STMicroelectronics STGIPN3H60A

Overview

STGIPN3H60A from STMicroelectronics is an SLLIMM-nano intelligent power module (IPM) integrating a 3 A, 600 V, 3-phase IGBT inverter bridge with gate drivers, bootstrap diodes, freewheeling diodes, and protection circuitry in NDIP-26L package. It delivers low EMI, negative V_CE(sat) temperature coefficient, and built-in interlocking for motor control in space-constrained appliances like dishwashers and refrigerators.

For engineers reviewing the STGIPN3H60A datasheet, STGIPN3H60A pinout, STGIPN3H60A application, or STGIPN3H60A equivalent, key selection considerations include its 3.3/5/15 V CMOS/TTL-compatible logic inputs, 1.5 µs blanking time, integrated undervoltage lockout per channel, and thermal resistance of 12.8 °C/W (junction-to-case per IGBT).

Technical Context

This IPM implements three independent half-bridge gate driver ICs (HVICs) with internal bootstrap diodes and dedicated V_BOOT, V_CC, HIN/LIN inputs per phase - enabling direct MCU interface without optocouplers. Each high-side driver supports up to 618 V bootstrap voltage and features 320 ns dead-time generation with interlocking.

The inverter section integrates six 600 V, 3 A IGBTs with co-packaged freewheeling diodes exhibiting 1.7 V forward voltage at 1 A and 2.15 V typical V_CE(sat) at 15 V drive and 25 °C - optimized for PMSM/BLDC and ACIM drives operating up to 25 kHz PWM frequency.

Key Specifications

Pinout & Package

NDIP-26L is a 26-pin, single-in-line, insulated dual in-line package with integrated heat sink pad. Its thermally enhanced layout places power terminals (P, NU, NV, NW, U, V, W) on one side and logic/control pins (HIN/LIN/V_CC/V_BOOT) on the opposite side to minimize coupling and simplify PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IPM motor drive applications.

Compared with FSB50550 and IRSM836-048, STGIPN3H60A uniquely combines 3 A rating, NDIP-26L compactness, uncommitted op-amp, and 320 ns hardware interlock - making it optimal for cost-sensitive, space-constrained white goods where signal conditioning and shoot-through immunity are critical.

Availability

STGIPN3H60A is available at Aetrix Electronics and suitable for dishwasher motor drives, refrigerator compressor control, and compact fan speed regulation requiring stable component supply across multi-year production cycles.

Supply support for STGIPN3H60A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for automotive, industrial, and consumer markets.

STGIPN3H60A belongs to the SLLIMM-nano IPM product line, engineered specifically for low-power (<500 W) permanent magnet and induction motor drives in home appliances where miniaturization, EMI compliance, and system-level protection integration are mandatory.

FAQ

What is the maximum allowable DC bus voltage for STGIPN3H60A?

The absolute maximum collector-emitter voltage (V_CES) is 600 V per IGBT. Recommended operating voltage is up to 500 V DC applied between P and NU/NV/NW terminals, as specified in Table 11. Exceeding 500 V risks premature failure due to voltage transients even if peak remains below 600 V.

Can STGIPN3H60A operate with 3.3 V logic inputs?

Yes - the HIN and LIN inputs accept 3.3 V, 5 V, or 15 V CMOS/TTL logic levels, with guaranteed recognition of high state above 1.8 V and low state below 1.1 V (Table 10). Internal 500 kΩ pull-down resistors ensure safe default state when inputs are floating.

How is thermal performance validated for this IPM?

Thermal resistance is measured per IGBT: R_thJC = 12.8 °C/W (junction-to-case), verified under standardized JEDEC conditions. The NDIP-26L package uses a copper heat spreader and exposed thermal pad; effective heatsinking requires ≥25 cm² of 2 oz copper on PCB layer beneath the pad.

Does STGIPN3H60A include protection against shoot-through?

Yes - it implements hardware interlocking with fixed 320 ns dead time between complementary HIN and LIN signals (Figure 5), plus independent undervoltage lockout on each V_CC and V_BOOT rail. These functions operate autonomously without MCU intervention.