STMicroelectronics STIPN1M50-H

Overview

STIPN1M50-H from STMicroelectronics is a SLLIMM-nano intelligent power module (IPM) integrating six 500 V, 1 A MOSFETs and three half-bridge HVIC gate drivers in an NDIP-26L package. It delivers a complete 3-phase inverter bridge with embedded op-amp, comparator-based fault protection, bootstrap diodes, interlocking logic, and ±2 kV HBM ESD rating - designed for compact, low-EMI motor drives in space-constrained appliances.

For engineers reviewing the STIPN1M50-H datasheet, STIPN1M50-H pinout, STIPN1M50-H application, or STIPN1M50-H equivalent, this IPM supports direct MCU interface without optocouplers, offers programmable current sensing via CIN/OP+–OP–/OPOUT, enables fast shutdown propagation (≤250 ns), and provides validated thermal resistance (R_th(j-c) = 11.5 °C/W per MOSFET) for reliable thermal design in fan and pump inverters.

Technical Context

This IPM implements a fully integrated 3-phase inverter architecture with independent U/V/W half-bridge gate drivers, each featuring built-in bootstrap diodes, undervoltage lockout (V_{BS_thOFF} = 9.8–10.6 V), and interlocking logic to prevent shoot-through. The control section includes a rail-to-rail op-amp (GBWP = 8–12 MHz, SR = 2.5–3.8 V/µs) and a comparator with internal 0.54 V reference for overcurrent detection.

Switching behavior is optimized for low EMI: typical turn-on/off times are 226 ns / 248 ns at 300 V, 0.5 A, with dV_OUT/dt limited to 50 V/ns. The module supports 3.3 V/5 V/15 V CMOS/TTL logic inputs with 375 kΩ internal pull-downs and 180 ns dead time, enabling robust PWM control in noisy appliance environments.

Key Specifications

Pinout & Package

STIPN1M50-H uses the NDIP-26L type C package: 26-pin, dual-in-line, thermally enhanced molded module with isolated baseplate and 1.8 mm pin pitch. Dimensions: 29.2 mm × 12.5 mm × 4.4 mm (L × W × A), with 16.4 mm eB1 and 21.5 mm eB2 mounting centers. Pin 1 marked by notch; pin 16 is dummy, internally connected to P.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase inverter IPM applications.

Compared with FSB50450, STIPN1M50-H reduces component count and layout complexity via integrated op-amp and comparator, while STIPN2M50-H offers seamless scalability within the same footprint and control interface - both alternatives retain identical NDIP-26L mechanical compatibility and thermal mounting requirements.

Availability

STIPN1M50-H is available at Aetrix Electronics and suitable for appliance motor drives, HVAC fan controllers, and compact pump inverters requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for STIPN1M50-H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade components since 1987.

STIPN1M50-H belongs to the SLLIMM-nano IPM product line, engineered specifically for cost-sensitive, space-constrained 3-phase motor drives in white goods and building automation - emphasizing integration, thermal efficiency, and ease of MCU interfacing.

FAQ

What is the maximum recommended PWM frequency for STIPN1M50-H?

The datasheet specifies 25 kHz as the recommended maximum PWM frequency under normal operating conditions (T_C < 100 °C). This limit balances switching loss, thermal performance, and EMI compliance. At 25 kHz, the module achieves optimal efficiency and audible noise suppression for fan and pump applications, with measured dV_OUT/dt held to 50 V/ns to minimize radiated emissions.

How does the internal comparator trigger shutdown?

The comparator compares voltage at CIN against its internal 0.54 V reference. When CIN exceeds this threshold - typically from a shunt resistor voltage drop indicating overcurrent - it triggers immediate disable of the U-phase outputs. V/W-phase shutdown follows via the SD/OD pin with propagation delay dependent on external R_SD/C_SD values, as detailed in Application Note AN4966.

Can STIPN1M50-H operate with a 3.3 V MCU interface?

Yes. The HIN/LIN inputs accept 3.3 V logic levels (V_IH = 2.25 V min), and internal 375 kΩ pull-down resistors ensure defined states during reset or MCU boot. No level-shifting is required, enabling direct connection to 3.3 V microcontrollers such as STM32G0 or ESP32, with verified timing margins for 180 ns dead time enforcement.

What thermal interface material is recommended for the NDIP-26L baseplate?

A 0.1–0.2 mm thick thermally conductive silicone pad (e.g., Laird Tflex 300 series, 3–5 W/m·K) is recommended between the NDIP-26L baseplate and aluminum heatsink. This ensures uniform pressure distribution and avoids mechanical stress on solder joints, while maintaining R_th(j-c) near the specified 11.5 °C/W per MOSFET under 1 A continuous load at T_C = 100 °C.