN3H60 from STMicroelectronics is a SLLIMM™-nano intelligent power module integrating a 3 A, 600 V, 3-phase IGBT inverter bridge with integrated gate drivers, bootstrap diodes, fault protection comparators, and an uncommitted op-amp - designed for compact AC motor drives in space-constrained appliances. It delivers V_CE(sat) = 2.15 V (typ.) at 1 A, 12.8 °C/W junction-to-case thermal resistance, and 50 V/ns output slew rate for EMI-optimized switching in refrigerator compressors and air-conditioning fans.

For engineers reviewing the STGIPN3H60 datasheet, STGIPN3H60 pinout, STGIPN3H60 application, or STGIPN3H60 equivalent, key selection criteria include its NDIP-26L package layout, dual-function SD/OD pin for shutdown and fault reporting, integrated current-sensing op-amp (±6 mV offset), and interlocking logic with 180 ns dead time - all critical for reliable inverter design in low-power built-in motor systems.

Technical Context

This IPM implements three independent half-bridge gate drivers (U/V/W) using high-voltage ICs (HVICs), each with dedicated bootstrap circuits (VBOOT_U/V/W) and logic inputs (HIN/LIN). The control section includes a comparator referenced to 0.54 V (typ.) for overcurrent detection via external shunt, and an op-amp with 8 MHz GBWP and 3.8 V/µs slew rate for precision current sensing.

Switching behavior is governed by internal interlocking logic that prevents shoot-through, enforced by 180 ns minimum dead time between HIN and LIN transitions. Fault propagation is asymmetric: CIN-triggered shutdown disables U-phase outputs directly, while V/W phases rely on external RC timing through the shared SD/OD pin - requiring careful design per AN4966.

Key Specifications

Pinout & Package

The STGIPN3H60 uses the NDIP-26L type C package: 26-pin, 29.2 mm × 12.5 mm × 4.4 mm body height, with isolated creepage/clearance for 1000 V_rms isolation, and integrated heat slug for direct thermal coupling to heatsink.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase inverter bridge applications.

Compared with FSTB12A60 and FSB50450, STGIPN3H60 uniquely integrates a precision op-amp and comparator in the same NDIP-26L footprint - enabling complete analog current feedback and fast fault response without adding components, making it optimal for space-constrained, safety-critical appliance inverters.

Availability

STGIPN3H60 is available at Aetrix Electronics and suitable for refrigerator compressor drives, air-conditioning fan inverters, dishwasher drain pumps, and HVAC recirculation pumps requiring stable component supply across multi-year production cycles.

Supply support for STGIPN3H60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The SLLIMM™-nano product line delivers compact, thermally optimized intelligent power modules targeting built-in motor applications - prioritizing integration density, EMI performance, and protection autonomy in white-goods and HVAC systems.

FAQ

What is the maximum recommended PWM frequency for STGIPN3H60?

The datasheet specifies 25 kHz as the maximum recommended PWM frequency under −40 °C < T_C < 100 °C conditions. This limit ensures safe junction temperature rise given the 12.8 °C/W thermal resistance and 9.7 W per IGBT power dissipation. Exceeding 25 kHz increases switching losses and may require derating or enhanced heatsinking.

How does the SD/OD pin function in shutdown versus fault reporting modes?

SD/OD operates in two distinct modes: as an active-low logic input (SD) when pulled low to disable all three half-bridges, and as an open-drain output (OD) when pulled high via external resistor to report faults (e.g., overtemperature or overcurrent). The pin cannot perform both simultaneously - fault reporting requires SD to be held high during normal operation.

Can the integrated op-amp be used for voltage sensing instead of current sensing?

Yes - the op-amp is fully uncommitted and supports any differential or single-ended configuration. Its rail-to-rail output (0–14.7 V), ±6 mV offset, and 8 MHz GBWP make it suitable for DC bus voltage monitoring, temperature signal conditioning (with NTC), or auxiliary feedback loops - provided input common-mode range (0–V_CC) is respected.

Is external bootstrap diode required for STGIPN3H60 operation?

No - the STGIPN3H60 integrates internal bootstrap diodes for each phase (U/V/W), eliminating the need for external diodes. This reduces component count and PCB area, and improves reliability by removing a common failure point. External bootstrap capacitors (typically 0.1–0.22 µF ceramic) remain mandatory and must be placed close to VBOOT and OUT pins.