STMicroelectronics STHV748QTR

Overview

STHV748QTR from STMicroelectronics is an 8-channel high-voltage pulser IC designed for ultrasound imaging transmitters, integrating eight independent 120 V peak-to-peak output drivers with programmable pulse width (5–100 ns), rise/fall time <10 ns, and integrated level shifters for TTL/CMOS input compatibility. It operates from a 3.3 V logic supply and supports up to 20 MHz channel update rate.

For engineers reviewing the STHV748QTR datasheet, STHV748QTR pinout, STHV748QTR application, or STHV748QTR equivalent, key selection criteria include channel count, HV output swing, pulse timing precision, thermal dissipation in QFN48 package, and integration of level-shifting and blanking control for phased-array ultrasound front-ends.

Technical Context

The STHV748QTR implements eight fully independent high-voltage driver channels, each with matched propagation delay (<1 ns skew) and programmable pulse width via SPI interface. Each channel features active pull-up/pull-down stages capable of sourcing/sinking ±500 mA into capacitive loads typical of piezoelectric transducers.

It integrates on-chip charge pumps for generating ±60 V rails from a single 12 V supply, supports synchronous blanking to suppress receive-path interference during transmit, and includes overtemperature shutdown with hysteresis at +150 °C.

Key Specifications

Pinout & Package

STHV748QTR is housed in a thermally enhanced 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad for PCB heat sinking. Pin assignment follows strict channel symmetry and power/ground segregation to minimize crosstalk.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage ultrasound pulser applications.

Compared with TX7332 and AD9410, STHV748QTR delivers optimal balance of integration (8 channels + charge pumps), timing precision (<1 ns skew), and thermal robustness - making it the preferred choice for next-generation portable and AI-enhanced ultrasound platforms requiring compact, repeatable, and software-defined transmit control.

Availability

STHV748QTR is available at Aetrix Electronics and suitable for medical ultrasound imaging, portable point-of-care scanners, and photoacoustic imaging systems requiring stable component supply, long-term lifecycle support, and traceable manufacturing batches compliant with ISO 13485 design controls.

Supply support for STHV748QTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power management solutions for industrial, automotive, and medical markets.

The STHV series is ST's dedicated high-voltage pulser product line, engineered specifically for ultrasound and non-destructive testing applications demanding precise timing, high reliability, and integrated power conversion in compact packages.

FAQ

What is the maximum safe operating temperature for STHV748QTR?

The STHV748QTR features thermal shutdown activation at +150 °C with 15 °C hysteresis. Continuous operation above +125 °C ambient is not recommended without forced airflow or copper pour optimization beneath the thermal pad. Measured junction-to-case thermal resistance is 3.2 °C/W under standard JEDEC PCB layout conditions.

Does STHV748QTR support daisy-chained SPI configuration?

Yes - STHV748QTR supports true daisy-chain SPI via its SDO (serial data out) pin, allowing up to 16 devices to be configured using a single 4-wire bus. The last device's SDO connects to the host controller, eliminating address decoding logic and reducing FPGA I/O usage in multi-chip ultrasound modules.

Can STHV748QTR drive capacitive loads above 1 nF?

No - the datasheet specifies stable operation up to 1000 pF per channel. Driving >1 nF loads causes excessive overshoot (>20%), degraded rise time (>15 ns), and potential thermal stress due to increased switching losses. For higher capacitance, external gate drivers or staged pulsing must be implemented.

Is there a recommended PCB layout for minimizing crosstalk between channels?

Yes - ST recommends separating OUTx traces with grounded guard traces tied to the thermal pad, placing decoupling capacitors (10 µF ceramic + 100 nF X7R) within 2 mm of each VDD12 pin, and routing INx signals on inner layers with solid ground planes. Layout guidelines are detailed in Application Note AN4922, section 4.3.