STMicroelectronics STGIPQ5C60T-HLS

Overview

STGIPQ5C60T-HLS from STMicroelectronics is a 3-phase intelligent power module (IPM) integrating six short-circuit rugged 600 V/5 A trench-gate fieldstop IGBTs with freewheeling diodes, three half-bridge gate drivers, an uncommitted op-amp, and a fault comparator - all in a single N2DIP-26L package. It delivers motor drive functionality for low-power ACIM and BLDC applications with integrated thermal sensing (NTC), ±2 kV HBM ESD protection, and 1800 Vrms isolation.

For engineers reviewing the STGIPQ5C60T-HLS datasheet, STGIPQ5C60T-HLS pinout, STGIPQ5C60T-HLS application, or STGIPQ5C60T-HLS equivalent, key selection criteria include its 5 A/600 V inverter rating, TTL/CMOS-compatible 3.3 V/5 V logic inputs, built-in bootstrap diodes, interlocking dead-time control (180 ns), and integrated current-sensing op-amp with 6 mV offset voltage.

Technical Context

This IPM implements a fully integrated 3-phase inverter stage with independent high-side (HVG) and low-side (LVG) gate drivers per phase, each featuring undervoltage lockout (UVLO) on both VCC (12.0 V turn-on threshold) and Vboot (11.5 V turn-on threshold). The internal op-amp supports closed-loop current sensing with 8–12 MHz GBWP and 2.5–3.8 V/µs slew rate, while the comparator uses a precise 0.54 V internal reference for overcurrent detection.

The module employs interlocking logic to prevent shoot-through, enforcing 180 ns minimum dead time between complementary HIN/LIN transitions. Its NTC thermistor interface shares the T/SD/OD pin with shutdown input and open-drain fault output, enabling temperature monitoring and active fault signaling using a single external pull-up resistor (1–2.2 kΩ) and ≤3.3 nF capacitor.

Key Specifications

Pinout & Package

The STGIPQ5C60T-HLS is housed in an N2DIP-26L type L no stand-off package with exposed thermal pads internally connected to GND (pins 1, 26) and P (positive DC input, dummy pins). The 26-pin layout supports direct screw-mount heatsink attachment and optimized thermal path from IGBT die to case.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IPM motor drive applications.

Compared with STGIPQ5C60T-HZS, the HLS variant offers identical performance with tube packaging for flexibility; versus FSGM30SH60DF, it trades higher current rating for integrated analog functions that reduce system-level component count and improve thermal safety in sub-10 A appliances.

Availability

STGIPQ5C60T-HLS is available at Aetrix Electronics and suitable for refrigerator compressor drives, kitchen hood fan control, and dishwasher drain pump applications requiring stable component supply, long-term lifecycle assurance, and UL 1557-certified isolation.

Supply support for STGIPQ5C60T-HLS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

This device belongs to the SLLIMM™ nano 2nd series intelligent power modules, engineered specifically for compact, high-efficiency AC and BLDC motor drives in white goods and HVAC equipment where thermal density and board space are critical constraints.

FAQ

What is the maximum recommended PWM frequency for STGIPQ5C60T-HLS?

The datasheet specifies 25 kHz as the recommended maximum PWM frequency under T_C ≤ 100 °C conditions. This limit balances switching losses (E_on/E_off ≈ 200 µJ total per cycle) against thermal rise in the 9.2 °C/W IGBT junction-to-case path. Operation above 25 kHz requires derating based on measured case temperature and heatsink performance.

How is the NTC thermistor connected and calibrated in this IPM?

The NTC is internally connected between the T/SD/OD pin and GND. Its resistance varies from ~12 kΩ at 25 °C to ~1.5 kΩ at 125 °C, forming a voltage divider with an external pull-up resistor (1 kΩ for 3.3 V MCUs, 2.2 kΩ for 5 V). The resulting V_SD drops from ~4.5 V to ~2.2 V across that range, enabling linear temperature mapping via ADC.

Can the op-amp be used for voltage sensing instead of current sensing?

Yes - the op-amp's rail-to-rail input/output, 14.7 V high-level output, and 70–85 dB large-signal gain support direct DC bus voltage monitoring or auxiliary supply regulation. Its 6 mV offset introduces <0.1% error at 6 V full scale, making it suitable for precision voltage feedback in closed-loop DC link control.

What happens during simultaneous HIN and LIN activation on the same phase?

The internal interlocking logic forces both high-side and low-side outputs into tri-state (high-impedance) mode within 125 ns of SD assertion, preventing shoot-through. This hardware-level protection overrides all input states and remains active until both inputs return to valid logic levels (HIN=0, LIN=0) for ≥1.5 µs - ensuring robust fault containment.